Category Archives: ASIC Industry Market Trends

ASIC design for the IoT

February 09, 2015, anysilicon

SystemOnChip

As everybody is trying to figure out what the Internet of Things (IoT) will look like and how connected things will work, I’d like to address a question that many people have: why design your own Integrated Circuit (IC) rather than just use an off-the-shelf processor, write software and be done?
 
In a

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What’s wrong with RTL for ASIC designs?

January 14, 2015, anysilicon

packaging

I think this is an appropriate first post, because this is a question that we’ve heard many times when talking with hardware engineers trying to sell our product. The fact that there are (now) about a dozen companies trying to replace RTL with alternatives (I’ll talk about HLS in other

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If Your Chip Is Not an SoC, It Soon Will Be

December 18, 2014, anysilicon

SystemOnChip

Last week’s post was addressed primarily to those of you who are already designing SoCs. We made the point that more and more SoCs have multiple processors, either homogenous or heterogeneous, and that most or all of those processors do or will have caches. This led to the main conclusions of the

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Moore’s Law Will Not Come To An End Anytime Soon

December 16, 2014, anysilicon

growth

Gordon Moore said‚ on the 40th anniversary of his law that “Moore’s law is really about economics.” What did he really mean by that? In 1965 when Gordon Moore put forth Moore’s law based on his observation, those years were Golden years of Free Market Capitalism in America. The entire decade

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The IP Blame Game

December 10, 2014, anysilicon

IP-quality300x200

This is a guest post by Methodics that delivers state-of-the-art semiconductor data management (DM)  for analog, digital and SoC  design  teams.

The topic of IP quality in the SoC era is difficult to define, and solutions to problems relating to IP quality, verification, and use are hard to find. Debates rage between IP users, suppliers,

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TSV Integration is Creating Growth

November 19, 2014, anysilicon

Through-Silicon-Via-TSV-Technology

“The long term growth of the equipment & materials business will be supported by the expansion of 3D TSV stack platforms” says Yole (Yole Développement) in its latest report, “Equipment & Materials for 3DIC & WLP Applications“. The market research and strategy consulting company, Yole proposes a deep analysis of the equipment &

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