Nanoscope Services


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We are Focused Ion Beam (FIB) Technologists and Microscopy experts offer IC Nano-surgery, Failure Analysis, Reliability testing, Fabrication process qualifications and nano-fabrication for the Nanotech community.

Based around our advanced Microscopy and FIB expertise, NanoScope offer a suite of fast turn Failure Analysis services for our semiconductor clients.




Failure Analysis

Services offered:


  • External optical examination
  • Build a test socket board
  • Basic benchtop electrical testing
  • X-ray package analysis
  • CSAM package analysis
  • Decapsulation
  • Internal optical inspection
  • Anti-counterfeit check (partnered with ELTEK)
  • FIB/SEM internal inspection
  • FIB Sectioning and imaging (w/wo iterative slicing)
  • Process Metrology (inc. SI/SE imaging)
  • SEM EDS studies
  • FIBxTEM Sectioning
  • TEM imaging analysis (TEM/STEM) – BF/DF
  • TEM X-ray or EELS elemental analysis
  • Written report

Circuit Nano-edit

FIB circuit edit for when a 1st Silicon test has shown a mask change is required before volume production.


We can check the package structure, die attach and bonding (using non-destructive X-ray or CSAM inspection), cleanly decapsulate the device to expose the target area, perform your FIB circuit edit to cut and/or connect metal nodes, and then re-passivate the fix. If needed we can even reseal the device before re-testing.


Have fully working devices in a few hours or days, with our >95% 1st time success rate.


Sometimes design changes can be highly time critical, and we like to make sure that we can deliver your fixes when you need them. NanoScope is the only circuit edit provider to offer an urgent service, in addition to the standard ‘next in queue’ service traditionally available. If you need working silicon right now – we can add shifts to ensure your work can be dealt with right away (without affecting anyone in the queue). If you just can’t wait – ask about our ‘Urgent Turnaround’ and watch what happens next.

Reliability Testing

Low Cost Reliability Testing

NanoScope now offers 3, economical, turn-key reliability services for our Semiconductor clients.


MSL Evaluation

This identifies the classification level of non-hermetically sealed surface mounted solid state devices, which may be sensitive to moisture induced stress. A package’s MSL sets the parameters for subsequent device preconditioning. The basic test sequence is shown below and assumes that pre-and post electrical tests are conducted at the customer site. The test is performed to IPC/JEDEC Standard J-STD-020D.1

  • Initial Visual Inspection
  • 1st Acoustical Microscope (CSAM)
  • Initial Bake – 24 hrs @ 125°C
  • Moisture Soak – Temp/Humidity at required level
  • Reflow (IR bake) X3 @260°c
  • Final Visual Inspection
  • 2nd Acoustical Microscope (CSAM)
  • Optional written report

Device Pre-conditioning

This exposes a batch of devices to the upper limit of the MSL level specified prior to that batch undergoing reliability testing. Pre-conditioning may use all of the sequence shown above – but is often steps 3, 4, and 5 only. The accelerated equivalent tests are also available. Pre-conditioning is available for the full range of MSL’s, and is performed to JEDEC Standard JESD22-A113


High Temperature Storage

HTS is used to test for thermally activated failure mechanisms of solid state devices. Elevated temperatures (150 degrees) are applied for a longer fixed period of time (1000hrs) without electrically stressing the devices. Following HTS, electrical test measurements should be done within 96 hours. The test is performed to JESD22-A103 standard.

FIBxTEM Analysis

FIB Prepared ‘Ultra thin’ TEM sections.


This tried and tested process has been used routinely for many years and successfully applied by NanoScope to prepare customers samples from over 200 materials systems.


There are 4 clear advantages


  1. EXACT LOCATION and ORIENTATION – Have your ‘ultra thin’ section prepared from exactly where you would like. Specify the orientation of each section as well.
  2. MATERIALS INDEPENDENT – The FIB milling process is largely independent of materials hardness or structure. Complex materials combinations and devices are possible to prepare within a single section.
  3. ‘LARGE’ IMAGING AREA – A FIB prepared section tends to be of uniform imaging thickness and quality, allowing information to be collected across the majority of the section area.
  4. MINIMAL MECHANICAL PREPARATION. Most samples are immediately acceptable for FIB processing without embedding and slicing or cleaving and grinding. If it is clean and small enough, vacuum compatible and has a flat(ish) top surface it can probably be loaded immediately.


TEM Analysis of FIB prepared sections


A variety of TEM instruments may be used for your high end imaging and analysis requirements.


Select the analytical TEM techniques you require from this list of capabilities:


  1. Bright/Dark field imaging with referenced metrology as required.
  2. Diffraction patterns taken from your specified points.
  3. Elemental Analysis either as points, linescans or maps to identify which materials are present and their locations.


For more detailed information about TEM Analysis please contact us.