Monthly Archives: April 2018

Cyient Acquires Semiconductor Firm AnSem N.V.

Cyient Limited (“Cyient”), a global provider of engineering, manufacturing, geospatial, networks, and operations management services, today announced that its step down subsidiary Cyient Europe Ltd. has acquired AnSem N.V., a leading fabless, custom analog and mixed-signal application-specific integrated circuits (ASICs) design company. AnSem specializes in advanced analog, radio frequency, and mixed-signal integrated circuit design and provides custom ASICs for clients around the world across key industries, including automotive, medical, industrial, smart home, and smart grid, with long-life applications of five to ten years.


Incorporated in 1998 as a spin-off of the university of Leuven and with the support of imec – the research and innovation hub in nanoelectronics and digital technologies. AnSem has a strong team of technical and domain experts and has established itself as a well-known name in the field of analog and mixed-signal ASICs. Headquartered in Leuven, Belgium, AnSem has been certified as an ISO 9001:2015 company with a strong focus on solving complex challenges. Through its proven history of 100% first-time-functional designs, AnSem not only provides significant cost savings, but also time-to-market benefits, making this Cyient’s center of excellence. AnSem, has revenue of ~$10 Million and 20%+ operating margin.


“AnSem’s leading-edge, custom mixed-signal analog integrated circuit (IC) capability allows Cyient to offer turnkey ICs, starting from concept circuit to final production. Through this acquisition, Cyient can help its clients develop smart analog sensors to capture data, while leveraging our IoT and analytics solutions to provide actionable insights,” said Suman Narayan, Senior Vice President for Semiconductor, IoT, and Analytics at Cyient.


“We are excited to become a part of the Cyient family and expand our capabilities to a larger customer base,” said AnSem’s CEO and Co-founder, Stefan Gogaert. “Over the years, AnSem has built an impeccable record of custom analog ASIC solutions delivery, a long-term customer base, and an unparalleled capability to develop, validate, and verify complex solutions. Thanks to this acquisition, our ability to deliver the volume of ASICs that our customers need to stay ahead of the competition will become even stronger. It also will enable us to be in the leading position that we were already aiming for.”


“Innovation is an integral part of imec’s culture, and throughout the years, we have continuously supported regional start-up activities related to microelectronics and nanoelectronics. AnSem is one of the success stories that has grown to become a profitable company in analog, RF and mixed-signal design with an international customer base,” said Ludo Deferm, Executive Vice President at imec and member of the Board of Directors of AnSem. “We are delighted with the acquisition of AnSem by Cyient. This is a confirmation of AnSem’s business value and the strength of the eco-system around imec. We are hopeful that this acquisition is the beginning of a close collaboration between Cyient and imec, as well as with other Flemish companies.”


Cyient expects this transaction to be EPS accretive.


About Cyient:
Cyient (Estd: 1991, NSE: CYIENT) provides engineering, manufacturing, geospatial, networks, and operations management services to global industry leaders. Cyient leverages the power of digital technology and advanced analytics capabilities, along with domain knowledge and technical expertise, to solve complex business problems. As a Design, Build, and Maintain partner, Cyient takes solution ownership across the value chain to help clients focus on their core, innovate, and stay ahead of the curve.

Relationships form the core of how Cyient works. With over 15,000 employees in 21 countries, Cyient partners with clients to operate as part of their extended team, in ways that best suit their organization’s culture and requirements. Cyient’s industry focus includes aerospace and defense, medical, telecommunications, rail transportation, semiconductor, utilities, industrial, energy and natural resources.

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AMBA Bus Overview

The Advanced Microcontroller Bus Architecture (AMBA) is an on-chip interconnect that uses an open standard. The AMBA bus connects to and controls the management of peripherals and blocks designed for SoC or System-on-a-Chip. The development of the AMBA bus has had far reaching effects, including the creation of multi-processor designs that use significant numbers of peripherals and controllers.


The following figure shows the AMBA bus implementation:


However, the AMBA bus goes far beyond devices that are microcontroller based. Its effect reaches a wide-range of applications, including SoC parts that are used in devices such as smartphones, TVs and more. Without the development of AMBA bus, the creation of mobile devices such as tablets and smartphones would be quite difficult to say the least. AMBA is a registered trademark of ARM.


How AMBA Bus Works


The AMBA bus was designed to address the interconnect for SoC application and have the peripherals interface with each other more efficiently. The purpose of the AMBA bus is to do the following:


  • Unify and standardize SoC interconnect IP
  • Enable and promote SoC modular design
  • Easy reuse of IP cores
  • Allow 1st time right development of SoC with one or more embedded CPUs
  • Supports high performance along with low-power communication

The modular design helps to boost the development of IP cores which are technology independent and the reuse of IP cores to help accelerate and reduce cost of future designs.


AMBA Bus History


The AMBA was first introduced by a company named ARM in 1996. The first buses used in AMBs were the Advanced Peripheral Bus or APB and the Advanced System Bus or ASB. The design was an immediate success, and this was followed in 1999 by the AMBA 2. In this version, the AMBA added a high-performance bus or AHB that used a singular clock-edge protocol which advanced the design of the product.


By 2003, the AMBA 3 was created and it introduced the Advanced Extensible Interface or AXI which boosted the performance of the interconnect to an even higher degree. It also brought along the Advanced Trace Bus or ATB which was used on the CoreSight trace solution and on-chip debug. This design lasted for several years until it was surpassed in 2010 by the AMBA 4. This version boosted the AXI to a considerable degree and laid the foundation for newer versions.


By 2013, the AMBA 5 came along and provided the Coherent Hub Interface or CHI along with a newly designed high-speed transport application that helped reduce congestions and create a streamlined approached. So potent has the impact of the AMBA been that today the protocols are considered the industry standard for all embedded processors.

Sankalp Semiconductor to Participate in Panel Discussion at “The Annual SOI Silicon Valley Symposium”

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be present at SOI Silicon Valley Symposium on 26th April in Santa Clara, California. Sankalp Semiconductor offers services and solutions to its customers in key semiconductor domains including digital, analog, mixed signal, custom layout, standard cell development, IO, memory, IP migration services and PDK development. Sankalp Semiconductor acts as a One-Stop Semiconductor Services store for various customer requirements. The event will feature Samir Patel, CEO, Sankalp Semiconductor as one of the panellist.



When: Thursday, April 26th from 4:55 pm to 5:55 pm
Location: Hyatt Regency, Santa Clara, CA
Panel: Need for ultra-low power electronics and its application drivers
Moderator: Carlos Mazure, SOI Industry Consortium
Panelists: Samir Patel, CEO, Sankalp Semiconductor, Dr. Tim Saxe of QuickLogic will be joined by Mahesh Tirupattur, EVP, Analog Bits, Kelvin Low, VP, ARM, Dave Eggleston, VP, GLOBAL FOUNDRIES and Wayne Dai, CEO, Verisilicon



To set-up a Meeting at the event, please send us an email at



For more information on conference, please visit


About Sankalp Semiconductor
Sankalp Semiconductor offers an integrated portfolio of services and solutions to its customers in key semiconductor domains including digital, analog, high-speed physical interface IP, Embedded Memory Compiler and EDA modelling. Sankalp Semiconductor is a preferred semiconductor design service partners to multiple Fortune 500 companies in the Automotive, Consumer Electronics, Industrial IoT and Medical electronics space. The company enables its customers achieve their time-to-market window by delivering first pass silicon designs and engage with product engineering teams across the globe to design System-on-Chip. Sankalp Semiconductor is based in Sunnyvale, California, with offices in USA, India, Canada, Germany and Malaysia.




Contact Information: Sowmya Maskay

Sankalp Semiconductor


Semiconductor Foundries Sales Ranking 2017

Research included in the recently released 50-page April Update to the 2018 edition of IC Insights’ McClean Report shows that in 2017, the top eight major foundry leaders (i.e., sales of ≥$1.0 billion) held 88% of the $62.3 billion worldwide foundry market (Figure 1).  The 2017 share was the same level as in 2016 and one point higher than the share the top eight foundries represented in 2015.  With the barriers to entry (e.g., fab costs, access to leading edge technology, etc.) into the foundry business being so high and rising, IC Insights expects this “major” marketshare figure to remain at or near this elevated level in the future.

TSMC, by far, was the leader with $32.2 billion in sales last year.  In fact, TSMC’s 2017 sales were over 5x that of second-ranked GlobalFoundries and more than 10x the sales of the fifth-ranked foundry SMIC.

Figure 1
China-based Huahong Group, which includes Huahong Grace and Shanghai Huali, displayed the highest growth rate of the major foundries last year with an 18% jump.  Overall, 2017 was a good year for many of the major foundries with four of the eight registering double-digit sales increases.

Of the eight major foundries, six of them are headquartered in the Asia-Pacific region. As shown, Samsung was the only IDM foundry in the ranking.  IBM, a former major IDM foundry, was acquired by GlobalFoundries in mid-2015 while IDM foundries Fujitsu and Intel fell short of the $1.0 billion sales threshold last year. Although growing only 4% last year, Samsung easily remained the largest IDM foundry in 2017, with over 5x the foundry sales of Fujitsu, the second-largest IDM foundry.



To review additional information about IC Insights’ new and existing market research reports and services please visit our website:


More Information Contact

For more information regarding this Research Bulletin, please contact Bill McClean, President at IC Insights. Phone: +1-480-348-1133, email:


CMOS Image Sensor (CIS) Sales Records Seen Through 2021

CMOS image sensor (CIS) sales are on pace to reach a seventh straight record high this year and nothing ahead should stop this semiconductor product category from breaking more annual records through 2021 (Figure 1), according to IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discretes.

After rising 9% in 2017 to about $11.5 billion, worldwide CMOS image sensors sales are expected to increase by a compound annual growth rate (CAGR) of 8.7% to $15.9 billion in 2021 from the current record high of $10.5 billion set in 2016, based on the five-year forecast in the 360-page O-S-D Report, which covers more than 40 different product categories across optoelectronics, sensors and actuators, and discrete semiconductors.


Figure 1


After strong growth from the first wave of digital cameras and camera-equipped cellphones, image sensor sales leveled off in the second half of the last decade.  However, another round of strong growth has begun in CMOS image sensors for new embedded cameras and digital imaging applications in automotive, medical, machine vision, security, wearable systems, virtual and augmented reality applications, and user-recognition interfaces.

Competition among CMOS image sensor suppliers is heating up for new three-dimensional sensing capability using time-of-flight (ToF) technology and other techniques for 3D imaging and distance measurements.  ToF determines and senses the distance of faces, hand gestures, and other things by measuring the time it takes for light to bounce back to sensors from emitted light (often an infrared laser or LED).  CMOS technology has progressed to the point of supporting integration of ToF functions into small chip modules and potentially down to a single die.  Sony, Samsung, OmniVision, ON Semiconductor, STMicroelectronics, and others have rolled out and developed 3D image sensors. Infineon has also jumped into the image sensor arena with a 3D offering that is built in ToF-optimized CMOS technology.

Automotive systems are forecast to be the fastest growing application for CMOS image sensors, rising by a CAGR of 48% to $2.3 billion in 2021 or 14% of the market’s total sales that year, says the 2017 O-S-D Report.  CMOS image sensor sales for cameras in cellphones are forecast to grow by a CAGR of just 2% to $7.6 billion in 2021, or about 47% of the market total versus 67% in 2016 ($7.0 billion).  Smartphone applications are getting a lift from dual-camera systems that enable a new depth-of-field effect (known as “bokeh”), which focuses on close-in subjects while blurring backgrounds—similar to the capabilities of high-quality single-lens reflex cameras.

Report Details:  The 2017 O-S-D Report 
In a one-of-a-kind study, IC Insights continues to expand its coverage of the semiconductor industry with detailed analysis of trends and growth rates in the optoelectronics, sensors/actuators, and discretes market segments in its newly revised 360-page O-S-D Report—A Market Analysis and Forecast for the Optoelectronics, Sensors/Actuators, and Discretes.

Now in its 12th annual edition, the 2017 O-S-D Report contains a detailed forecast of sales, unit shipments, and selling prices for more than 30 individual product types and categories through 2021. Also included is a review of technology trends for each of the segments.  The 2017 O-S-D Report, with more than 240 charts and figures, is attractively priced at $3,590 for an individual-user license and $6,690 for a multi-user corporate license.


More Information Contact

For more information regarding this Research Bulletin, please contact Rob Lineback, Senior Market Research Analyst at IC Insights. Phone: +1-817-731-0424, email:




Innosilicon is proud to announce the expansion of our IP portfolio into GLOBALFOUNDRIES new 22nm FDX technology node. Innosilicon’s IP in 22FDX offers an excellent combination of performance, power consumption and ease of use that Innosilicon is known for.


“We have worked closely with GlobalFoundries for years to ensure our mutual customers can get products to market quickly and still meet their power, performance, and area targets.” said Cathy Chen, Innosilicon IP Sales Chief.


As a very important ecosystem partner of GlobalFoundries, Innosilicon was invited to develop IP last year and passed verification this year. Some Renowned company has already started applying Innosilicon’s IP on this node.
In order to better serve our customers, Inosilicon will establish a design center in Chengdu, hand in hand with GlobalFoundries, and make effort to offer best solution for our customers.






GLOBALFOUNDRIES, a leading full-service semiconductor design, development, fabrication and innovation company with locations across the globe.
GlobalFoundries partner with some of the world’s most inspired companies to develop and produce the semiconductors that are changing the way people live today and defining what’s possible for tomorrow.
While execution excellence remains our first priority, we are more than a manufacturer. We are the catalyst for growth in the industries we serve. With one of the largest populations of leading-edge scientists and technologists in the semiconductor manufacturing industry.








INNOSILICON is a world class innovative fabless IP design company focusing on high performance
PHYs, HD mixed signal IP products with leading market shares. We are 1st to provide silicon proven 14nm IP in China and 1st to reach >100M production record in 28nm. Our IPs are highly optimized and available in SMIC, TSMC and GF processes from 0.13/0.11um, 90nm,
65/55nm, 40nm, 28nm all the way to 16nm/14nm. Contact us and discover just how easy your next SoC design can be with our end-to-end support.