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Services
Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
IP Cores
12 bit SAR ADC, Digital temperature sensor
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Services
Advanced Logic - 40nm, 65/55nm, Mature Logic - 90nm, 0.13um/0.11um, Mature Technology 0.18μm, 0.35μm, Non-Volatile Memory, Analog/Power, Turnkey Services
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Services
Testing, Qualification & Reliability , Failure Analysis , mmWave Automotive / 5G Device Testing – Up to 81 GHz
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Services
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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Services
ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety
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Services
Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign
IP Cores
Analog IP Cores, Digital IP Cores
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Services
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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Services
ASIC design, ASIC verification, System validation and industrialization , Full turnkey
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Services
A to Z ASIC design services, Custom and Standard IP development
IP Cores
HDMI2.1/DisplayPort1.4/eDP1.4 TX Combo-PHY, HDMI2.1/DisplayPort1.4/eDP1.4 RX Combo-PHY, USB4.0/DisplayPort2.0 Combo-PHY
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Services
Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform
IP Cores
0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)
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Services
Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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IP Cores
GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
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Services
ASIC Design, ASIC Production Testing, Measurement Systems
IP Cores
GaN Gate Driver, SiC Gate Driver
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Services
Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services
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Services
Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation
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Services
ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support
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Services
Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
IP Cores
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
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Services
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
IP Cores
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Services
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Services
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Services
SoC Verification, IP Level Verification, FPGA Prototyping, ASIC Implementation
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Services
Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
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Services
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Services
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Services
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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Services
Custom Analog Mixed-Signal ASIC Solutions, ASIC, SoC, FPGA Design Services, Design Verification, Silicon Validation, IC Design Services, DFT Services
IP Cores
Microcontrollers and IDE solution, Custom Memory IP and I/Os, DDR3/DDR2 Memory Controller, 3D Graphics Processor for Wearables/IoT, Gigabit Ethernet PHY Cores, Wired and Wireless Connectivity
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Services
Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Services
SystematIC- Custom ASIC Design, Turnkey (Supply chain Services), Sensor Interfacing, Integrated Power, High Voltage Expertise
IP Cores
Analog IP
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Services
ASIC design and supply chain management, ASIC design services
IP Cores
Video and Graphics, Digital IP, Analog IP
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Services
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Services
Design Services
IP Cores
Standard Cells Libraries, TCAM & CAM, SRAM & ROM, Custom PDK and PCELL, Register Files
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Services
Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
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Services
Smart Integrated Power, Wireless Communications, RF-Energy, Characterization and Testing, EDA, Consultancy and Training Services, Supply Chain Management, Certifications
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Services
SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
IP Cores
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Services
Analog Circuit Design, Digital & Mixed Signal Design, Verification, Concept to Silicon
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Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
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Services
Design Verification, Physical Design , Design for Test (DFT) , Analog Design , Turnkey Final Test and Wafer Sort Solutions , Embedded Services
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Services
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
IP Cores
Processor IP, Digital and Analog IP
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Services
Turnkey ASIC Design, IP Blocks Design, Radioelectronic Devices Development
IP Cores
RF Transceivers, PLL, ADC, Process, Voltage and Temperature Sensors (PVT sensor/detector/controller), RFID (UHF tag, ID card, NFC, medical implants), Energy harvesting (power converters from RF-field to voltage and current)
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Services
Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
IP Cores
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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Services
Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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Services
Logic Design (Front-End), ASIC Design RTL to GDS2, Analog & RF Design, Productization, Production, Additional Services
IP Cores
CPU & SoC, Security, General Purpose IP, Analog IP
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Services
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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Services
IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Services
RTL Design, Verification, Analog Layout, Physical Design, System Engineering, Embedded Software/Firmware
IP Cores
Custom SerDes, ARM HSSTP PHY with Link Layer, PCIe PHY, XAUI PHY, CEI SR PHY, SATA PHY
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Services
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
IP Cores
RFID analog front-end
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Services
Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Cores
IP Library
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Services
Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Services
IP Licensing, Mixed-Signal ASIC Design and Customization
IP Cores
HomePlug Green PHY Powerline Communication (HPGP PLC) for Electric Vehicle (EV) Charging System and Automotive, ZigBee Wireless at 2.4GHz, Sub-Gigahz RF Transceiver (programmable 400MHz – 1GHz)
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Services
Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
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Services
PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Services
Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation
IP Cores
Power Management, Data Converters, Clock Management, Sensors , Front Ends
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Services
ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
IP Cores
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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Services
Full turnkey, ASIC Definition, Custom IC and ASIC design, Prototype Manufacturing and Evaluation, ASIC Industrialization, Supply Chain Management
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Services
Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
IP Cores
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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Services
Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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Services
Circuit Design, Product Development, Memory products, IP and consulting, Test Consulting
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Services
Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
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Services
ASIC Design, ASIC Production, ASIC Production Management, Replacement of Obsolete Components
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Services
Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
IP Cores
Column ADC Patent, Extensive IP Library
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Services
IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access
IP Cores
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
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