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UK
Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.
Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
View vendor pageGermany
Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.
ASIC Design, Test and Characterization, Methodological support for IC designers, fabs, and IP vendors, Laboratory Equipment
View vendor pageFrance
SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
View vendor pageBelgium
Sofics is an IP provider improving reliability of ICs through innovative designs. Sofics offers 3 products: TakeCharge®, PowerQubic® and CustomIO®.
Low Voltage ESD/EOS protection (up to 5V), HV/BCD EOS/ESD protection (5V and higher), LIN PHY (transceiver) , Programmable Clipping Circuit for Antenna pins, Power-on-Reset Circuit, Radiation Hard, ESD robust Level Shifters
View vendor pageFrance
Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.
RFID analog front-end
View vendor pageUSA, India
SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.
Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services
View vendor pageUSA
On Semiconductor Custom Foundry Services group offers a comprehensive portfolio of high performance mixed signal and high voltage (BCD and Bipolar) processes to external designers and fabless companies.
Foundry Services, Custom Foundry Services, Full Turnkey, In House Assembly and Test Development, In-house Qualification and Failure Analysis Services, In House SiP: System in Package, Foundry Process Longevity
View vendor pageSwitzerland
Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
View vendor pageUSA
Founded in 2003, Aragio Solutions is a full-service provider of semiconductor intellectual property (IP) for integrated circuit (IC) design.
General-Purpose I/O (GPIO), ESD Protection , High-speed I/O, Memory Interfaces, Special
View vendor pageUSA
IC Failure Analysis Lab is a full-service provider of Failure Analysis and Qualification services to Semiconductors, Medicals, Telecommunications, and Automotive companies.
Failure Analysis, Reliability and Qualification Testing
View vendor pageUSA
EAG's Microelectronics Test and Engineering team provides semiconductor and electronics design firms with test, debug, and early engineering support for new product introduction.
ATE Test and Engineering, Burn-In & Reliability Qualification Services, ESD Testing & Latch-Up Testing Services, PCB Design & Assembly Services, FIB Circuit Edit and Debug Services, Failure Analysis Services
View vendor pageThe Netherlands
Eurofins MASER is an independent engineering service company. Since 1993 we have offered Reliability Test and Failure Analysis Services to the semiconductor and electronic systems industry.
Reliability Test, Failure Analysis
View vendor pageAs the ASIC design is moving towards maskset creation and tapeout, the cost of design changes are increasing exponentially. It’s easier and cheaper to modify the ASIC design and even redo some of the chip architecture early the design stage. However it’s much more difficult and far more expensive after ...
Many IC designers pay little attention to ASIC qualification and consequently pay high price and delays before the chip reaches to high volume. The mindset of experienced IC designers is considering IC quality (and reliability) through all phases of the IC design process. Today, more than ever, re-tapeout is costly ...
The semiconductor IP core market has grown dramatically in the last 10 years. There are literally hundreds of IP core suppliers in the market providing almost every possible functionally - from DC/DC and PLLs to Bluetooth and CPU cores. This large number of vendors and IP cores makes the selection ...
An often-overlooked part of chip design is Verification according to Sondrel as designing the front end of a chip is generally perceived as being the more interesting part. However, as Susan Mack, a Senior Engineering Manager at Sondrel, disagrees: “Verification is a very important part of the chip design process ...
What is RF-SOI? RF-SOI is name of a specialized semiconductor process utilized to create certain RF Integrated Circuits for applications like antenna tuners for cellphones and switching devices. Essentially, it is RF version of the SOI technology. Historical Development and Evolution of RF-SOI Technology Peregrine Semiconductor initiated the SOI process technology in 1990s ...
FDSOI stands for Fully Depleted Silicon on Insulator. FDSOI is a planar process technology that provides an alternative solution to overcome some of the limitations of bulk CMOS technology at reduced silicon geometries and smaller nodes. The FDSOI process has two distinct features. First starting with the substrate, an ultra-thin buried ...
Simply defined, Latch-Up in VLSI is a functional chip failure associated with excessive current going through the chip, caused by weak circuit design. In some cases Latch-Up can be a temporary condition that can be resolved by power cycle, but unfortunately it can also cause a fatal chip failure. What is ...
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