Blog

Avnet ASIC selected to become a Value Chain Aggregator (“VCA”) by TSMC, Strengthening the Offering for ASIC Customers

press release

February 20, 2024: Avnet ASIC Israel Ltd, (AAI) a leading provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica, an Avnet company (NASDAQ: AVT), has been appointed as a Value Chain Aggregator (VCA) by TSMC, the world’s leading silicon foundry. The appointment positions Avnet

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RISC-V Processors Addressing Edge AI Devices to Reach 129 Million Shipments by 2030

market

LONDON, Feb. 14, 2024 — Reduced Instruction Set Computing (RISC)-V processor architectures are starting to address edge Artificial Intelligence (AI) workloads, and this trend is set to continue throughout the decade. According to a new report from global technology intelligence firm ABI Research, while RISC-V’s penetration into AI workloads is only just beginning,

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Introduction to eDRAM

eDRAM Overview
 
A key factor in improving memory operations in System on Chips (SoC) is the use of embedded dynamic random-access memory (eDRAM), which means that the DRAM memory is inside the chip. This helps with enhancing the effectiveness and functionality of electronic products by reducing power consumption and

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Trilinear Technologies Accelerates Innovation in Automotive Display Connectivity with DisplayPort Automotive Extensions Standard (DP AE)

press release

Portland OR – February 6, 2024 — Trilinear Technologies, a leading provider of cutting-edge technologies for display connectivity and semiconductor solutions, is proud to announce its strategic collaboration with key industry partners to support the integration of VESA’s DisplayPort Automotive Extensions (DP AE) into automotive systems. This initiative reflects Trilinear’s commitment

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First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

news

iNPACK (a PCB Technologies Ltd. Company) and cutting-edge IC packaging and assembly house in Israel, in conjunction with ATS Engineering, a leading IC Test House based in Israel, have announced a transformative collaboration in order to establish the first Outsourced Semiconductor Assembly and Test (OSAT) facility in the Middle East. This pioneering venture aims to

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CEO Talk: Michael Dube, EVP at Rochester Electronics

This interview was held with Michael Dube, Executive Vice President of Manufacturing Operations and Engineering of Rochester Electronics.
 

 
Tell me a bit about your background? How did you first get started with Rochester Electronics?
 
Sure, let me share a bit about my journey. I kicked off my

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