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Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
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ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Fast Turn IC Assembly & Packaging, Hi-Rel IC Assembly & Packaging, Flip Chip Assembly, Wire Bonding & Ribbon Bonding, Package Design Services
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IC Qualifications for ESD, Burn-in product, process, Reliability Qualification capability and capacity, Device Package Qualification Services including Preconditioning, Engineering and Hardware capabilities, IC Package Failure Analysis
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ATE Test and Engineering, Burn-In & Reliability Qualification Services, ESD Testing & Latch-Up Testing Services, PCB Design & Assembly Services, FIB Circuit Edit and Debug Services, Failure Analysis Services
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