Sencio

The Netherlands

sencio

Founded on 1st of January 2011, located in Nijmegen in the Netherlands, Sencio has taken over the advanced assembly activities from Elmos Advanced Packaging. Sencio is a privately funded, independent company, able to support our customer’s functional packaging requirements. Our employees have many years of experience in development and volume manufacturing sensor components and sensors systems among others for the automotive industry. More than 400 Million assembled devices just for the automotive industry.

Our mission is to be a world class competence center offering development and manufacturing of functional semiconductor assembly solutions to companies with the focus on MEMS and sensor systems.

Services

Packaging Solutions

Complex or delicate devices can present you with significant packaging puzzles. We can help you solve them. Sencio offers functional packaging solutions for devices and systems such as MEMS and integrated sensor systemsopto-electronics and RF modules. Our solutions are complemented by a complete range of package design, prototyping, assembly and test services.

 

Our experience in package development and volume manufacturing of sensor components and systems spans over 25 years. So whatever your market – automotive, industrial, medical, aerospace, portable and wearable, etc., and for virtually any application, we can support you as a world class competence center for functional packaging.

 

Whatever packaging or assembly puzzle you face, we can help you realize your ideas.

Packaging Services

For many applications the package can often play as big a role as the silicon. This is most clearly seen with sensors, where sensors and sensor interfaces are typically customized devices. Each device is designed specifically to meet the exact nature of the application, environment and medium that the sensor needs to operate within.

 

As creative experts in our field, we understand all the different packaging technologies, tools, materials, assembly constraints and potential design restrictions. This expertise has been built up during many years of high volume manufacturing of sensor products for the automotive industry. After going over your review of your specification together, we will help you define your essential requirements and start the package design.

 

Of course our nCapsulate technology allows you to take your design to a higher level. You can incorporate alignment features, mounting support and even custom shapes. That brings flexibility to secondary housing design to ensure it better fits the needs of the end use case as well as aesthetics. It also helps save assembly time and effort while improving overall efficiency.

 

Want to develop a cost-effective functional packaging solution? Contact us to learn more.

Prototyping

We can offer you fast turnaround assembly of a small series of your device. These prototypes can be used for full electrical and functional verification of the first silicon coming out of the wafer fab for example. You can chose from ceramic or plastic packages, and special packages can also be ordered on request.

 

Our prototyping service also includes the back grinding and / or sawing of (MPW) wafers. The typical throughput time of a small prototype series is three days. Expedite throughput times are available.

 

Need functional samples for device verification urgently? Don’t delay, contact us now.

 

Volume manufacturing

Calling on our experience of industrialisation and volume manufacturing, we can deliver functional package volumes from a couple of hundred thousand to several million units per product. Our state-of- the-art, TS16949 certified production and assembly lines in the Netherlands and the Philippines deliver everything from prototypes right up to volume runs of several million units per product.

 

Our reputation speaks volumes! In total we have assembled several hundred million units, a significant portion of which are sensor devices for the automotive industry. Therefore your IP (Intellectual Property) is secured. This we guarantee, being an independent subcontractor focusing on our core competence: the functional packaging solution for your device.

 

Looking for volume assembly of your packaged devices? Contact us to discover how we can meet your expectations.

Back end wafer processing

As part of our complete assembly service, we can naturally handle your delicate (sensor) wafers with care when preparing them for assembly. We can also offer each assembly stage as stand-alone services, so for example we can manage backgrinding and sawing of wafers and return bare dies to you.

 

Chip and package thicknesses often need to be tuned, and we can provide this service for wafers up to 8”. We have wide experience of sawing sensors with membranes and our in-house capability includes fully automatic wafer inspection, used to detect both wafer and sawing defects.

 

Need delicate and careful handling of wafers? Discover how our back end processing capabilities can help you.

Component supply management

As a service supplier we can combine dies, sensors and electronic components from different suppliers into one system – as demonstrated by our MCM molding technology. If the system we assemble for you contains components from different suppliers, we can take over the supply management of the components. This reduces the working capital and material handling required on your side. It also has a positive effect on the cycle time by benefiting from fast feedback.

 

We have the experience and logistical systems to handle supply management, making your life easier. We only take over the supply management itself. You remain responsible for the component specification and ownership of the system IP. We assure material traceability.

 

Simplify the supply management of your components. Let Sencio do it as part of your assembly.

In-house Packaging Technologies

As semiconductor devices become ever more integrated and complex to meet the growing demands of always on, connected IoT solutions, so do the demands on packaging. Our range of packaging technologies provides the foundation for high quality encapsulation solutions for your MEMSsensors and multichip modules.

Calling on a range of technologies and package outlines ensures Sencio can find the right option to fit your device requirement – from exposed die , LGA assembly and QFN map moldings to MCM moldingglobtop molding and our flagship nCapsulate. And we can help you at any or all stages of package development for your device – from package development right through to automotive qualified volume production and assembly.

Contact us to discover the right package technology to encapsulate your device and deliver the protection you need.

 

  • QFN
  • Opto-electronics/photonics
  • RF/Power Modules
  • Sensors
  • MEMS