Blog

How to Cut Costs, Time and Pain during ASIC Manufacturing

June 25, 2018, anysilicon

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Managing an end-to-end ASIC supply chain process is one of the biggest challenges of chip projects. The semiconductor value chain, which has always been complex, does not seem to get any simpler. A McKinsey report pointed out “there has been a 50 percent increase in test and verification time during

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Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications

June 25, 2018, anysilicon

news

Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions today at 55th DAC 2018 announced release of its Embedded DisplayPort (eDP) receiver IP. DisplayPort offers high bandwidth, lower pin count and low power solutions for high-resolution displays. The Chip on Glass (COG) technology enables area

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CEO Talk: Udi Shaked, Inomize

June 23, 2018, anysilicon

inomize

This interview with conducted with Udi Shaked, CEO of Inomize.
 
Full Name: Udi Shaked
Title: CEO
Company: Inomize

 
 
Tell me a bit about your background. How did you first get started with Inomize? 
 
We came up with the idea of launching Inomize back in 2007,

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eWLB

June 21, 2018, anysilicon

wafer bumping feature

The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
 
The first eWLB package was used in mobile phones in 2009 and since

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T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018

June 20, 2018, anysilicon

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T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
 
Mobile World Congress Shanghai is the

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Black Pepper Spices up the Arm Approved Design Partner Program

June 19, 2018, anysilicon

ARM_design partner

ne of the key features of the Arm ecosystem is its open and collaborative nature, and that’s no more evident than in its bank of Approved Design Partners. They bring an additional layer of design expertise and capabilities to SoCs from Arm silicon partners, enabling them with more opportunities to

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