Blog

Silab Tech Announces Release of XGS-PON SERDES IP Core

June 13, 2017, anysilicon

serdes silab tech

Silab Tech, a leading supplier of high speed serial interface intellectual property designs (IP cores) announced today the release of its XGS-PON PHY. This IP Core provides symmetrical 10Gbps interconnect solution for Next Generation Passive Optical Networks (PON). The IP Core is silicon proven on 40nm node and was integrated

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Open-Silicon Unveils Industry’s Highest Performance Interlaken Chip-to-Chip Interface IP

June 12, 2017, anysilicon

open-silicon

Open-Silicon, a system-optimized ASIC solution provider and founding member company of the Interlaken Alliance, today announced its eighth-generation Interlaken IP core, supporting up to 1.2 Tbps high-bandwidth performance and up to 56 Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is

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Faraday Announces the World’s First Automotive ASIC Qualified for AEC-Q100 and AEC-Q006

June 12, 2017, anysilicon

car

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced today that it has completed the first-ever automotive ASIC device qualified for AEC-Q100 and AEC-Q006 as defined by the Automotive Electronics Council (AEC). This milestone achievement demonstrates Faraday’s readiness to participate in this quality-driven marketplace bringing

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ELSYS Eastern Europe Selected As ARM Approved Design Partner

June 07, 2017, anysilicon

ARM_design partner

ELSYS Eastern Europe, the subsidiary of ELSYS Design, has joined the ARM® Approved Design Partner Program. Design partners selected for the program help enable ARM silicon partners with design support and training services to successfully deliver ARM-based SoCs optimized for targeted market opportunities.
 
To receive ARM Approved Design Partner

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Optimized ASICs for Medical Applications

June 07, 2017, anysilicon

medical

A few years ago Derek Hunt offered some insight into the benefits of CMOS semiconductor technology in the miniaturization of medical devices. CMOS has been around for decades and aside from the size benefits which will be discussed shortly, the technology also brings significant cost savings and performance improvements to

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Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology

June 05, 2017, anysilicon

makechip

Racyics GmbH announced today it has launched makeChip, an innovative design service platform, developed using GLOBALFOUNDRIES’ 22FDX® process technology and supported by Cadence. Available to start-ups, design experts, research institutes, and universities, makeChip is a central gateway to design integrated circuits based on advanced semiconductor technologies.
 
The platform provides

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