May 31, 2016, anysilicon
GLOBALFOUNDRIES today announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the company plans to expand its global manufacturing footprint by establishing a 300mm fab in China. GLOBALFOUNDRIES is also investing in expanding design support capabilities to better serve customers across the country.
“China is the fastest growing semiconductor market, with more than half of the world’s semiconductor consumption and a growing ecosystem of fabless companies competing on a global scale,” said GLOBALFOUNDRIES CEO Sanjay Jha. “We are pleased to partner with the Chongqing leadership to expand our investment in support of our growing Chinese customer base.”
The initial plan of the project includes upgrading an existing semiconductor fab to accommodate the manufacturing of 300mm wafers using GLOBALFOUNDRIES’ production-proven technologies from its Singapore site. The proposed joint venture will provide immediate access to a state-of-the-art facility, accelerating time-to-market with production planned for 2017.
“In recent years, Chongqing has followed the cluster model to vigorously develop the electronic information industry, becoming one of China’s most important locations for intelligent end products manufacturing,” said Huang Qifan, Mayor of Chongqing. “During the period of China’s thirteenth five-year plan, Chongqing will continue to develop the intelligent IC and other strategic emerging industries, and promote sustained and healthy economic development in the region. GLOBALFOUNDRIES is a world-famous IC manufacturing company, and we welcome them to participate through cooperation to achieve mutual benefit and win-win. Cooperation between the two parties will help to enhance the production of intelligent IC technology in Chongqing, further improving the electronic information supply chain in Chongqing and the rest of China.”
GLOBALFOUNDRIES continues to strengthen its sales, support, and design services offerings in China, doubling over the past year with plans for continued growth. The company’s current presence is anchored by world-class design centers in Beijing and Shanghai, which have extensive expertise in custom designs supporting a robust ASIC platform, coupled with foundry design capabilities for a variety of technology nodes. These capabilities are complemented by key regional partners in its design and IP ecosystem.