Blog

TSV Integration is Creating Growth

November 19, 2014, anysilicon

“The long term growth of the equipment & materials business will be supported by the expansion of 3D TSV stack platforms” says Yole (Yole Développement) in its latest report, “Equipment & Materials for 3DIC & WLP Applications“. The market research and strategy consulting company, Yole proposes a deep analysis of the equipment &

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The Macroeconimics of 450mm Wafers

November 16, 2014, anysilicon

stacked wafers

SEMICON West 2014 in San Francisco was a great place to meet bloggers in the semiconductor industry to get updated on the status of 450mm diameter silicon wafers. On one side, there is a good news about the unprecedented level of collaboration taking place between the design and construction professionals

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Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models

November 12, 2014, anysilicon

This paper describes the use of behavioral models and mixed-signal simulation as a means to verify the proper instantiation, connectivity and control of analog and mixed-signal (AMS) intellectual property (IP), and also as a means to prototype an AMS integrated circuit (IC) or system-on-chip (SOC) using behavioral models in place

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What Does It Cost You When Your SoC is Late to Market?

November 07, 2014, anysilicon

If your chip is late to market, it is costing you far more than you know.
 
Arteris conducted a survey of all its chip design customers to gain a more accurate grasp of the major concerns they have in their day-to-day operations and to gain a better understanding of what

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