Monthly Archives: November 2018

Semiconductor lithography equipment market: how megatrends are going to change the future

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the MtM industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big investments. Consequently, the total equipment market for these process steps generated revenue of more than US$500 million in 2017. It is then expected to peak at almost US$900 million by 2023, with a 10% CAGR over this period. This is mostly driven by lithography market segment, showing a 10% CAGR between 2017 and 2023, to reach about US$600 million at the end of the period.



Yole Développement (Yole) releases this month its technology & market report dedicated to bonding and lithography equipment market for MtM devices. In its new edition, the market research and strategy consulting company proposes a comprehensive overview of the bonding and lithography equipment for MtM devices with an accurate update of the 2017-2023 equipment market forecasts. This report points out the technology trends across MtM devices and details the related technology roadmap. The 2018 edition reveals a valuable analysis based on competitive landscape as well as a detailed comparison between new brand and refurbished equipment by MtM device.


Megatrend markets are pushing MtM devices to new levels of complexity, resulting in big investments. Behind these markets, the lithography equipment ecosystem is directly impacted. Yole’s analysts invite you to discover today the latest technology trends and understand the market evolution.


Driven by megatrend applications, MtM devices could disrupt lithography technology adoption. Therefore megatrend applications like 5G wireless technologies, electric vehicles, and advanced mobile devices demand miniaturization and extra functionality. Fabricating the next MtM device generation requires tools with new technical specifications.


“These are very different to the “More Moore” mainstream semiconductor industry with respect to resolution, overlay, DOF, wafer bow and backside alignment”,explains Amandine Pizzagalli, Technology & Market Analyst, Semiconductor Manufacturing at Yole.


MEMS, sensors and power devices have more relaxed specifications, so that mask aligner tools are sufficient at lower cost. However, megatrend applications are pushing devices with more stringent requirements, with lithographic features below 1μm. This would pave the way towards greater adoption of stepper tools.


Today, the new lithography equipment market for MtM devices is mostly driven by advanced packaging. This sector accounts today for almost 60% of the overall MtM lithography tools market and will continue dominating this industry with stepper technology.


Meanwhile, a high percentage of lithography equipment revenue for MEMS and sensors, CIS and power devices comes is generated by retrofitted tools coming from the legacy semiconductor industry. Nevertheless, new lithography systems will be shipped to meet smaller alignment and feature sizes, where older tools will face limitations.


The lithography equipment landscape for MtM devices is fragmented in different ways since it is served by two main company types:


  • Specialist equipment vendors like Veeco, EVG, SUSS MicroTec, SMEE, who offer brand new lithography tools specifically for the MtM industry.
  • Top-tier semiconductor equipment suppliers like ASML, Canon, Nikon, mostly supporting refurbished equipment.





For decades, Canon has offered lithography equipment for the front-end area. And as a key lithography equipment vendor, Canon leads the refurbished equipment market for power and CIS devices. In order to capture additional market share in MtM devices, Canon has developed a strategy aimed at improving its product portfolio with brand-new MtM tools, available at a lower cost than its front-end lithography tools. Moreover, Canon is attempting to leverage their PVD deposition capabilities in the bonding business to launch a permanent bonding tool based on a metal interface (Image: Courtesy of Canon).


Amandine Pizzagalli had the opportunity to share her vision of the lithography equipment industry with Doug Shelton, Marketing Manager at Canon. Both experts reviewed the technical challenges and market evolution during a dedicated interview. This discussion is today available on More.


A detailed description of the Bonding and Lithography Equipment Market for More than Moore Devices report is available on, manufacturing reports section.




Sankalp wins STPI Highest Exporter Award – ITES

Bangalore, India – Nov 30, 2018 – Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, received the Software Technology Parks of India (STPI) award for being the Highest Exporter – ITES in the Hubli Region. Sankalp Semiconductor has consecutively fourth time won the award. According to STPI, the state of Karnataka has touched Rs 1,52,280Cr worth of exports from STPI member units during 2017-18. The award was presented to Sankalp Semiconductor at the Bengaluru Tech Summit on Nov 29th, 2018


“We are very honoured to win the prestigious award from STPI. We are committed to invest and grow teams specialized in chip design,” said Nagaraj Azhakesan, COO, Sankalp Semiconductor. “The award is a confirmation of our efforts in providing our global customers with high quality solution & services in the chip design domain.”


Sankalp Semiconductor incepted in 2005 with a focus to serve the semiconductor companies by primarily offering analog & mixed signal design services. Today, Sankalp with a team of 850+ engineering professionals has design centres in Hubli, Bangalore, Kolkata and Ahmedabad in India and Ottawa, Canada. The company provides unique advantage to its semiconductor customers by enabling them at any point of semiconductor services life cycle with the ability to provide end-to-end solutions.




About Sankalp Semiconductor

Sankalp Semiconductor offers an integrated portfolio of services and solutions to its customers in key semiconductor domains including analog & mixed signal, digital, high-speed physical interface IP, Embedded Memory Compiler, IOs and EDA modelling. Sankalp Semiconductor is a preferred semiconductor design service partners to multiple Fortune 500 companies in the Automotive, Consumer, Networking, Wireless, IoT, Medical electronics and Foundry space. The company enables its customers achieve their time-to-market window by delivering first time right silicon designs and engage with product engineering teams across the globe to design System-on-Chip. Sankalp Semiconductor is based in Sunnyvale, California, with offices in USA, India, Canada, Germany, Malaysia & Japan.



Contact Information:
Eklovya Sharma

Sankalp Semiconductor
+91 98790 48571 (Cell)


Samsung’s Big Semi Capex Spending Keeps Pressure on Competition

IC Insights revised its outlook for total semiconductor industry capital spending and presented its forecast of semiconductor capex spending for individual companies in its November Update to The McClean Report 2018, which was released earlier this month.


Samsung is expected to have the largest capex budget of any IC supplier again in 2018.  After spending $24.2 billion for semiconductor capex in 2017, IC Insights forecasts that Samsung’s spending will edge slightly downward, but remain at a very strong level of $22.6 billion in 2018 (Figure 1).  If it comes in at this amount, Samsung’s two-year semiconductor capital spending will be an astounding $46.8 billion.

Figure 1
As seen in Figure 1, Samsung’s semiconductor capital outlays from 2010, the first year the company spent more than $10 billion in semiconductor capex, through 2016 averaged $12.0 billion per year. However, after spending $11.3 billion in 2016, the company more than doubled its 2017 capex budget. The fact that Samsung’s continued its strong capex spending in 2018 is just as impressive.


IC Insights believes that Samsung’s massive spending outlays in 2017 and 2018 will have repercussions far into the future.  One effect that has already begun is a period of overcapacity in the 3D NAND flash market.  This overcapacity situation is due not only to Samsung’s huge spending for 3D NAND flash, but also from spending by competitors (e.g., SK Hynix, Micron, Toshiba, Intel, etc.) that attempt to keep pace in this market segment.


With the DRAM and NAND flash memory markets showing strong growth through the first three quarters of 2018, SK Hynix ramped up its capital spending this year.  In 1Q18, SK Hynix said that it intended to increase its capex spending by “at least 30%” this year. In the November Update, IC Insights forecasts that SK Hynix will see a 58% surge in its semi capex spending.  The increased spending by SK Hynix this year is focused primarily on bringing new capacity online at two of its large memory fabs—M15, a 3D NAND flash fab in Cheongju, South Korea, and the expansion of its huge DRAM fab in Wuxi, China. The Cheongju fab is being pushed to open before the end of this year.  The Wuxi fab is also targeted to open by the end of this year, a few months earlier than its original start date of early 2019.


Overall, IC Insights’ now forecasts total semiconductor industry capital spending will climb 15% to $107.1 billion this year, the first time that annual industry capex is expected to top $100.0 billion. Following the industry-wide growth this year, semiconductor capex is expected to decline 12% in 2019 (Figure 2).


Figure 2
Given that the current softness in the memory market is expected to extend into at least the first half of next year, the combined capital spending by the three largest memory suppliers—Samsung, SK Hynix, and Micron—is forecast to drop from $45.4 billion in 2018 to $37.5 billion in 2019, a decline of 17%.


In total, the top five spenders, which are expected to represent 66% of total outlays this year, are forecast to cut their capital spending by 14% in 2019 with the remaining semiconductor industry companies registering a 7% decline.


Report Details:  The McClean Report 2019
The 2019 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry, will be released in January 2019.  A subscription to The McClean Report includes free monthly updates from March through November (including a 200+ page Mid-Year Update), and free access to subscriber-only webinars throughout the year. An individual user license to the 2019 edition of The McClean Report is priced at $4,990 and includes an Internet access password.  A multi-user worldwide corporate license is available for $7,990.


As part of your 2019 subscription, you are entitled to free attendance at a McClean Report seminar (one seat for each copy purchased; company-wide licensees receive five free seats).  The schedule for next year’s seminar tour is shown below.


Tuesday, January 22, 2019 — Scottsdale, Arizona
Thursday, January 24, 2019 — Sunnyvale, California
Tuesday, January 29, 2019 — Boston, Massachusetts



To review additional information about IC Insights’ new and existing market research reports and services please visit our website:



More Information Contact

For more information regarding this Research Bulletin, please contact Bill McClean, President at IC Insights. Phone: +1-480-348-1133, email:

PDF Version of This Bulletin

A PDF version of this Research Bulletin can be downloaded from our website at


MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC

Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.




HPC is highly intensive in terms of CPU activity and requires ever increasing levels of computing power. This increased power consumption requires more electricity and this leads to much higher levels of heat generation. All this energy consumption equates to the costs of successfully implementing HPC easily becoming prohibitive.


As the CPU temperatures rise the power consumption of HPC machine ASIC drastically increases, therefore real time temperature monitoring systems are necessary to allow for power optimization. In-chip embedded temperature sensors help extend device lifetimes and provide protection through the enablement of shutdown schemes, the latter being as a result of rising temperatures from sudden increases in dynamic CPU load profiles.


Companies like MicroBT are meeting these challenges by creating cost effective, highly efficient and functional HPC machines that can deal with the increased level of heat by employing such embedded temperature sensors in areas with known hotspots on the die.


“The quality of the product is very high in all respects. Accurate temperature monitoring and management can enable products to deal with all kinds of challenges in extreme environments. The outstanding performance of Moortec’s solution gives us more confidence to face these types of environments and maintain our high quality in the mass production stage” said Guo Haifeng who is R&D header of MicroBT.


Ramsay Allen, VP of Marketing at Moortec, said “We are excited to be able to support companies like MicroBT who are working in the exciting field of HPC. MicroBT is a major innovator in this ever growing field and we are proud to support their projects with our best-in-class embedded monitoring solutions”



About MicroBT Electronics Technology Co., Ltd.

Established in 2016 and headquartered in Shenzhen, Shenzhen MicroBT Electronics Technology Co., Ltd. (hereinafter referred to as “MicroBT”) is a high-tech company in capable of designing and selling ASIC-based products built upon 28nm/16nm/7nm process. Boasting ASICs and related products with its own intellectual property, MicroBT dedicates itself to deep exploration in ASIC design, blockchain technology, cloud computing and artificial intelligence. Being good at deployment and operation of cloud computing data centers, it serves big-data processing and application areas such as cloud computing, artificial intelligence, and blockchain.


For more information visit the MicroBT website:


About Moortec

Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the consumer, mobile, automotive, high performance computing and telecommunications sectors.


For more information please contact Ramsay Allen, +44 1752 875133, visit and follow us on Twitter @moortec and LinkedIn.

Efabless Launches the Chiplicity Design Partner Program Featuring Chipus Microelectronics, Sankalp Semiconductor and Symmid Corporation

SAN JOSE, CA — Efabless, a crowd-sourcing design platform for custom silicon, today announced the launch of the Chiplicity Design Partner Program. The program supports ASIC and IP design partners across multiple services provided by the Efabless platform in responding to requests and developing custom ICs for product OEM or IC semiconductor customers.


The Efabless Design Platform offers a complete development solution for design partners that streamlines the time and cost associated with creating custom silicon solutions for the market. The platform includes a complete EDA design flow based on open-source tools, access to foundry process technologies and IP, as well as prototyping and production fabrication services.


The Design Platform is also powered by a global community of design professionals and firms that support design requests made by end-customers. In addition to design services, the community fuels the platform through creation, innovation and listing of designs and IP via the Efabless Design Marketplace. These designs and IP can then be leveraged by design partners for custom ASIC designs for end-customers enabling a broader range of solutions and a faster time-to-market.


At launch, the Chiplicity Design Partner Program includes the following companies, each of which will list IP and provide design services through the Efabless Design Platform:


Chipus Microelectronics — a semiconductor company with proven expertise in the development of ultra-lowpower, low-voltage, analog and mixed-signal integrated circuit (ICs) and systems on chip (SoCs). Headquartered in Florianópolis, Brazil, Chipus has a U.S. subsidiary in Silicon Valley and sales teams in both the United States and Europe.


Sankalp Semiconductor — an end-to-end chip design services provider for analog, digital, high-speed physical interface IP, Memory Compiler & Technology foundation. With over 14 years of operations and large design services teams Sankalp has collaborated with multitude of customers to offer innovative chip realization services.


Symmid Corporation — the largest fab-independent Malaysian design group with world-class expertise in analog, digital, mixed-signal and high-voltage IC design. Branded as the “One stop center for IC Design Solution” in Malaysia, the company provides end-to-end IC design service support to fabless design houses, electronics and semiconductor system companies, equipment manufacturers and service providers.


The combination of leading design services partners along with the Efabless Platform provides a unique and powerful offering for developing custom ASICs. By enabling design partners with tools, processes, and the ability to leverage and collaborate across a global community, Efabless streamlines the effort, process and costs of development, making custom silicon a viable option to a broader and diverse range of emerging IoT and intelligent products.


“We are excited to welcome Chipus, Sankalp and Symmid as our first design partners on the platform,” said Mike Wishart, CEO of Efabless. “They are all leaders in the industry with well-earned reputations for design quality and reliability. Importantly, they share our vision that the emerging world of massively connected devices will be accelerated by making customized mixed signal ASIC solutions broadly available and costeffective. This requires new approaches that use community business models and cloud-based collaborative development platforms. Efabless was founded to do exactly that and Chipus, Sankalp and Symmid are fellow travelers in making this vision a reality.”


“Chipus is very excited to participate in the Chiplicity Design Partner Program,” said Murilo Pessatti, CEO of Chipus Microelectronics. “We believe and recognize custom silicon design is passing to a transformation and we are proud to support initiatives driven by companies like Efabless that are visionary players. We have built a great relationship with Efabless in the last years exchanging experiences and insights, and being part of this program is really a remarkable milestone in pushing together to turn easy to make custom silicon for the huge amount of new opportunities and customizations AI and IoT requires.”


“The next wave of chip design is being enabled through reliable platforms that combine chip design domain knowledge, IPs, EDA tools and services,” said Samir Patel, CEO, Sankalp Semiconductor. “Chiplicity Design Partner Program will not only serve as the platform for traditional chip companies but will also ease the barrier for system companies with limited chip design expertise to implement their ASIC designs.”


“Being selected by Efabless to be part of Chiplicity Design Partner Program is a great milestone for Symmid. This is a recognition for Symmid’s IC design capability on global stage. We are confident that this platform will greatly benefit the fabless IC Design community in terms of cost, efficiency, maximizing shared resources and time-to-market for their design and products. Let us join hands and make this a success story for all,” said Ahmed Saad, CEO of Symmid Corporation.


Contact Efabless to find out more about Efabless or participating in the Chiplicity Design Partner Program.



About Efabless is the world’s first crowd-sourcing platform for semiconductors. Efabless’ customers connect with a community of design firms and professionals and receive formal quotes for custom mixed signal IC and IP solutions. Efabless then provides its IC design community with a cloud-based platform offering everything needed to execute the designs. This includes a design flow based on open source tools; a marketplace featuring IP and full reference designs; access to foundry processes and MPW services to get to prototypes. The entire offering is designed to eliminate the cost and administrative barriers that have inhibited IC design in general and custom IC design in particular.


Efabless is headquartered in San Jose, CA


For more information, visit



About Chipus Microsemiconductor

Chipus Microelectronics is a semiconductor company with proven expertise in the development of ultra-lowpower, low-voltage, analog and mixed-signal integrated circuits (ICs) and systems on chip (SoCs).


Relying on a strong experience in power management and data converters, the company has more than 200 IP mixed-signal blocks in process nodes from 40nm to 0.35um of various foundries. Since its foundation in 2008, Chipus has provided IC design services in leading edge technologies also, including down to 28nm and 10nm, with firm commitment and flexible client support to customers worldwide (USA and Americas, Europe, and Asia).


Headquartered in Florianópolis, Brazil, Chipus has a US subsidiary in Silicon Valley and sales team in Europe. Assuring quality standards, Chipus is ISO 9001:2015 certified.


For additional information on Chipus or its services, please visit:



About Sankalp Semiconductor

Sankalp Semiconductor offers an integrated portfolio of services and solutions to its customers in key semiconductor domains including digital, analog, high-speed physical interface IP, Embedded Memory Compiler and EDA modelling. Sankalp Semiconductor is a preferred semiconductor design service partner to multiple Fortune 500 companies in the Automotive, Consumer Electronics, Industrial IoT and Medical electronics space. The company enables its customers achieve their time-to-market window by delivering first time right silicon designs and engage with product engineering teams across the globe to design System-onChip. Sankalp Semiconductor is based in Sunnyvale, California, with offices in USA, India, Canada, Germany and Malaysia.



About Symmid Corporation

SYMMID is Malaysia’s premier IC design company that deliver the most comprehensive


ASIC/ASSP/FPGA/Analog mixed signal design/RF/High Voltage design services to meet customers’ needs (cost, time, quality). The company develops and supplies customer exclusive ASIC solutions for the automotive, industrial and consumer market. Symmid offerings range from a complete SOC implementation, custom circuit design, IP blocks, layout services and sign-off audits. It’s commitment to provide its customers the most comprehensive mixed signal design services using its local design team, and its extensive network of design partners, Symmid specialises in handling any special needs ranging from specialised IP blocks, filters, PLLs, power supplies, complete transceiver solutions, data converters, I/O blocks, PDK development and more. Symmid is ISO9001 and ISO27001 certified.



Contact Information


Jeff DiCorpo Efabless Corporation (408) 896-2078

IC Packaging: consumer solutions are adapted for automotive applications

“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.


Under this dynamic context, the market research and strategy consulting company releases a comprehensive technology & market report focused on advanced packaging solutions for automotive electronic components.


Titled, Trends in Automotive Packaging, this study identifies and analyzes the major platforms currently used in the automotive industry and points out technical trends related to LiDAR, CIS, radar, power and lighting devices, MEMS and sensors. Yole’s Semiconductor & Software team shares with you their advanced packaging knowledge applied to the automotive sector.


“For the first time, we clearly see packaging innovations for automotive components,” comments Emilie Jolivet from Yole. “Step by step, advanced packaging technologies initially developed for consumer purposes are implemented by Tiers 1 and 2. And the diversity of automotive components is a strong business opportunity for the advanced packaging companies.” Therefore, for the first time, the automotive industry is ready to accept consumer solutions, even for more dedicated applications like powertrain.




Based on the impressive growths of this industry (+7% for automotive sale – +15% for the electronics systems in automotive – And +20% for semiconductors in automotive…), Yole’s report highlights the attractiveness of this historic industry.


Automotive industry: where is advanced packaging implemented? What is the impact of regulations on these solutions? Who are the big advanced packaging big players? The Semiconductor & Software team from Yole invites you to discover the latest advanced packaging trends for the automotive industry.


Electronic devices are more and more common in cars and the number of electronic systems is also increasing. The quantity of electronics in a car has increased 2.5 times since the 90’s. In 2017, 26 cm² of semiconductor substrates was used in a car, while in 2023 Yole expects 35 cm². The four main trends empower the strong diversity of functions and so a large number of sensors, power supplies, communication chips, lighting components and processors that can either come from the consumer market or be especially developed for automotive.


“As an example, almost all OEMs have announced large investments or electrification plans of their fleet in the coming years,” comments Lauranne Chemisky, Technology & Market Analyst at Yole. “Impact of electrification should be first limited. Then, at long term, the story should be different. Automation and sensors guide innovation in the automotive industry, especially packaging solutions.”


This impressive increase in electronic devices integrated in vehicles will directly drive the packaging market. In 2017, the packaging for automotive total revenue was quoted at about US$3.7 billion. According to Yole, it will reach roughly US$7 billion in 2023. The automotive packaging industry is involved in many device types and thus in many packaging platforms: the largest volume growth appears in power module, high power discrete and CIS markets. From a revenue point of view, LED is showing the highest figure and in parallel, LiDARs has the highest growth…


Yole’s team identified five main application groups with very different needs and operating conditions: infotainment & comfort, powertrain, safety, lighting and connectivity. Electronic devices can be either specific to one application group (Example: LEDs for automotive lighting applications) or be part of several groups, but with specific specifications. MCUs is a good example for the safety and infotainment applications.


Packaging affects how, where and how long the device can function… Yole’s analysts identified a new era for automotive development that may accelerate the adoption of innovative packaging technologies. “At Yole, there are today significant demands for power applications,” explains Emilie Jolivet from Yole. “A second wave could be led by new advanced packaging needs like embedded chips and more computing on the edge.”


Figure 2: Automotive IC Packaging Roadmap

In addition, for the first time in history, a big effort is made to adapt consumer technologies to the automotive sector. Although the main platform in term of units is the WBBGA package, which represents half of the market, advanced packaging platforms such as flip-chip and fan-out are finding their place.


The next packaging innovation expected is embedded die in substrate for converter dies. Packages like QFN package, iBGA Package and ceramic packaging are also growing for specific applications like CIS, MEMS and power devices.


These results will be presented by Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea at the 20th Electronics Packaging Technology Conference (EPTC). This presentation will take place on December 5th at 4:00 PM during the Plenary Session 2, titled Packaging for next generation automobiles/autonomous vehicles. Make sure to attend this presentation and discuss with our expert. Feel free to visit also our team in the exhibition area (Booth #19).


A detailed description of the automotive packaging report from Yole is available today on, advanced packaging reports section. All the types of packages used in the automotive industry, in addition to technology roadmaps are well detailed in this technology & market analysis.