Featured Vendor

Mirafra

USA

Mirafra is a global Engineering Services company with expertise in Semiconductor Design & Verification, Embedded and Application Software services.

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Integra Technologies

USA

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

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AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

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Advanced Sensor Integrations

USA

ASI develops custom Analog and Mixed-Signal IC chips & IP blocks. Company is located in San Jose since 2008.

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