Monthly Archives: December 2016

Faraday Readies MCU ASIC Migration Path with 55nm eFlash

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance. By skipping 90nm, Faraday’s MCU ASIC path strides directly from 8-inch 0.11μm to 12-inch 55nm eFlash process node, offering much lower power/leakage and significant performance gain. Faraday has already achieved multiple design wins, such as MFP (Multifunction printer) and smart meter.


This 55nm eFlash-based ASIC solution consists of Faraday’s PowerSlash™ library and memory IP with Turbo Mode feature to accelerate device performance; Faraday also provides versatile interface IPs and the Uranus™ SoC development platform to speed-up the development of the SoC silicon. In addition to the 55nm design wins, Faraday’s eFlash solution has been implemented in touch panels, factory automation, and automotive appliances to address the ever-expanding market.


“In order to meet the growing demand for advanced MCUs, Faraday has readied the new migration path with the 55nm eFlash-based ASIC solution,” said Steve Wang, President of Faraday. “We have abundant experience and knowledge to implement our ASIC solution at UMC’s fab, helping obtain better yield improvement for the eFlash blocks. By utilizing this 55nm solution, we are confident that we can assist our customers to seize business opportunities in the market with cost advantages and faster time-to-market.”




About Faraday Technology Corporation

Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, MPEG4, H.264, USB 2.0/3.1 Gen 1, 10/100/1000 Ethernet, Serial ATA, PCI Express, and programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China.

For more information about Faraday, please visit:


Press Contact: Faraday Tech, Evan Ke, +886 3 578 7888 ext. 8689,

AnSem expands operations in Enschede, The Netherlands

Leuven, December 20th 2016 – AnSem NV, the leading analog, RF and mixed-signal ASIC solutions company expands its operations, opening an office in Enschede, The Netherlands.


The Dutch design center will be headed by Clemens Mensink, who has over 20 years of IC experience. AnSem BV will be located close to the University of Twente, at The Innovation Campus in Enschede.


Stefan Gogaert, CEO of AnSem, is happy to announce the start of AnSem BV: “AnSem wants to keep its leading role in delivering world class analog and mixed-signal IC design services and turnkey ASIC solutions to the growing markets of medical and industrial applications. Starting a design center in the Netherlands is part of this growth strategy. The vicinity of the University of Twente is not a coincidence. Together with the University of Leuven, the ICD-group at the University of Twente is one of the most renowned, cutting-edge and innovative educational institutes in the field of IC design.”




AnSem NV

Karolien Verhaeghe – HR & MarCom Manager

Esperantolaan 9 3001 Heverlee

Phone: +32 16 38 65 06


HDL Design House Selected as ARM Approved Design Partner

Belgrade, Serbia – December 20th, 2016 – HDL Design House, a provider of high-performance digital and analog IP cores and system-on-chip (SoC) design and verification services, has joined the ARM® Approved Design Partner program, through which leading SoC design houses are recognized by ARM as accredited partners in specific technologies and activities.


To ensure the deliverance of the highest quality in SoC design services based around ARM processor IP and the ARM DesignStart portal, HDL Design House (DH) successfully completed the ARM auditing process. Membership of the program validates HDL DH’s ability to respond to increasing customer requirements for the provision of ARM-based solutions and expertise. ARM technology users can also benefit from the HDL DH FlexIP core portfolio, which consists of soft IP cores ready to be integrated into ARM-based SoCs.


HDL DH has already gained extensive experience in this area, having executed more than 50 ARM CPU-based SoC projects.


“We are delighted to join the ARM Approved Design Partner program and thus ensure credibility in our SoC design capabilities,” said Predrag Markovic, CEO, HDL DH. “Our team has accumulated significant know-how in SoC design, working on numerous ARM-based projects covering market segments such as industrial, mobile, Internet of Things (IoT), communications and automotive. Membership of the ARM Approved Design Partner program demonstrates our ability to assist with bespoke customer projects in the latest technologies for emerging markets.“


“HDL DH provides comprehensive SoC design and verification services and today becomes a valued new member of the ARM Approved Design Partner program,” said Peter Lewin, director of marketing, Partner Enablement Group, ARM. “The company’s accreditation extends the choice of official design partners with extensive experience in implementing ARM-based designs in the most efficient way possible.”






About HDL Design House:
HDL Design House delivers leading-edge digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs. The company also develops IP cores, developed and verified using Cadence tools and flow, and component (VITAL) models for major SoC product developers. Founded in 2001 and currently employing 140 engineers working in three design centers in Serbia and Greece, HDL Design House’s mission is to deliver high quality products and services, with flexible licensing models, competitive pricing and responsible technical support. The company was awarded ISO 9001:2008 and ISO 27001:2013 certifications in December 2006 and has achieved certifications from Direct Assessment Services (DAS). For more information, please visit


For more information, please contact:


HDL Design House
Milena Jovanovic,
Marketing Manager,
phone: +381 (0)11 7859 557

300mm Silicon Wafers Market Overview

Prior to 2008, the 200mm silicon wafer was used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm silicon wafers.  Rankings of silicon manufacturers by installed capacity for each of the wafer sizes are shown in Figure 1.  The chart also compares in a relative manner the amounts of capacity held by the top 10 leaders.




Figure 1



Looking at the ranking for 300mm silicon wafers, it is not surprising that the list includes only DRAM and NAND flash memory suppliers like Samsung, Micron, SK Hynix, and Toshiba/Western Digital; the world’s five largest pure-play foundries TSMC, GlobalFoundries, UMC, Powerchip, and SMIC; and Intel, the industry’s biggest IC manufacturer (in terms of revenue).  These companies offer the types of ICs that benefit most from using the largest wafer size available to best amortize the manufacturing cost per die, and have the means to continue investing large sums of money in new and improved 300mm fab capacity.

The leaders in the 200mm size category consist of pure-play foundries and manufacturers of analog/mixed-signal ICs and microcontrollers.

The ranking for the smaller wafer sizes (i.e., ≤150mm) includes a more diversified group of companies. STMicroelectronics has a huge amount of 150mm wafer capacity at its fab site in Singapore, but the company has been busy converting this production to 200mm wafers.  Another STMicroelectronics 150mm fab in Catania, Italy, is also undergoing a conversion to 200mm wafers, with plans for that project to be completed in 2017.

A significant trend regarding the industry’s IC manufacturing base, and a challenging one from the perspective of companies that supply equipment and materials to chip makers, is that as the industry moves IC fabrication onto larger wafers in bigger fabs, the group of IC manufacturers continues to shrink in number (Figure 2).

Today, there are less than half the number of companies that own and operate 300mm wafer fabs than 200mm fabs.  Moreover, the distribution of worldwide 300mm wafer capacity among those manufacturers is becoming increasingly top-heavy.

Figure 2

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More Information Contact

For more information regarding this Research Bulletin, please contact Bill McClean, President at IC Insights. Phone: +1-480-348-1133, email:

Embedded die: from Incubation to High Volume Production

Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC[1] package substrate came from DC/DC[2] converters in smartphones, penetration in other market segments of interest to embedded die such as automotive, medical or aerospace was simply delayed due to much longer qualification times and regulatory approval cycles.


Furthermore, embedded die platforms are showing different drivers compared to competing solutions…


The embedded die platform has been incubated and brewed for years patiently waiting for the right moment to appear on the scene in considerable volume. It seems we are finally nearing the point of inflection – from incubation to volume, comments Yole’s Advanced Packaging & Semiconductor Manufacturing team.


Embedded Die Packaging: Technology& Market Trends 2017 contains a full segmentation of the embedded die platform including embedded die in IC package substrate, rigid board and flexible board and the related drivers. This report proposes a detailed analysis of market revenue and unit forecasts per segments such as mobile, automotive, medical, consumer, ICT and industrial. Yole’s analysts review detailed splits per product within each market segment. These estimations are based on industry developments and likelihood of further success of the Embedded Die platform.


“In 2015, an estimated 94% of the US$23.5 million embedded die packaging market was recorded in the highly competitive mobile segment,” announces Emilie Jolivet, Technology & Market Analyst within Advanced Packaging & Semiconductor Manufacturing team at Yole. 2016 exhibited a revenue decline, expected to last through 2017, due to production decline of camera modules in mobile phones utilizing the embedded die packaging platform. Going forward, the embedded die market is expected to drastically change with product launches in the automotive, medical, ICT[3], consumer and industrial segments. By 2021 non-mobile share of the US$ 49.7 million embedded die packaging market will rise from 6% to 36% of the total revenue. Automotive and medical markets offer a promising opportunity for the embedded die technology rising from scratch to a combined US$15.5 million packaging revenue. Certain products in the medical domains are in the final stages of long awaited regulatory approvals while the automotive market could be more disruptive with 5-10 times higher revenues, depending on big player adoption rates.



For the first time, in a dedicated technology & market report, the “More than Moore” market research & strategy consulting company Yole treats the embedded die in PCB[4] platform as a standalone topic covering both embedding in an IC package substrate, rigid boards and flexible boards. In addition, Yole’s analysts detail the advanced embedded interconnects such as MCeP® developed by Shinko or Intel’s solution named EMIB®. When advanced embedded interconnects are included, the embedded die packaging revenue rises an order of magnitude.


As announced, in terms of applications, the limited products/one market image is expected to change significantly. The embedded die technology has been known to the high reliability markets such as medical, aerospace and automotive for years. However cycle times and especially regulatory approvals follow much different and longer schemes than in the consumer sector. A variety of products is expected to arrive on the market in the near future. A trend from low cost to high value embedded die packaging is on the horizon.


  • The automotive sector is forecasted with highest revenue and unit growth with CAGR[5] values from 2015 to 2021 of 246% and 239%, respectively and first volumes expected already in 2017. The high growth is expected from the adoption of embedded die in 48V power converters, motor control units, camera modules, distance sensors and lighting modules.
  • Following the automotive market, the high value lower unit count medical market is forecasted to exhibit a CAGR of 84%. The products associated include hearing aids, pacemakers, neurostimulation and endoscopic cameras.


In combination with products from other market segments, the overall embedded die packaging revenue CAGR is estimated at 13% and unit CAGR at 25% by 2021. However, although non-mobile products are expected to gain speed, the mobile segment is likely to maintain leadership by 2021 due to several RF and power management units adopting embedded die resulting in a mobile segment revenue CAGR of 9%.


Looking ahead, the adoption of embedded die in new markets is expected to propel the embedded die platform from 2018 onwards to the long awaited higher volumes and growth slopes.


A detailed description of the embedded die report is available on, advanced packaging reports section.


[1] IC : Integrated Circuit

[2] DC : Direct Current

[3] ICT : Information & Communication Technologies

[4] PCB : Printed Circuit Board

[5] CAGR : Compound Annual Growth Rate



Samsung Likely to Spin off Foundry Business Division

According to Business Korea Samsung Electronics is considering a reorganization of the System LSI division in order to systematically grow the system semiconductor business. The company is planning to separate the design and manufacturing sectors in the business unit and divide or spin off it to fabless and foundry business divisions.

The consideration came after the company lost Apple, the largest customer in the sector of application processors (AP), which refers to the brain of smartphones, to Taiwan’s TSMC and some raised awareness towards the need to separate the foundry business division.

Samsung Electronics’ System LSI business division is largely divided into four segments; system on chip (SoC) team which develops mobile APs, LSI development team which designs display driver chips and camera sensors, foundry business team and support team. According to many officials in the industry, Samsung Electronics is now considering forming the fabless division by uniting the SoC and LSI development teams and separating from the foundry business.



The System LSI reorganization plan shows Samsung’s will to grow the business more systematically by dividing its system semiconductor design and manufacturing capabilities.

As Samsung Electronics succeeded in mass producing system semiconductor products 10-nanometer process technology for the first time in the world, the company signed a large foundry contract with Qualcomm.