Monthly Archives: December 2018

DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019

IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published in January 2019.  Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organization (WSTS) through the year 2023.

 

 

Topping the chart of fastest-growing products for 2018 is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment over the past two years (Figure 1).  The 2018 DRAM market is expected to show an increase of 39%, a solid follow-up to the 77% growth in 2017. The number-one position is not unfamiliar territory for the DRAM market.  It was also the fastest-growing IC segment in 2013 and 2014.

 

 

dram market growth 2013 to 2019
Figure 1
Remarkably, DRAM has been at the top and near the bottom of this list over the past six years, demonstrating its very volatile and cyclical nature.  IC Insights forecasts that DRAM will rank nearly last in terms of market growth in 2019, with a 1% decrease in total sales.  After two strong years of growth, Samsung, SK Hynix, and Micron—the world’s three primary DRAM suppliers—have expanded their manufacturing capacity and are beginning to ramp up production, bringing some much needed relief to strained supplies, especially for high-performance DRAM devices. At the same time, shipments of large-scale datacenter servers, which were a primary catalyst for much of the recent DRAM market surge, have begun to ease as uncertain economic and trade conditions factor into decisions about continuing with the strong build out.

 

 

NAND flash joins DRAM as another memory segment that has enjoyed very strong growth over the past two years (Figure 2).  Solid-state computing, particularly, has been a key driver for high-density, high-performance NAND flash even as mobile applications continue to be a significant driver. Meanwhile, automotive and computing special purpose logic devices have also been strong performers the past two years.  The top five IC markets listed for 2018 are the only product categories that are expected to surpasses the 17% growth rate of the total IC market this year.

 
fastest growing ic markets
Figure 2

 

The full list of IC product rankings and forecasts for the 2019-2023 timeperiod is included in The McClean Report 2019, which will be released in January 2019.

 

Report Details:  The 2019 McClean Report
The 2019 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry, will be released in January 2019. A subscription to The McClean Report includes free monthly updates from March through November (including a 200+ page Mid-Year Update), and free access to subscriber-only webinars throughout the year.  An individual user license to the 2019 edition of The McClean Report is priced at $4,990 and includes an Internet access password.  A multi-user worldwide corporate license is available for $7,990.

As part of your 2019 subscription, you are entitled to free attendance at a McClean Report seminar (one seat for each copy purchased; company-wide licensees receive five free seats).  The schedule for next year’s McClean Report seminar tour is shown below.

 

Tuesday, January 22, 2019 — Scottsdale, Arizona
Thursday, January 24, 2019 — Sunnyvale, California
Tuesday, January 29, 2019 — Boston, Massachusetts

 

To review additional information about IC Insights’ new and existing market research reports and services please visit our website: www.icinsights.com.

 

More Information Contact

For more information regarding this Research Bulletin, please contact Bill McClean, President at IC Insights. Phone: +1-480-348-1133, email: bill@icinsights.com
PDF Version of This Bulletin

A PDF version of this Research Bulletin can be downloaded from our website at http://www.icinsights.com/news/bulletins/

 

Amkor Offers Optical Package Solutions for Multiple Applications

Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including LIDAR, fingerprint sensing, ambient light sensing and 3D facial recognition.

 

 

“Amkor has over 25 years of experience manufacturing and testing MEMS and Sensor devices for automotive, communications and consumer applications” said John Donaghey, Corporate Vice President, Amkor Technology. “We are excited to extend our high-volume MEMS and Sensor package platforms to address optical market requirements. This allows our customers to bring their solutions to market quickly without sacrificing performance.”

 

 

Amkor’s factories are IATF16949 certified and have the ability to meet the rigorous requirements of the AEC-Q100 specification.  Full turnkey Optical MEMS and Sensor solutions from Amkor include design, assembly and test.

 

 

To learn more about Amkor’s capabilities in Optical MEMS and Sensor packaging, visit Amkor.com/technology/optical-sensors/

 

 

This announcement is also available in ChineseJapanese, and Korean.

Credo selects Moortec’s In-Chip Monitoring IP to optimise performance and reliability in their latest generation of SerDes chips

Moortec, provider of complete In-Chip Monitoring PVT Subsystems announced today that Credo  has utilised Moortec’s Temperature Sensor and Voltage Monitor IP to optimise performace and increase reliability in their latest generation of SerDes chips.

 

Credo Logo

 

Credo offers high-performance, mixed-signal semiconductor solutions including advanced serializer-deserializer (SerDes) IP and interconnect solutions.  The company’s products are used to scale bandwidth and deliver end-to-end signal integrity in next-generation platforms requiring single-lane rate 25G, 50G, and 100G connectivity.

 

As a global innovation leader in high performance, low power connectivity solutions for 100G, 200G, and 400G port enabled networks, Credo has consistently broken through perceived technical barriers, delivering industry-leading speed, power and equalization.  Credo’s unique, patented mixed signal architecture is the foundation for its high performance, low power, connectivity chip solutions and robust SerDes IP offerings.  MoorTec’s PVT sensors are utilized in all Credo standard products which are being deployed on system OEM linecards and 100G per lambda optical modules which are enabling the next generation of datacenter, service provider, and enterprise networks.

 

“After a comprehensive investigation, we concluded that the PVT sensing fabric from Moortec was the best IP solution that can meet our wide range of high performance interconnect chip solutions and advanced process node IP requirements,” said Arshan Aga, Credo’s Vice President of Analog Design. “Moortec’s silicon-proven PVT sensors made for easy integration, which allows us to reduce time-to-market and project risk. MoorTec’s technical support was also very prompt and effective.”

 

 

Moortec VP of Sales, Naseer Khan said “We are delighted to be able to support Credo’s advances in SerDes technology with our highly accurate, highly featured temperature sensing and voltage monitoring IP”. Thermal and supply management is crucial in these kind of high bandwidth Serdes  architectures. Moortec’s monitoring IP is perfectly designed to address the sort of issues that can arise as a result of hotspots and drops in supply across the chip”.

 

About Credo

Credo is a leading provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high-performance computing markets. Credo’s advanced Serializer-Deserializer (SerDes) technology delivers the bandwidth scalability and end-to-end signal integrity for next generation platforms requiring single-lane 25G, 50G, and 100G connectivity. Credo makes its SerDes available in the form of Intellectual Property (IP) licensing on the most advanced process nodes and with complementary product families focused on extending reach and multiplexing to higher data rates.  Credo has offices in San Jose, Taiwan, Shanghai and Hong Kong.

 

For more information please vist www.credosemi.com

Press Contact:

Jen Peckham

jen.peckham@credosemi.com

 

About Moortec

Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the datacenter, consumer, automotive and IoT sectors.

 

For more information please visit www.moortec.com and follow Moortec on twitter and LinkedIn.

 

Moortec Semiconductor Ltd Press Contact:

Ramsay Allen

Moortec Semiconductor Ltd

ramsay.allen@moortec.com

+44 1752 875133

 

Faraday Reveals Its Multi-protocol Video Interface IP on UMC 28HPC

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The Multi-Protocol Video Interface IP solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and sensor interfaces, projectors, MFP, DSC, surveillance, AR and VR, and AI applications.

 

Faraday has been developing and providing video interface IP in UMC IP process nodes for more than a decade. The newly-launched 28nm multi-protocol video interface IP delivers an enhanced design architecture. Its transmitter (TX) design enables MIPI and CMOS-IO combo solutions for package cost reduction and flexibility in select applications; the receiver (RX) combo PHY includes MIPI, LVDS, subLVDS, HiSPi, and CMOS-I/O to support a diversified range of interfaces to CMOS image sensors.

 

“Faraday’s multi-protocol video interface IP solutions come with a high compatible and cost-effective MIPI D-PHY and its solid subsystem verified at the IP, system, and production level to minimize the risk in integration. Our optimized video interface IP and value-added services have provided our customers with a low risk system development path at the lowest cost with rapid time-to-market on their applications of display, image capture, projectors, and HUD,” said Flash Lin, Chief Operating Officer of Faraday.

 

Press Contact
Evan Ke
+886.3.578.7888 ext. 88689
evan@faraday-tech.com

Sales Contact
Find Faraday’s oversea office

 

 

About Faraday Technology Corporation

Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certified to ISO 9001 and ISO 26262. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, USB 2.0/3.1 Gen 1, 10/100/1000 Ethernet, Serial ATA, PCI Express, and programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China. For more information, please visit:www.faraday-tech.com or follow Faraday on LinkedIn

Beckermus Technologies Announces Partnership with Engage Photonics

Beckermus Technologies was founded in 1998 and serves as an Excellence Center in the field of “Bare Die” assembly services for micro-electronic and micro-optical systems. Beckermus Technologies has been playing a vital role in the lifecycle of many products, for numerous companies worldwide, from early prototypes to mass production.

 

We are now glad to announce, that Beckermus Technologies have partnered with Engage Photonics, an Optics Design House, specializing in micro-optical systems. Engage Photonics has been selected based on our long-term experience working with its Founder and CEO, Costa Gurgov.

 

The partnership enables Beckermus Technologies to offer the complete product lifecycle:

 

  • Requirements study and Optical Architecture
  • Proof of Concept and prototyping
  • Optical design, system design
  • Component selection and optical characterization
  • Optomechanical design, tolerancing and integration
  • Manufacture, assembly and test.

 

The cooperation creates one-shop-stop full turnkey solution that not only includes design to production in-house process but also offers ongoing feedback between the design team and the assembly team.

CoreHW releases IP library with over 200 IP

CoreHW releases an IP library with over 200 silicon verified IP. Silicon proven solutions allow fast end-product development and implementation. The IP library gives a comprehensive look to company’s IP range and makes it easier and faster for customers to start their ASIC design process.

 

The IP listed in the library are developed with several Silicon Foundries for various process nodes, for example: 22nm FDX, 40 nm CMOS, 130nm RFSOI and 180nm CMOS. Silicon IP include solutions for example for imaging, Bluetooth and IoT, WiFi, among other various application areas.

 

CoreHW offers several licensing model options: white box or black box, single use – multi use. Company also offers support in IP integration and customization.

 

Examples of the IP solutions CoreHW offers:

  • CorePLL, High Performance 6GHz synthesizer, Synthesizer for LTE Carrier Aggregation systems
  • High Resolution 16b SAR ADC for imaging solutions
  • RF Front End for Bluetooth and IOT solutions
  • Receiver for WiFi Front-End
  • High Efficiency DCDC system for Power management ICs
  • Tunable regulators, Band Gap references, Operational amplifiers, comparators, Level shifters, and Digital control and Interface IP

 

Full IP library is available at http://www.corehw.com/IP

 

Requests and more information:

Tero Kainulainen

tero.kainulainen@corehw.com

 

 

About the company:

 

CoreHW is a fabless semiconductor company established in 2013 in Tampere, Finland. CoreHW develops full custom RF, Power Management-, Data Converter and High-Performance Analog IC and IP. CoreHW high performance IP are optimized for low power consumption and small die area. We support you in the IP integration, verification, productization and possible customization. Both black box and white box licensing models are available. We offer design services for customers worldwide, with over 20 years of experience gained from leading communications companies and research hubs. We are passionate about exploring the possibilities of integrated solutions and dedicated to our customers. We believe these are the reasons we are one of todays fastest growing IC companies. If somebody can do it, it is CoreHW.