Blog

Fabless Silicon Manufacture: Supplier Relationships Matter

January 09, 2017, anysilicon

parternship

When someone contributes to the success of your product, but they don’t work directly for your company, why should they work as hard as your employees ? Your employees, and to a smaller extent your suppliers, obviously have a financial interest in your company’s success. But success takes more than

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Faraday Readies MCU ASIC Migration Path with 55nm eFlash

December 22, 2016, anysilicon

news

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance. By skipping 90nm, Faraday’s MCU ASIC path strides directly from 8-inch 0.11μm to 12-inch 55nm eFlash process node, offering much lower power/leakage and

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AnSem expands operations in Enschede, The Netherlands

December 22, 2016, anysilicon

enschede

Leuven, December 20th 2016 – AnSem NV, the leading analog, RF and mixed-signal ASIC solutions company expands its operations, opening an office in Enschede, The Netherlands.
 
The Dutch design center will be headed by Clemens Mensink, who has over 20 years of IC experience. AnSem BV will be located

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HDL Design House Selected as ARM Approved Design Partner

December 20, 2016, anysilicon

arm

Belgrade, Serbia – December 20th, 2016 – HDL Design House, a provider of high-performance digital and analog IP cores and system-on-chip (SoC) design and verification services, has joined the ARM® Approved Design Partner program, through which leading SoC design houses are recognized by ARM as accredited partners in specific technologies

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300mm Silicon Wafers Market Overview

December 19, 2016, anysilicon

wafers

Prior to 2008, the 200mm silicon wafer was used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm silicon wafers.  Rankings of silicon manufacturers by installed capacity for each of the wafer sizes are shown

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Embedded die: from Incubation to High Volume Production

December 16, 2016, anysilicon

growth

Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC[1] package substrate came from DC/DC[2] converters in smartphones, penetration in other market segments of interest to embedded

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