Blog

CEO Talk: Karel Masařík

July 30, 2018, anysilicon

This interview was held with Karel Masařík, Founder and Chief Executive Officer at Codasip, Ltd.
 

 
Tell me a bit about your background. How did you first get started with your company?
 
Codasip was born a decade ago out of my PhD work at the Technical University of Brno. I

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Sankalp Semiconductor Appoints Sathish Kumar Ganesan as Vice President Engineering

July 27, 2018, anysilicon

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, has appointed Sathish Kumar Ganesan in the key position of Vice President Engineering for IP Business. In this capacity, Sathish will be responsible for IP development and related engineering services. He has 16+ years

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Amkor Delivers Industry’s First Package Assembly Design Kit to Support Mentor’s High-Density Advanced Packaging Tools

July 21, 2018, anysilicon

Amkor Technology announced today it has partnered with Mentor to release Amkor’s SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools. Amkor’s award-winning High-Density Fan Out(HDFO) process can now be used in conjunction with Mentor’s software to deliver

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Open-Silicon and Credo Demonstrate Solutions for Deep Learning and Networking Applications at TSMC OIP and Symposium in Amsterdam

July 21, 2018, anysilicon

Open-Silicon, a system-optimized custom SoC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, and Credo, a global innovation leader in Serializer-Deserializer (SerDes) technology, will participate in a joint demonstration at the TSMC 2018 Open Innovation Platform Ecosystem Forum and Technology Symposium in

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Semiconductor Content in Electronic Systems Forecast to Reach 31.4% in 2018

July 21, 2018, anysilicon

In its upcoming Mid-Year Update to The McClean Report 2018 (to be released at the end of July), IC Insights forecasts that the 2018 global electronic systems market will grow 5% to $1,622 billion while the worldwide semiconductor market is expected to surge by 14% this year to $509.1 billion, exceeding the $500.0

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Inomize to present a paper at TSMC OIP Forum in Amsterdam

July 18, 2018, anysilicon

Inomize, a leading Israeli design services company, will present a paper at TSMC OIP Forum in Amsterdam, The Netherlands on Monday 23rd July, as well as exhibiting at the OIP Forum and the TSMC Symposium on Tuesday 24th July.
 
Abstract: Based on TSMC 16n FFC automotive process design of a multi processors System on Chip to be part

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