Blog

Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales

April 09, 2018, anysilicon

codasip

Codasip, the leading supplier of RISC-V® embedded processor intellectual property, today announced that Jerry Ardizzone has joined as Vice President of Worldwide Sales, reporting to CEO Karel Masařík.
 
“We are very excited to have Jerry on board to lead our global sales efforts,” declared Karel Masařík, CEO and founder

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CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators

April 09, 2018, anysilicon

compression

Semiconductor intellectual property provider CAST, Inc. has taken advantage of a new cloud-based FPGA accelerator marketplace developed by Accelize®to make industry-leading GZIP data compression available to users and developers whenever they need it.
 
The new AccelStore™makes critical functions like GZIP directly available to end users on a rental by

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CEO Talk: Stefano Perticaroli, RAME

April 06, 2018, anysilicon

CEO_Stefano_Perticaroli_AnySilicon

This interview was help with Stefano Perticaroli, Ph.D. Eng., CEO at Radio Analog Micro Electronics srl.
 

 
Tell me a bit about your background? How did you first get started with Radio Analog Micro Electronics?
 
I completed my Ph.D in Electronics Engineering at DIET Sapienza Università di Roma

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Fan-out packaging confirms its success story. What is the next step?

April 03, 2018, anysilicon

fan-out

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole).
 
Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next

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MEMS packaging & testing: the next opportunity for OSATs?

April 03, 2018, anysilicon

mems1

More than half of MEMS[1] packaging today is done by OSATs[2] and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for RF[3] applications, is making the MEMS business more and more attractive for OSATs, which have started

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MEMS packaging market is growing faster than the devices market itself

April 03, 2018, anysilicon

mems1

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%

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