IC Package Design

The richest directory of IC Package Design worldwide. Find the IC Package Design that matches your needs.

55 results found

Gold Technologies

USA

With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.

Services

Test Sockets, Pogo Pins, Custom Connectors

View vendor page

Cicor

Cicor is a globally active group of leading companies in the microelectronics industry. The group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, hybrids and electronic modules.

View vendor page

PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

View vendor page

Presto Engineering

USA

Presto Engineering, Inc. provides outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management

View vendor page

Trusted Semiconductor

USA

ASIC, FPGA, and custom IC development services including front and back-end design, IP development, package design, manufacturing, assembly, and test.

View vendor page