Category Archives: Packaging

Amkor Technology to Acquire NANIUM

February 03, 2017, anysilicon

amkor nanium

TEMPE, Ariz. and VILA DO CONDE, Porto, Portugal, February 2, 2017 – Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction

Read More

Silicon Wafer Integrated Fan-out Technology Packaging for Highly Integrated Products

January 16, 2017, anysilicon

swift

The continued growth of the mobile handset, tablet, and networking markets requires ongoing development of innovative packaging technologies. The required solutions must provide reduced form factor and high thermal and electrical performance as well as increased functional convergence and system integration. To meet the extremely small interconnect feature sizes in

Read More

Embedded die: from Incubation to High Volume Production

December 16, 2016, anysilicon

growth

Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC[1] package substrate came from DC/DC[2] converters in smartphones, penetration in other market segments of interest to embedded

Read More

The Future of Fan-in Packaging

November 24, 2016, anysilicon

bumps

Fan-In packaging has been a successful and steadily growing platform for over a decade. However Fan-In packaging should face a challenging future, announces Yole Développement (Yole), the “More than Moore” market research and strategy consulting company. Indeed, despite of unchanged market drivers, Fan-In packaging is showing an uncertain future with

Read More

IC Packages Price Calculator

November 08, 2016, anysilicon

calculator

IC Package Price calculator is an online IC package price estimation tool that covers all the major IC package types exist today.
 
To use the IC package price tool simply select the IC package type, number of pins and volume and the tool will send you an email with

Read More

Qualcomm Opens Semiconductor Test Manufacturing Site in Shanghai

September 18, 2016, anysilicon

amkor

Qualcomm Incorporated (NASDAQ:QCOM) today announced the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first foray into providing manufacturing services for semiconductors. By working with Amkor Technology, Inc., one of the world’s leading providers of contract

Read More