CORWIL Technology

USA

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CORWIL Technology was founded in 1990 to provide high quality full turn-key IC assembly and test services to the semiconductor, OEMs, Mil-Aero and medical industries. Excellent quality and superior service have been the hallmarks of CORWIL’s success. CORWIL has emerged as the premier one-stop provider of its semiconductor test and assembly services, including wafer thinning and dicing, optical inspection, full assembly and testing of IC’s and complex modules as well as reliability testing.

 

CORWIL is a US based OSAT. Our Bay Area facility has the state of the art assembly and test capabilities along with CORWIL’s highly skilled and experienced engineering team. Operating a 48,500 square foot manufacturing facility, CORWIL boasts over 12,000 square feet of Class 10,000 clean room production capability, a Class 1,000 clean room as well as a class 100k test floor and 36 Class 100 laminar flow benches.

Services

Wafer Processing

CORWIL’s significant investment in back end wafer processing has enabled us with the largest capacity in North America for wafer thinning, dicing, inspection and die-sort. We are well positioned to support both high-mix/low volume prototyping as well as mid to high volume production requirements.

  • Wafer Thinning
  • Wafer Polishing
  • Wafer Dicing

– Dice Before Grind (DBG)
– Die Attach Film (DAF)

  • Die Sort

– High speed auto pick and plate tools

  • Inspection

– AOI (Automated Optical Inspection)
– Mil-Std-883, Class Q & V

IC Assembly

A wide variety of standard JEDEC and custom IC packages are assembled in our Class 10,000 and 1,000 clean room environments, including Open-Cavity (hermetic and non-hermetic), QFN/DFN, BGA/LGA, uBGA, CSP, Imaging Devices, COB, Med-Tech Devices and MCM with numerous die-attach, interconnect and seal options available.

  • Die attach
  • Wire bond (Aluminum and Gold)
  • Flip Chip
  • Encapsulation and transfer mold
  • Substrate solder ball attach
  • Device Singulation

SIP/MCM Modules:

Our multi-component assembly options include:

  • Stacked die
  • SMT components
  • Package-on-package
  • Combined Flip Chip
  • Wirebond structure

 

Test Services

CORWIL offers a wide range of test services, including environmental, mechanical and electrical. Our ATE portfolio spans analog, digital, mixed-signal and RF technologies complete with probers and handlers to support both wafer sort and package test. Our environmental screening lab is DLA certified to Mil-PRF-38535

  • Environmental Screening
  • Burn-in
  • Test Program and Hardware Development
  • Wafer Sort
  • Final Package Test

Volume Production

CORWIL is the highest volume subcontractor of wafer dicing, visual inspection, and die pick & place services in the US, producing tens of millions of die per month for its customers. For commercial markets, such as communications, imaging, PC, and consumer/industrial, CORWIL’s IC assembly and test production capabilities range from plastic packages such as QFN’s, to complex BGA’s and multi-chip-modules. Additionally, for the mil/aero markets, CORWIL assembles and tests IC’s in ceramic packages including full mil-spec process flows and environmental screening. CORWIL is certified QML (Qualified Manufacturers List) by the U.S. Government for mil-spec (Class B or Level Q) IC assembly and test. QML certification for space level (Class S or Level V) IC assembly and test is in process.

Quick Turn Production

Prototypes & Pre-Production

 

For quick-turn prototyping, CORWIL is unsurpassed in producing highly complex products such as Flip Chip or wirebonded BGA or chip-scale devices with thousands of bumps or wire bonds. For new product development, where time-to-market is of utmost importance, especially in highly competitive markets, CORWIL customers will request quick-turns as fast as 8 to 24 hours. This leads to faster introduction of customers’ products into the market resulting in greater market share and increased profitability for our customers. CORWIL is the sole source provider of prototyping services in Flip Chip and wire bonded BGA’s for many fabless companies as well as full IDMs (Integrated Device Manufacturers with wafer fabs) and OEM’s with application specific devices. CORWIL also is the designated provider for pre-production quantities, overflow production, and for end-of-quarter or end-of-year production surges for many customers.

 

Quick Turn Production

 

  • 4-8 hours to less than 5 days
  • Pre-arranged slots available
  • Small quantities to complex jobs in higher volumes

Engineering Services & Credentials

CORWIL engineers are experts in package design, materials selection, assembly process compatibility, high yield manufacturing, and issues affecting package integrity. Our engineering team is organized by process areas, such as wafer thinning and dicing, Flip Chip, wire-bond, die picking and inspection, QFN and other plastic package assembly, and electrical test. In all these areas, the engineering team is working on the latest technologies.

CORWIL holds the following Credentials/Certifications:

  • ISO 9001:2008 Certified
  • ISO 13485:2003 Certified
  • MIL-PRF-38535 & MIL-STD-883 (DLA Certified for Q & V)
  • ITAR Registered & Compliant
  • AS9100C