Category Archives: Packaging

CEO Talk: Oliver Maiwald, Sencio B.V

February 20, 2019, anysilicon

This interview was held with Mr. Oliver Maiwald, CEO of Sencio B.V.
Tell me a bit about your background? How did you first get started with Sencio?
I have had a fairly circuitous route to the role of CEO. My first step was as an electrical technician working on the

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Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

February 01, 2019, anysilicon

“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for

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An Introduction to BGA Package

January 15, 2019, anysilicon

With the levels of integration rising to unprecedented levels and the requirement of integrated circuits with a high number gate and pins increased day by day, there was a need to manufacture a package that would be convenient to use, would be will reliable and robust, would pose higher pin

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Amkor Offers Optical Package Solutions for Multiple Applications

December 13, 2018, anysilicon

Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including

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Beckermus Technologies Announces Partnership with Engage Photonics

December 09, 2018, anysilicon

Beckermus Technologies was founded in 1998 and serves as an Excellence Center in the field of “Bare Die” assembly services for micro-electronic and micro-optical systems. Beckermus Technologies has been playing a vital role in the lifecycle of many products, for numerous companies worldwide, from early prototypes to mass production.
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IC Packaging: consumer solutions are adapted for automotive applications

November 23, 2018, anysilicon

“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.
Under this dynamic context, the market research

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