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Semiconductor Packaging History and Trends

February 27, 2016, anysilicon

 
Since the invention of the first semiconductor package in 1965, the semiconductor packaging technology has grown dramatically and several thousands of different semiconductor package types have been made. The chart below presents the semiconductor packaging history. Particularly it shows the two major trends in semiconductor packaging:  addressing high pin

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Simple Analog ASIC Design Solves Difficult Thermal Analysis Problems

February 24, 2016, anysilicon

In a world where Application Specific Integrated Circuits (ASICs) and Application Specific Standard Products (ASSPs) are dominating every conceivable application, greater attention is being applied to their long term reliability. These chips are being built on smaller lithographies, running at higher speeds, dissipating more power and to

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New 2D Semiconductor Material Will Lead to Faster Chips

February 23, 2016, anysilicon

Research in the field of 2D materials that started approximately five years ago, focusing on developing materials that are one layer thick which would make it faster for atoms to move in a single layer. Currently, transistors and other components used in electronic devices have been made of 3D materials

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Semiconductor R&D Growth Slows in 2015

February 16, 2016, anysilicon

Semiconductor industry spending on research and development grew by just 0.5% in 2015, which was the smallest increase since the 2009 downturn year and significantly below the compound annual growth rate (CAGR) of 4.0% in R&D expenditures during the last 10 years, according to IC Insights’ new 2016 edition of The

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RF Package Design Focusing Portability

February 15, 2016, anysilicon

Today, the (SiP) System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations

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SilabTech is the winner of IESA 2015 Technology Innovation Award

February 12, 2016, anysilicon

SilabTech, leading supplier of High Speed Interface intellectual property designs (IPs), announced today that it was awarded with the 2015 IESA Award for the Most Innovative Product for its High Speed Interface (SERDES) Design which is leading the industry in its Low Power figures while enabling customers to use it in wide variety

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