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IBM, GlobalFoundries Deal to To Close July 1st

June 23, 2015, anysilicon

The tech world was buzzing during last October when IBM agreed to pay GlobalFoundries $1.5 billion to take over their semiconductor manufacturing facilities in East Fishkill and Vermont. The deal is now expected to close as of July 1st.
 
The closing of the deal will put to end months

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Focused Ion Beam (FIB)

June 19, 2015, anysilicon

Integrated circuit (IC) designers are learning that a technique long used on older process nodes is providing even more valuable benefits as they develop devices to be manufactured at advanced technology nodes, including 28nm and beyond. During a period when it takes $10 million or more to bring a device

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CDM ESD Testing: Getting a Clearer Picture

June 19, 2015, anysilicon

ESD

Of all of the component-level ESD tests available, the CDM ESD (charged-device model) test is the closest to simulating real world events. CDM ESD testing simulates ESD charging followed by a rapid discharge, similar to what is seen in the automated handling, manufacturing, and assembly of IC devices. Unfortunately, the CDM

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Xilinx Expected to Introduce new 7nm Products in 2017

June 19, 2015, anysilicon

The war between TSMC and Samsung is heating up and it’s expected to last well throughout the decade. The war only got hotter when TSMC announced that they will begin producing 7nm processors in 2017. Xilinx will be their very first customer.
Xilinx Inc. made the announcement late yesterday that

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Semiconductor Wafer – Overview and Facts

June 16, 2015, anysilicon

Semiconductor wafer is absolutely invisible in our daily life but it exists in a form of an ASIC or an IC in each and every electronic device we use. Semiconductor wafer is a round piece of silicon which consists of silicon dies that are designed to perform a very specific

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GLOBALFOUNDRIES Release Schedule for 14nm

June 13, 2015, anysilicon

The 14nm technology development between Samsung and GlobalFoundries that started last year is now reaching its final step by releasing the availability schedule of the process technology including the 2 main flavors.
 

 
The primary concept of the strategic collaboration is to make 14nm FinFET technology available at

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