Blog

Semiconductor lithography equipment market: how megatrends are going to change the future

November 30, 2018, anysilicon

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the MtM industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big

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Sankalp wins STPI Highest Exporter Award – ITES

November 30, 2018, anysilicon

Bangalore, India – Nov 30, 2018 – Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, received the Software Technology Parks of India (STPI) award for being the Highest Exporter – ITES in the Hubli Region. Sankalp Semiconductor has consecutively fourth time won

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Samsung’s Big Semi Capex Spending Keeps Pressure on Competition

November 30, 2018, anysilicon

IC Insights revised its outlook for total semiconductor industry capital spending and presented its forecast of semiconductor capex spending for individual companies in its November Update to The McClean Report 2018, which was released earlier this month.
 
Samsung is expected to have the largest capex budget of any IC supplier again in

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MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC

November 30, 2018, anysilicon

Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.
 

 
HPC is highly intensive in terms of CPU activity and requires ever increasing levels of

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Efabless Launches the Chiplicity Design Partner Program Featuring Chipus Microelectronics, Sankalp Semiconductor and Symmid Corporation

November 28, 2018, anysilicon

SAN JOSE, CA — Efabless, a crowd-sourcing design platform for custom silicon, today announced the launch of the Chiplicity Design Partner Program. The program supports ASIC and IP design partners across multiple services provided by the Efabless platform in responding to requests and developing custom ICs for product OEM or

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IC Packaging: consumer solutions are adapted for automotive applications

November 23, 2018, anysilicon

“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.
 
Under this dynamic context, the market research

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