April 29, 2013, anysilicon
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to withstand the hot temperatures during tests.
Burn in tests check the reliability of the ASIC device and are typically done at 125ºC, while electrical signals and power are applied to ASICs. Burn-in boards are inserted into the burn-in oven which supplies the necessary voltages to the samples while maintaining the oven temperature at 125ºC. After the stress testing the samples must be screened to ensure they passed the oven testing.
Burn in boards utilize high grade materials. For testing up to 125C a special version of FR4 is used (High Tg FR4). For higher temperatures up to 250C a Polyimide is used; and for very high temperatures up to 300C a High grade polyimide is used.
In addition to the typical PCB design guidelines which are quite common among all PCB designers, there are a few additional factors for making a Burn in Board. One of the most important considerations is selecting the highest possible reliability and quality for the Burn in Board and the test socket. You don’t want your Burn in board to fail before the device under test. Therefore, all active/passive components and connectors should comply with high-temperature requirements, and all materials and components should meet high-temperature and aging requirements.