Blog

TSMC will enter the fan out wafer level package business

October 28, 2015, anysilicon

“The fact that TSMC is interested in advanced packaging isn’t “new news”, comments Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). He adds: “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for

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IC Insights Lowers its Worldwide 2015 IC Market Forecast from +1% to -1%

October 23, 2015, anysilicon

IC Insights recently released its October Update to The McClean Report, which examined the effects of slowing worldwide GDP growth and a stronger U.S. dollar on the 2015 IC market forecast.
 
Since all of IC Insights’ figures are presented in U.S. dollars, a strengthening U.S. currency deflates foreign sales and market results

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BiCMOS process overview

October 22, 2015, anysilicon

While the entire semiconductor industry is excited about FinFET and FDSOI process technologies, there is one semiconductor technology that considered by engineers as “the process for real men” and it’s called BiCMOS.
 
BiCMOS process is essentially a combination of Bipolar transistor and CMOS transistors, it offers many technical advantages

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Sony spins off chipmaking business

October 20, 2015, anysilicon

Sony has announced that its semiconductor unit will now be separated from the company’s core business. The strategic decision arrived in order to allow the Japanese electronic firm to focus its resources and attentions on the Devices and the Digital image divisions. This last one in particular, in fact, has

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Intel has 1,000 people working on chips for the iPhone

October 19, 2015, anysilicon

Interesting and surprising cooperation: Intel is developing the modem chip to be used in the next iPhone’s devices. To meet Apple’s tough and tight schedule IBM has allocated a staff of about 1,000 people. Intel’s foothold in what is expected to be the world’s best-selling smartphone has a dramatic importance

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STATS ChipPAC Sold to China’s JCET

October 14, 2015, anysilicon

According to the latest reports, Temasek and China’s Jiangsu Changjiang Electronics Technology Co Ltd (JCET) just signed a $1.8 million deal that will allow JCET to acquire STATS ChipPAC from Temasek.
 
 

 
The decision followed the new internal financial policy at Temsasek which aims to diversify the

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