Blog

Beckermus Adds a New Active Alignment Machine: ficonTEC CL1500

August 28, 2018, anysilicon

beckermus

Innovative medical devices, autonomous vehicles, IoT applications, cloud based organizations, 5G communication networks and more high-end industries are basing their products on microelectronics and micro-optical components.
Constant reduction in chip size and uncompromising placement accuracy demands are some of the dominant challenges those industries are facing.
We, in Beckermus Technologies,

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Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications

August 28, 2018, anysilicon

Silicone wafers in a carrier

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it is leveraging Samsung FinFET platforms to extend its ASIC design solutions in next-generation applications, such as artificial intelligence (AI), 5G/infrastructure networking, blockchain, cloud storage, high-performance computing (HPC), AR & VR, and high-end imaging. Read More

Top-15 Semiconductor Suppliers 2018

August 20, 2018, anysilicon

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IC Insights released its August Update to the 2018 McClean Report earlier this month.  This Update included a discussion of the top-25 semiconductor suppliers in 1H18 (the top-15 1H18 semiconductor suppliers are covered in this research bulletin) and Part 1 of an extensive analysis of the IC foundry market and its suppliers.
The top-15 worldwide semiconductor (IC and O-S-D—optoelectronic, sensor,

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IBM and Synopsys Accelerate 3nm Process Development with DTCO Innovations

August 16, 2018, anysilicon

The man with a carrier of the silicone wafers

Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with IBM to apply design technology co-optimization (DTCO) to the pathfinding of new semiconductor process technologies for the 3-nanometer (nm) process node and beyond. DTCO is a methodology for efficiently evaluating and down-selecting new transistor architectures, materials and other process technology innovations

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Size of Semiconductor Acquisitions May Have Hit Limit

August 15, 2018, anysilicon

The demise of Qualcomm’s pending $44 billion purchase of NXP Semiconductors in late July along with growing regulatory reviews of chip merger agreements, efforts by countries to protect domestic technology, and the escalation of global trade friction all suggest semiconductor acquisitions are hitting a ceiling in the size of doable

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Faraday Unveils the Industry’s Smallest USB 2.0 OTG PHY IP

August 15, 2018, anysilicon

iStock_000008646318XSmall

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of the industry’s smallest USB 2.0 OTG PHY on UMC 40nm. The silicon-proven solution is targeted at consumer applications, such as MFP, DSC, USB portable devices, IoT, wearables, and MCU’s.
 
Faraday, a

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