Semiconductor Foundry Sales Ranking 2015

April 27, 2016, anysilicon

TSMC, by far, was the leader with $26.4 billion in sales last year.  In fact, TSMC’s 2015 sales were over 5x that of second-ranked GlobalFoundries (even with the addition of IBM’s chip business in the second half of 2015) and almost 12x the sales of the fifth-ranked China-based foundry SMIC.

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Chipmaker Allwinner is Enabling a $79 Laptop

April 26, 2016, anysilicon

Allwinner Technology, a Chinese fabless semiconductor company that design and manufacture SoC processors announced a new laptop that could cost $79. Since its founding in 2007, Allwinner has released more than 15  SoC processors that have been widely implemented in Android-based tablets, as well as in smartphones, laptops and more. Read More

High Bandwidth Memory – White Paper

April 25, 2016, anysilicon

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology.
In June 2015, AMD introduced its Fiji

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Automotive IC Market to Display Strongest Growth Through 2019

April 21, 2016, anysilicon

Later this month, IC Insights will release its new 2016 IC Market Drivers Report.  The report contains analyses on automotive electronics, the Internet of Things, tablet PCs, smartphones, medical and health systems, and several other mature and emerging electronic systems.
The upcoming IC Market Drivers Report finds that from 2014 through 2019, the

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Glassify’s Brewing a Semiconductor Beer Glass

April 18, 2016, anysilicon

Israeli start-up Glassify joined the IoT revolution and introduces the first beer glass integrating a semiconductor chip. The beer glass allows consumers to connect the glass to the smartphone using NFC technology.

According to the company the new beer glass allows consumer to enjoy a more personal

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High-Bandwidth Memory (HBM) Webinar Video

April 14, 2016, anysilicon

SK hynix, Inc., Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete high-bandwidth memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect an SoC and an HBM memory stack. Many companies are already using HBM to

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