Category Archives: Packaging

Amkor Factories Receive Key Automotive Certification

April 16, 2018, anysilicon

car

Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that multiple factories have passed certification audits for IATF-16949:2016, a key certification required for manufacturers who supply products to the automotive market. IATF-16949:2016 replaces and supersedes the older ISO/TS-16949 standard.


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Fan-out packaging confirms its success story. What is the next step?

April 03, 2018, anysilicon

fan-out

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole).
 
Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next

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MEMS packaging & testing: the next opportunity for OSATs?

April 03, 2018, anysilicon

mems1

More than half of MEMS[1] packaging today is done by OSATs[2] and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for RF[3] applications, is making the MEMS business more and more attractive for OSATs, which have started

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MEMS packaging market is growing faster than the devices market itself

April 03, 2018, anysilicon

mems1

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%

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OSAT Companies Ranking 2016-2017

February 15, 2018, anysilicon

Many old CPU chips and obsolete computer processors as background

Despite the common belief, OSAT (Outsourced Semiconductor Assembly and Test) companies are very innovative. Many look at TSMC or Synopsys and consider their R&D work as innovative. But actually, semiconductor assembly industry is as innovative as any other company in the industry. We just don’t hear about it.
 
Semiconductor

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ASE and Cadence Deliver First System-in-Package EDA Solution Tailored for ASE’s High-Performance, Advanced IC Package Technologies

February 03, 2018, anysilicon

press release

Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311, NYSE: ASX), and Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. The solution consists of the SiP-id™ (System-in-Package – intelligent

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