Blog

Challenges and Opportunities for the Semiconductor Industry in the IoT

May 31, 2017, anysilicon

The Internet of Things has become a mainstream technology strategy for businesses looking to accelerate growth in 2017 and beyond. The semiconductor industry isn’t immune to the ongoing IoT buzz, as experts believe that major players will soon abandon the pursuit of Moore’s Law in favor of a wholesome strategy necessitating

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Programmable Battery Charger IP Cores For SoC Applications

May 29, 2017, anysilicon

Since its inception in 2008, Chipus has been developing a series of analog power management IP cores, including linear regulators, power-on resets, ultra low power references (voltage and current), and power management units, using various architectures, and employed by customers worldwide in various application areas.
 
Chipus is now building

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Apple is working on an AI Chip (IC)

May 29, 2017, anysilicon

Apple began relatively early with artificial intelligence software when it introduced Siri in 2011 – a tool that allows users to activate their smartphones with voice commands. Now, the electronics giant is bringing artificial intelligence to ICs.
 
Apple is working on a processor specifically designed for artificial intelligence tasks,

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Alma Technologies Introduces an Online Tool for Comparison of Image Compression Standards as Implemented by our IP Cores

May 26, 2017, anysilicon

An online tool for back-to-back comparison of the image compression standards implemented by our IP cores is now available on our website.
 
The Bit Accurate Models of the respective image compression cores are used to encode / decode a user supplied test image, in order to evaluate and compare

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2017 Automotive Semiconductor Market on Pace for Record Year

May 25, 2017, anysilicon

Electronic systems that improve vehicle performance; that add comfort and convenience; and that warn, detect, and take corrective measures to keep drivers safe and alert are being added to new cars each year. Consumer demand and government mandates for many of these new systems, along with rising prices for many

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IC Test Flow For Advanced Semiconductor Packages

May 24, 2017, anysilicon

Higher bus speeds and lower power consumption are design criteria for most modern digital electronic products. Packaging solutions that provide higher bus speeds at reduced power per bit ratios require design techniques that shorten the distance between chips (to reduce drive currents) and use wider data buses (with finer line-space

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