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HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

LAS VEGAS—January 8, 2024—Today, HaiLa Technologies Inc., a fabless semiconductor and software company focusing on hyper power-efficient wireless communications system-on-chip solutions for IoT devices, announces availability of the BSC2000 RF Evaluation Chip Development and Demonstration Kits. Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design, engineering, and

VeriSilicon unveils the new VC9800 IP for next generation data centers

Delivering exceptional throughput, AI-powered encoding, and superb image enhancement for data centers
 
Las Vegas, USA — January 8, 2024 — VeriSilicon (688521.SH) today unveiled its latest VC9800 series Video Processor Unit (VPU) IP with enhanced video processing performance to strengthen its presence in the data center applications. The newly launched

Cadence Acquires Invecas to Accelerate System Realization

Transaction brings Cadence skilled system design expertise in delivering end-to-end custom solutions to customers across multiple industries
 
SAN JOSE, Calif.– January 08, 2024 — Cadence Design Systems, Inc. (Nasdaq: CDNS) announced today that it has acquired Invecas, Inc., a leading provider of design engineering, embedded software and system-level solutions, headquartered

The Ultimate Guide eFPGA

Introduction to Embedded FPGAs
 

 
The embedded field-programmable gate array (eFPGA) technology has undergone significant evolution in recent years. eFPGAs serve as a programmable fabric in addition to conventional fixed-function components when they are directly integrated into application-specific integrated circuits (ASICs) or system-on-chips (SoCs). There are various benefits

GLOBAL SEMICONDUCTOR CAPACITY PROJECTED TO REACH RECORD HIGH 30 MILLION WAFERS PER MONTH IN 2024, SEMI REPORTS

MILPITAS, Calif. — January 2, 2024 — Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.
 

 
The 2024

SkyWater Submits Application for US CHIPS and Science Act Funding to Modernize Equipment and Enhance Production at its Minnesota Facility

BLOOMINGTON, Minn. – January 2, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced it has submitted a full application to the CHIPS Program Office of the U.S. Department of Commerce for funding through the CHIPS and Science Act. The application is for modernization and equipment upgrades to