Low-Power VLSI Design Methodology

October 28, 2014, anysilicon

Low Power Design is the today’s need in VLSI. Why? Well, ask yourself ! You go to gadget shop, looking for a new cell-phone. Apart from the price, what are the qualitative things that you would be most concerned about?

Features including the speed of the processor
Battery back-up Read More

Selecting an embedded MCU for SoC

October 27, 2014, anysilicon

This is a guest post by Dolphin Integration which provides IP core, EDA tool and ASIC/SoC design services

When a SoC integrator has to select a microcontroller for his application, most of the time, he refers to his own previous experiences rather than on a rational assessment as no standard benchmarking

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Electronic Design: Getting to First Time Right

October 22, 2014, anysilicon

This is a guest post from Michael Hermann, V.P. of Engineering at Nuvation Engineering, provider of complex electronic product development and design services.
Getting to “first time right” is a key goal at Nuvation Engineering and is built into our electronic design methodology. Broadly speaking, it means two things: First,

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Flip Chip Market and Technology Trends

October 20, 2014, anysilicon

Yole Développement announces its Flip Chip Market and Technology Trends report. Yole Développement’s analysis updates the business status of the Flip-Chip market including data for TIM, underfills, substrates and Flip-Chip bonders. Discover fully updated 2010 – 2018 market forecast, detailed technology roadmap and bottom up approach, plus a strong focus

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Getting the Most out of IC Design Houses

October 15, 2014, anysilicon

Failure analysis

In the field of IC Design, there are many companies that have unique focus and experience in designing integrated circuits, as well as being involved in the other aspects of IC design house elements, such as packaging, testing, validation, et cetera.
It may seem like a simple choice to

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TSV is a business…Looking for wider adoption!

October 13, 2014, anysilicon

3D Through Silicon Vias (TSV) is in MEMS, CMOS Image Sensors and high-end applications. When will it be used for mainstream consumer applications?… All results are part of the new report released by Yole Développement (Yole): 3DIC & 2.5D TSV Interconnect for Advanced Packaging – 2014 Business Update. This technology

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