BURLINGTON, VT–Green Mountain Semiconductor Inc. (GMS), a custom circuit design provider, is proud to announce its recent achievement of a Phase I Small Business Innovation Research (SBIR) contract. This significant milestone underscores GMS’ commitment to pushing the boundaries of technology in support of space applications. The contract was granted under
Read MoreChiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or “chiplets.” These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex
Read MoreReading, UK – 17 October 2023. Sondrel (AIM: SND), is pleased to announce that it is one of the founding members of Arm® Total Design, an ecosystem that is committed to bringing Arm Neoverse™ CSS-based designs to market. Arm Neoverse CSS features high-end Arm Neoverse cores that are designed for
Read MoreFlip chip , also known as “controlled-collapse chip connection” (C4), is an advanced semiconductor packaging technique that allows the direct attachment of a semiconductor chip, typically an integrated circuit (IC), to a substrate or circuit board. Unlike traditional packaging methods like wire bonding, in flip chip technology, the active side
Read MoreLAWRENCEVILLE, GA – October 16, 2023 — Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), has been recognized by TSMC as the recipient of the 2023 OIP Partner of the Year Award for Analog/Mixed Signal IP. The OIP Partner of the Year award honors TSMC Open Innovation
Read MoreIn the world of computers, we’re used to thinking in terms of simple “on” and “off” signals, like flipping a light switch. But imagine if your computer could do much more than that—like being in two states at once! This is where quantum silicon chips come into play.
Read More