Category Archives: Packaging

eWLB

June 21, 2018, anysilicon

wafer bumping feature

The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
 
The first eWLB package was used in mobile phones in 2009 and since

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Understanding Wafer Bumping Packaging Technology

June 09, 2018, anysilicon

wafer bumping feature

Consumer electronics markets, the mobile phone market in particular, are extremely demanding. They are driven by the desire to pack more and more functionality and enhanced value into the same size handheld device, and often at lower costs. This drive towards smaller, cheaper and thinner consumer electronics has driven the

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IMI global and Beckermus Cooperation

June 06, 2018, anysilicon

parternship

We are happy to announce that Beckermus and IMI has signed a strategic cooperation agreement. The cooperation goals are focused on enhancing each party advantages and facilities to support clients’ needs.
 
In a nutshell, Beckermus will supply Integrated Micro-Electronics Inc. (IMI) with prototype assembly services for microelectronics, micro-optics, photonics and electro-optics and

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Amkor Factories Receive Key Automotive Certification

April 16, 2018, anysilicon

car

Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that multiple factories have passed certification audits for IATF-16949:2016, a key certification required for manufacturers who supply products to the automotive market. IATF-16949:2016 replaces and supersedes the older ISO/TS-16949 standard.


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Fan-out packaging confirms its success story. What is the next step?

April 03, 2018, anysilicon

fan-out

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole).
 
Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next

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MEMS packaging & testing: the next opportunity for OSATs?

April 03, 2018, anysilicon

mems1

More than half of MEMS[1] packaging today is done by OSATs[2] and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for RF[3] applications, is making the MEMS business more and more attractive for OSATs, which have started

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