Monthly Archives: August 2018

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Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC China 2018

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting and presenting at D&R IP-SoC Day on 13th September in Shanghai, China. Sankalp Semiconductor offers services and solutions to its customers in key semiconductor domains including digital, analog, mixed signal, custom layout, standard cell development, IO, memory, IP migration services and PDK development. Sankalp Semiconductor provides end-to-end Semiconductor services and solutions for various customer requirements. The event will feature an industry talk by Samir Patel, CEO, Sankalp Semiconductor.

 

Featured Talk at IPSoC China

When: From 12:10 pm to 12:30 pm on 13th September 2018

Topic: “The Changing Technomics in Chip Design”, Samir Patel, CEO, Sankalp Semiconductor

Location: Evergreen Laurel Hotel Shanghai No. 1136, Zu Chongzhi Road, Pudong New District Pudong, 201203 Shanghai, China

To set-up a meeting at the event, please send us an email at marcom@sankalpsemi.com For more information on Design & Reuse IPSoC, Shanghai please visit http://www.design-reuse-embedded.com/ipsocdays/ipsocdays2018/

 

About Sankalp Semiconductor

Sankalp Semiconductor offers an integrated portfolio of services and solutions to its customers in key semiconductor domains including digital, analog, high-speed physical interface IP, Embedded Memory Compiler and EDA modelling. Sankalp Semiconductor is a preferred semiconductor design service partners to multiple Fortune 500 companies in the Automotive, Consumer Electronics, Industrial IoT and Medical electronics space. The company enables its customers achieve their time-to-market window by delivering first pass silicon designs and engage with product engineering teams across the globe to design System-on-Chip. Sankalp Semiconductor is based in Sunnyvale, California, with offices in USA, India, Canada, Germany and Malaysia. www.sankalpsemi.com

 

Contact Information:

Sowmya Maskay

Sankalp Semiconductor

marcom@sankalpsemi.com

+91 9611024330 (Cell)

View of a Businessman in front of a wall with a Processor chip and network connection - 3d render

Memory ICs to Account for 53% of Total 2018 Semiconductor Capex

IC Insights forecasts total semiconductor capital expenditures will rise to $102.0 billion this year, marking the first time that the industry has spent more than $100 billion on capital expenditures in one year.  The $102.0 billion spending level represents a 9% increase over $93.3 billion spent in 2017, which was a 38% surge over 2016.

 

Figure 1 shows that more than half of industry capital spending is forecast for memory production—primarily DRAM and flash memory—including upgrades to existing wafer fab lines and brand new manufacturing facilities. Collectively, memory is forecast to account for 53% of semiconductor capital expenditures this year. The share of capital spending for memory devices has increase substantially in six years, nearly doubling from 27% ($14.7 billion) in 2013 to a forecast of 53% ($54.0 billion) of total industry capex in 2018, which amounts to a 2013-2018 CAGR of 30%.

Figure 1
Of the major product categories shown, DRAM/SRAM is forecast to show the largest increase in spending, but flash memory is expected to account for the largest share of capex spending this year (Figure 2).  Capital spending for the DRAM/SRAM segment is forecast to show a 41% surge in 2018 after a strong 82% increase in 2017.  Capital spending for flash memory is forecast to rise 13% in 2018 after a 91% increase in 2017.

 

Figure 2

 

After two years of big increases in capital expenditures, a major question looming is whether high levels of spending will lead to overcapacity and a softening of prices.  Historical precedent in the memory market shows that too much spending usually leads to overcapacity and subsequent pricing weakness.  With Samsung, SK Hynix, Micron, Intel, Toshiba/Western Digital/SanDisk, and XMC/Yangtze River Storage Technology all planning to significantly ramp up 3D NAND flash capacity over the next couple of years (and new Chinese memory startup companies entering the market), IC Insights believes that the future risk for overshooting 3D NAND flash market demand is high and growing.

 
Report Details:  The 2018 McClean Report
Details on capital spending and other trends within the IC industry are provided in The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry (released in January 2018).  A subscription to The McClean Report includes free monthly updates from March through November (including a 200+ page Mid-Year Update), and free access to subscriber-only webinars throughout the year.  An individual-user license to the 2018 edition of The McClean Report is priced at $4,290 and includes an Internet access password.  A multi-user worldwide corporate license is available for $7,290.

 

 

To review additional information about IC Insights’ new and existing market research reports and services please visit our website: www.icinsights.com.

 

 

 

More Information Contact

For more information regarding this Research Bulletin, please contact Bill McClean, President at IC Insights. Phone: +1-480-348-1133, email: bill@icinsights.com
PDF Version of This Bulletin

A PDF version of this Research Bulletin can be downloaded from our website at http://www.icinsights.com/news/bulletins/

 

globalfoundries_feat

GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings

GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.

 

GF is realigning its leading-edge FinFET roadmap to serve the next wave of clients that will adopt the technology in the coming years. The company will shift development resources to make its 14/12nm FinFET platform more relevant to these clients, delivering a range of innovative IP and features including RF, embedded memory, low power and more. To support this transition, GF is putting its 7nm FinFET program on hold indefinitely and restructuring its research and development teams to support its enhanced portfolio initiatives. This will require a workforce reduction, however a significant number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.

 

“Demand for semiconductors has never been higher, and clients are asking us to play an ever-increasing role in enabling tomorrow’s technology innovations,” Caulfield said. “The vast majority of today’s fabless customers are looking to get more value out of each technology generation to leverage the substantial investments required to design into each technology node. Essentially, these nodes are transitioning to design platforms serving multiple waves of applications, giving each node greater longevity. This industry dynamic has resulted in fewer fabless clients designing into the outer limits of Moore’s Law. We are shifting our resources and focus by doubling down on our investments in differentiated technologies across our entire portfolio that are most relevant to our clients in growing market segments.”

 

In addition, to better leverage GF’s strong heritage and significant investments in ASIC design and IP, the company is establishing its ASIC business as a wholly-owned subsidiary, independent from the foundry business. A relevant ASIC business requires continued access to leading-edge technology. This independent ASIC entity will provide clients with access to alternative foundry options at 7nm and beyond, while allowing the ASIC business to engage with a broader set of clients, especially the growing number of systems companies that need ASIC capabilities and more manufacturing scale than GF can provide alone.

 

GF is intensifying investment in areas where it has clear differentiation and adds true value for clients, with an emphasis on delivering feature-rich offerings across its portfolio. This includes continued focus on its FDXTM platform, leading RF offerings (including RF SOI and high-performance SiGe), analog/mixed signal, and other technologies designed for a growing number of applications that require low power, real-time connectivity, and on-board intelligence. GF is uniquely positioned to serve this burgeoning market for “connected intelligence,” with strong demand in new areas such as autonomous driving, IoT and the global transition to 5G.

 

“Lifting the burden of investing at the leading edge will allow GF to make more targeted investments in technologies that really matter to the majority of chip designers in fast-growing markets such as RF, IoT, 5G, industrial and automotive,” said Samuel Wang, research vice president at Gartner. “While the leading edge gets most of the headlines, fewer customers can afford the transition to 7nm and finer geometries. 14nm and above technologies will continue to be the important demand driver for the foundry business for many years to come. There is significant room for innovation on these nodes to fuel the next wave of technology.”

 

 

About GF

GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give clients the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit http://www.globalfoundries.com.

Contact:

 

Jason Gorss
GLOBALFOUNDRIES
(518) 698-7765
jason.gorss@globalfoundries.com

beckermus

Beckermus Adds a New Active Alignment Machine: ficonTEC CL1500

Innovative medical devices, autonomous vehicles, IoT applications, cloud based organizations, 5G communication networks and more high-end industries are basing their products on microelectronics and micro-optical components.

Constant reduction in chip size and uncompromising placement accuracy demands are some of the dominant challenges those industries are facing.

We, in Beckermus Technologies, aiming to keep serving our clients with the best-of-breed micro-assembly solutions, prepared ourselves for the challenge by building an Active Alignment department.

The most recent addition to Beckermus’ facilities is a ficontec CL1500 machine. The machine’s built-in advanced capabilities were extended to accommodate our needs as a service company.

The CL1500 was adjusted to easily apply to multiple types of micro assembly requirements. This way we are able to instantaneously move from building the very first prototype to one company to a high volume production of a completely different product to another firm.

 

 Beckermus active alignment key capabilities   selected to ensure diversity and multiple applications

  • Passive/active high-precision alignment

  • High-precision bonding accuracy

  • Chip-on-Submount (CoS)

  • Lens assembly into packages

  • Pick-&-Place & handling sub-systems

  • Die sorting and component tracking

  • High accuracy epoxy bonding

  • UV Curing

  • Electronically adjustable bond force in mg range

  • Process parameter sequencing & tracking

  • Acquisition of operating parameters into a database

  • OCR for serial number tracking and component traceability

Silicone wafers in a carrier

Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it is leveraging Samsung FinFET platforms to extend its ASIC design solutions in next-generation applications, such as artificial intelligence (AI), 5G/infrastructure networking, blockchain, cloud storage, high-performance computing (HPC), AR & VR, and high-end imaging.

 

“By leveraging Samsung FinFET platforms, our customers can benefit from cutting-edge technologies for their SoC design,” said Flash Lin, Chief Operating Officer of Faraday. “In a very short time this year, Faraday has successfully taped-out ASIC projects on the Samsung FinFET platform, providing each with comprehensive value-added ASIC services. We are continuing to provide tailored ASIC solutions to help customers deliver innovative products, as well as facilitating the expansion of application coverage scenarios for Samsung Foundry.”

 

Faraday offers application-specific total solutions and has successfully delivered more than 2,200 ASIC mass production projects since 1993. This past January, Faraday joined Samsung Advanced Foundry Ecosystem (SAFE), enabling Customer ASIC to be implemented in Samsung FinFET process technologies with comprehensive verified IPs. The combination of Samsung Foundry and Faraday Technology design services provides an unparalleled level of performance, broad application coverage, and deep integration expertise.

top10

Top-15 Semiconductor Suppliers 2018

IC Insights released its August Update to the 2018 McClean Report earlier this month.  This Update included a discussion of the top-25 semiconductor suppliers in 1H18 (the top-15 1H18 semiconductor suppliers are covered in this research bulletin) and Part 1 of an extensive analysis of the IC foundry market and its suppliers.

The top-15 worldwide semiconductor (IC and O-S-D—optoelectronic, sensor, and discrete) sales ranking for 1H18 is shown in Figure 1.  It includes seven suppliers headquartered in the U.S., three in Europe, two each in South Korea and Taiwan, and one in Japan.  After announcing in early April 2018 that it had successfully moved its headquarters location from Singapore to the U.S. IC Insights now classifies Broadcom as a U.S. company.
 

Figure 1
As shown, all but four of the top 15 companies had double-digit year-over-year growth in 1H18. Moreover, seven companies had ≥20% growth, including the five big memory suppliers (Samsung, SK Hynix, Micron, Toshiba/Toshiba Memory, and Western Digital/SanDisk) as well as Nvidia and ST.
The top-15 ranking includes one pure-play foundry (TSMC) and four fabless companies.  If TSMC were excluded from the top-15 ranking, U.S.-based Apple would have been ranked in the 15th position. Apple is an anomaly in the top company ranking with regards to major semiconductor suppliers. The company designs and uses its processors only in its own products—there are no sales of the company’s MPUs to other system makers.  IC Insights estimates that Apple’s custom ARM-based SoC processors and other custom devices had a “sales value” of $3.5 billion in 1H18.
 

IC Insights includes foundries in the top-15 semiconductor supplier ranking since it has always viewed the ranking as a top supplier list, not a marketshare ranking, and realizes that in some cases the semiconductor sales are double counted.  With many of our clients being vendors to the semiconductor industry (supplying equipment, chemicals, gases, etc.), excluding large IC manufacturers like the foundries would leave significant “holes” in the list of top semiconductor suppliers.  Foundries and fabless companies are identified in the Figure. In the April Update to The McClean Report, marketshare rankings of IC suppliers by product type were presented and foundries were excluded from these listings.

Overall, the top-15 list shown in Figure 1 is provided as a guideline to identify which companies are the leading semiconductor suppliers, whether they are IDMs, fabless companies, or foundries.

 
In May 2018, Toshiba completed the $18.0 billion sale of its memory IC business to the Bain Capital-led consortium.  Toshiba then repurchased a 40.2% share of the business.  The Bain consortium goes by the name of BCPE Pangea and the group owns 49.9% of Toshiba Memory Corporation (TMC).  Hoya Corp. owns the remaining 9.9% of TMC’s shares.  The new owners have plans for an IPO within three years.  Bain has said it plans to support the business in pursing M&A targets, including potentially large deals.
As a result of the sale of Toshiba’s memory business, the 2Q18 sales results shown in Figure 1 include the combined sales of the remaining semiconductor products at Toshiba (e.g., Discrete devices and System LSIs) and the new Toshiba Memory’s NAND flash sales.  The estimated breakdown of these sales in 2Q18 is shown below:

 

  • Toshiba System LSI: $468M
  • Toshiba Discrete: $315M
  • Toshiba Memory Corporation: $3,107M
  • Total Toshiba/Toshiba Memory Corporation 2Q18 Sales: $3,890M

 

In total, the top-15 semiconductor companies’ sales surged by 24% in 1H18 compared to 1H17, four points higher than the total worldwide semiconductor industry 1H18/1H17 increase of 20%.  Amazingly, the Big 3 memory suppliers—Samsung, SK Hynix, and Micron, each registered greater than 35% year-over-year growth in 1H18.  Fourteen of the top-15 companies had sales of at least $4.0 billion in 1H18, three companies more than in 1H17.  As shown, it took just over $3.7 billion in sales just to make it into the 1H18 top-15 semiconductor supplier list.
Intel was the number one ranked semiconductor supplier in 1Q17 but lost its lead spot to Samsung in 2Q17 as well as in the full-year 2017 ranking, a position it had held since 1993.  With the continuation of the strong surge in the DRAM and NAND flash markets over the past year, Samsung went from having only 1% more total semiconductor sales than Intel in 1H17 to having 22% more semiconductor sales than Intel in 1H18!
 

It is interesting to note that memory devices are forecast to represent 84% of Samsung’s semiconductor sales in 2018, up three points from 81% in 2017 and up 13 points from 71% just two years earlier in 2016. Moreover, the company’s non-memory sales in 2018 are expected to be only $13.5 billion, up 8% from 2017’s non-memory sales level of $12.5 billion. In contrast, Samsung’s memory sales are forecast to be up 31% this year and reach $70.0 billion.

 
Report Details:  The 2018 McClean Report
Additional details on IC foundry trends are provided in the August Update to The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry (released in January 2018).  A subscription to The McClean Report includes free monthly updates from March through November (including a 200+ page Mid-Year Update), and free access to subscriber-only webinars throughout the year.  An individual-user license to the 2018 edition of The McClean Report is priced at $4,290 and includes an Internet access password.  A multi-user worldwide corporate license is available for $7,290.

 

 

To review additional information about IC Insights’ new and existing market research reports and services please visit our website: www.icinsights.com.

 

 

More Information Contact

For more information regarding this Research Bulletin, please contact Bill McClean, President at IC Insights. Phone: +1-480-348-1133, email: bill@icinsights.com

 
PDF Version of This Bulletin

A PDF version of this Research Bulletin can be downloaded from our website at http://www.icinsights.com/news/bulletins/