IC Package Design

The richest directory of IC Package Design worldwide. Find the IC Package Design that matches your needs.

51 results found

PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

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PandA Europe

UK

PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.

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AST

Israel

ASIC, COT, Mixed Signal, IPs design services, turn-key and Bitcoin solutions for advanced technologies (180nm, 90nm, 65nm, 40nm, 28nm, 20nm and 16nm).

Services

ASIC Services, Mixed Signal Services, Spec-in / Turnkey Services

IP Cores

High Speed Serdes solutions, High end, high speed ADC/DAC, Low-Power, Cost-Effective 8- and 16-bit MCUs, Video, Image & Data Compression, MIPI, RF

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include +8M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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