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MEMS packaging market is growing faster than the devices market itself

April 03, 2018, anysilicon

mems1

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%

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On-chip ESD protection for 40nm and 28nm CMOS technology

April 03, 2018, anysilicon

esd

Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
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Imec and Cadence Tape Out Industry’s First 3nm Test Chip

April 03, 2018, anysilicon

Silicone wafers in a carrier

The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using

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Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Santa Clara 2018

April 02, 2018, anysilicon

latest-news

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at Design & Reuse IPSoC 2018 on 5th April in Santa Clara, California. Sankalp Semiconductor’s booth will be displaying expertise related to the digital, analog and mixed signal, custom layout, standard

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IP-Maker to launch new NVMe host IP Family

April 02, 2018, anysilicon

press release

IP-Maker is introducing a new product line of NVMe Host IPs. In addition to the Easy NVMe Host IP, targeting embedded applications and launched in 2017, today IP-Maker announces the availability of two new products targeting data center applications: the Advanced NVMe Host IP, and the Multi Root NVMe Host

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Managing IC Qualification – A Quick Guide

March 31, 2018, anysilicon

Kid with jet pack riding bike. Child playing at home. Success, leader and winner concept

Many IC designers pay little attention to IC qualification and consequently pay high price and delays before the chip reaches to high volume. The mindset of experienced IC designers is considering IC quality (and production test) through all phases of the IC design process. Today, more than ever, re-tapeout is

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