Category Archives: Packaging

Amkor Technology to Acquire NANIUM

February 03, 2017, anysilicon

amkor nanium

TEMPE, Ariz. and VILA DO CONDE, Porto, Portugal, February 2, 2017 – Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction

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Silicon Wafer Integrated Fan-out Technology Packaging for Highly Integrated Products

January 16, 2017, anysilicon


The continued growth of the mobile handset, tablet, and networking markets requires ongoing development of innovative packaging technologies. The required solutions must provide reduced form factor and high thermal and electrical performance as well as increased functional convergence and system integration. To meet the extremely small interconnect feature sizes in

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Embedded die: from Incubation to High Volume Production

December 16, 2016, anysilicon


Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC[1] package substrate came from DC/DC[2] converters in smartphones, penetration in other market segments of interest to embedded

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The Future of Fan-in Packaging

November 24, 2016, anysilicon


Fan-In packaging has been a successful and steadily growing platform for over a decade. However Fan-In packaging should face a challenging future, announces Yole Développement (Yole), the “More than Moore” market research and strategy consulting company. Indeed, despite of unchanged market drivers, Fan-In packaging is showing an uncertain future with

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IC Packages Price Calculator

November 08, 2016, anysilicon


IC Package Price calculator is an online IC package price estimation tool that covers all the major IC package types exist today.
To use the IC package price tool simply select the IC package type, number of pins and volume and the tool will send you an email with

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Qualcomm Opens Semiconductor Test Manufacturing Site in Shanghai

September 18, 2016, anysilicon


Qualcomm Incorporated (NASDAQ:QCOM) today announced the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first foray into providing manufacturing services for semiconductors. By working with Amkor Technology, Inc., one of the world’s leading providers of contract

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