Monthly Archives: January 2019

VIS To Acquire GLOBALFOUNDRIES’ Fab 3E In Singapore

Vanguard International Semiconductor Corporation (VIS) and GLOBALFOUNDRIES (GF) today announced that VIS will acquire GF’s Fab 3E in Tampines, Singapore. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business. GF will continue to operate the facility through the end of 2019, providing a transition period to facilitate technology transfers for VIS and existing GF customers. Fab 3E currently manages a monthly capacity of approximately 35,000 8-inch wafers. The transaction amounts to $236 million USD and the transfer of ownership is set to be completed on December 31st, 2019.

 

VIS and GF have already reached consensus on the transfer of Fab 3E’s employees and customers. Both companies believe that employees are the most important assets of a company, so their interests should be put as the first priority during the transition–while ensuring no disruption to customers whose products are in production at the fab. Under this premise, VIS will extend employment offers to all employees currently working at Fab 3E, as well as continuously provide existing customers at Fab 3E with its foundry service, including MEMS customers.

 

“I appreciate the support of GF’s board and management team for this transaction, giving VIS an opportunity to continue expanding its capacity and reinforce momentum for future growth,” said Mr. Leuh Fang, Chairman of VIS. “Since its foundation, VIS has already had three separate experiences of successfully transforming a DRAM fab into a foundry fab. We believe this transaction is a win-win for both VIS and GF; and to VIS, it is also a decision that benefits all of our customers, employees, and shareholders. VIS will uphold its philosophy and principles to continue satisfying customers’ demands in capacity and technology, sustaining profitability and growth, and rewarding our shareholders.”

 

“This transaction is part of our strategy to streamline our global manufacturing footprint and increase our focus in Singapore on technologies where we have clear differentiation such as RF, embedded memory and advanced analog features,” said GF CEO Tom Caulfield. “Consolidating our 200mm operations in Singapore into one campus will also help reduce our operating costs by leveraging the scale of our gigafab facility in Woodlands. VIS is the right partner to leverage the Fab 3E asset going forward.”

 

VIS’s capacity has been fully utilized since 2018, and it is in the interests of its customers that VIS expands capacity to meet growing demands. The new fab is expected to contribute more than 400,000 8-inch wafers per year. This acquisition demonstrates the determination and commitment of VIS to accelerate capacity expansion.

 

 

About VIS

Vanguard International Semiconductor Corporation (VIS) is a leading specialty IC foundry service provider, founded in December 1994 in Hsinchu Science Park, Taiwan. VIS currently owns three 8-inch fabs with capacity of approximately 200,000 wafers per month. VIS offers a wide range of process technologies, including High Voltage, Ultra High Voltage, Bipolar CMOS DMOS (BCD), Discrete, SOI (Silicon on Insulator), Logic, Mixed-Signal. For more information, visit the company’s website: www.vis.com.tw

 

 

About GF

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog/mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Sankalp Semiconductor Appoints Abhijit Dutta as Head of Mixed Signal Solutions

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, has appointed semiconductor industry veteran Abhijit Dutta in the key position of the head of Mixed Signal Solutions. In this capacity, Abhijit will be responsible for mixed signal design services and head the Sankalp Kolkata Centre.

 

Abhijit has 32+ years of experience in the semiconductor industry with expertise in the design of automotive qualified ICs. Abhijit has worked with various organizations and has led various high performance teams in Cisco, Intel & NXP Semiconductor. Prior to joining Sankalp, he was heading the NXP Bangalore Design Center. Abhijit has Bachelor in Electronics (Radio Physics & Electronics) from Calcutta University.

 

“Abhijit’s brings extensive leadership and a deep understanding of engineering required for complex mixed signal design SoC” said Nagaraj Azhakesan, COO Sankalp Semiconductor. “His proven leadership track record of delivery will be instrumental in building and addressing the growing needs of customers for mixed signal design solutions and services.”

 

“I am delighted to be a part of team, Sankalp has been a proven leader for mixed signal solutions and services” said Abhijit Dutta, Head Mixed Signal Solutions, Sankalp Semiconductor. “My focus will be to work closely with customers and engineering teams to delivery high quality mixed signal solutions and services meeting customer schedules.”

 

Sankalp Semiconductor has executed multitude of complex digital and mixed signal SoC (System-on-Chip) projects for variety of its customers in Automotive, Consumer, Networking, Wireless, IoT, Medical, Foundry verticals. Sankalp Semiconductor was founded in 2005 with a focus to serve the semiconductor companies primarily offering analog & mixed signal design services. Today, Sankalp with a team of 950+ engineering professionals has design centers in Hubli, Bengaluru, Kolkata and Ahmedabad in India and Ottawa, Canada. The company provides unique advantage to its semiconductor customers by enabling them to engage at any point of semiconductor services life cycle with the ability to provide end-to-end solutions.

 

 

About Sankalp Semiconductor

Sankalp Semiconductor offers an integrated portfolio of services and solutions to its customers in key semiconductor domains including analog & mixed signal, digital, high-speed physical interface IP, Embedded Memory Compiler, IOs and EDA modelling. Sankalp Semiconductor is a preferred semiconductor design service partners to multiple Fortune 500 companies in the Automotive, Consumer, Networking, Wireless, IoT, Medical electronics and Foundry space. The company enables its customers to achieve their time-to-market window by delivering first time right silicon designs and engage with product engineering teams across the globe to design System-on-Chip. Sankalp Semiconductor is based in Palo Alto, California & Hubli, India with offices in USA, India, Canada, Germany, Malaysia and Japan. www.sankalpsemi.com

 

 

Contact Information:
Eklovya Sharma

Sankalp Semiconductor
marcom@sankalpsemi.com
+91 98790 48571 (Cell)

 

MosChip announces two acquisitions to strengthen Semiconductor Business Unit & CEO appointment

MosChip Semiconductor Technology, a Hyderabad-based leading Semiconductor & IoT technology company, has approved definitive agreements/arrangements for the acquisition of four companies, namely, Gigacom Semiconductor LLC, California, USA, Gigacom Semiconductor Pvt. Ltd, Visakhapatnam, FirstPass Semiconductors Pvt. Ltd, Hyderabad, and Institute of Silicon Systems Pvt. Ltd, Hyderabad. MosChip is making these acquisitions as part of the company’s growth plans to offer the full suite of skillset and expand business geography. Gigacom Semiconductor LLC is a six-year-old company focused on IP development and licensing apart from Mixed Signal Design Services. It has strong customer relationships with top-tier companies for both design services and IP licensing. Moschip will benefit immensely from the silicon-proven IP and Silicon Valley presence. Gigacom Semiconductor Pvt. Ltd is a six-year-old company primarily serving USA and India based customers in the Physical Design and Analog Layout space. FirstPass Semiconductors Pvt. Ltd. is an eight-year-old, well-established company serving multiple customers in Design Verification, Physical Design, and Analog Layout space. It serves both India and USA based customers. Institute of Silicon Systems Pvt. Ltd. (ISS) is a reputed player in the training space and trained more than 800 engineers in Physical design and Analog Layout in the past eight years. The acquisition helps in recruiting & grooming talent pool along with revenues.

 

“These acquisitions will help MosChip add nearly 250+ talented engineers to its global headcount and expand footprint in North American region. MosChip will also get access to high-speed serial interface IP (SerDes) which has become a key building block for any system-on-chip (SoC) development, making MosChip one of the few companies with production capabilities with leading fab relationships.” MosChip founder Ram Reddy said in a statement.

 

He further added, “These acquisitions will bring in synergy through mixed-signal intellectual property (IP) focus with proven expertise in physical design and analog layout, offering a full suite of design services, enhancing talent acquisition funnel through training, better access to top-tier customers and improved operational efficiency.”

 

The acquisitions will come into immediate effect, subject to all necessary approvals. Moschip is also pleased to inform the appointment of Mr. Venkata Sudhakar Simhadri as the CEO with effect from 24 July 2018. The Board also proposed to appoint him as Managing Director of the Company after obtaining the Central Government approval. Venkata is a serial entrepreneur and proven executive in the semiconductor industry. He is the Founder, President & CEO of Gigacom Semiconductor LLC & Founder / Director of Gigacom India (which are under acquisition by MosChip) and the driving force behind establishing IP licensing and design services business with leading semiconductor companies. Earlier to Gigacom, Venkata was the Founder, President & CEO of Time-to-Market (TTM) from 1998 till its acquisition by Cyient in 2008 and was its head of Hi-tech Business Unit till 2012. Venkata has 30 years of experience, primarily working in the USA and India region. He did his BE. from Andhra University and MS from New Jersey Institute of Technology (NJIT).

eSilicon Announces Technical Advisory Board

eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the formation of a technical advisory board (TAB) focused on guiding the company’s development work associated with artificial intelligence ASICS. Members of the TAB include Dr. Dileep Bhandarkar, Dr. Michael Orshansky and Dr. Mattan Erez. The TAB will be led internally by Patrick Soheili.

 

Dr. Dileep Bhandarkar is an independent datacenter technologies and neural network consultant and is the TAB chairperson. Prior to becoming an independent consultant, Dr. Bhandarkar was the vice president of technology at Qualcomm. Prior to Qualcomm, he was a distinguished engineer at Microsoft and director of architecture at Intel. He has also held positions at Digital Equipment Corporation and Texas Instruments. Dr. Bhandarkar holds a B. Tech. in EE from the Indian Institute of Technology, Bombay and a PhD in EE/Computer Science from Carnegie Mellon University. He is an IEEE fellow.

 

Dr. Michael Orshansky is a professor and John E. Kasch faculty fellow at the Department of Electrical and Computer Engineering, University of Texas at Austin. Dr. Orshansky received his BS, MS, and PhD degrees in Electrical Engineering and Computer Sciences from the University of California, Berkeley. His recent research is on approximate computing for on-chip machine learning acceleration. Prior to joining UT Austin, he was a research scientist and lecturer with the Department of EECS at UC Berkeley. Prior to moving into academic research, Dr. Orshansky was an early employee at eSilicon. He is an IEEE fellow.

 

Dr. Mattan Erez is a professor and a Temple Foundation faculty fellow at the Department of Electrical and Computer Engineering at the University of Texas at Austin. His research focuses on improving the performance, efficiency, and scalability of computing systems through advances in memory systems, hardware architecture, software systems, and programming models. His current focus areas are architectures for machine learning, large-scale and high-performance computing, and memory systems. Mattan received a BSc in Electrical Engineering and a BA in Physics from the Technion, Israel Institute of Technology and his MS and PhD in Electrical Engineering from Stanford University.

 

Patrick Soheili is vice president, business and corporate development at eSilicon Corporation. He is responsible for eSilicon’s worldwide business and corporate development activities, with a specific focus on artificial intelligence. Mr. Soheili has been president and CEO of On Demand Microelectronics, Cradle Technologies and Softcoin. He was a founding partner of Barrington Partners, a technology-focused venture capital firm. He has also held positions at Invox Technology, Altera Corporation, AMD and TRW. Mr. Soheili holds a Bachelor of Science in Mathematics from University of California, Santa Barbara and a Masters of Business Administration from Purdue University.

 

“The artificial intelligence field is rapidly evolving. Deploying ASIC technology to support AI accelerator development presents many challenges,” said Patrick Soheili. “The eSilicon neuASIC™ platform provides AI-specific IP and an architecture to address these challenges. I welcome the addition of our world-class TAB to help ensure we hit the mark for the dynamic and growing AI field.”

 

To learn more about eSilicon’s 7nm neuASIC IP platform or to inquire about access to the platform for design, visit eSilicon’s neuASIC web page or contact your eSilicon sales representative directly or via sales@esilicon.com.

 

 

About eSilicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com

New Online Tool by HardwareBee Helps Engineers Select Between FPGA and ASIC Technologies

HardwareBee, a leading online electronic design marketplace, today announced a new tool that helps engineers make quicker and more accurate decisions on whether to choose FPGA or ASIC technology in their electronic product. The online tool enables analyzing and comparing the costs of each of the technologies based on the target application and making more informed decisions.

 

In today’s market, where FPGAs increasingly provide wider and broader capabilities and ASICs are becoming more accessible in lower production volumes, developers are often unsure which technology to select for their product. The new tool helps engineers to clearly evaluate the overall costs of each technology, starting from the design phase and all the way to volume production.  

 

The free new tool is available online at http://hardwarebee.com/fpga-vs-asic-calculator/

 

About HardwareBee

 

Founded in 2017, HardwareBee is an online marketplace linking electronic design service providers and companies in search of development services. Using HardwareBee, companies can easily find electronic development and production vendors anywhere in the world with specific domain expertise that matches their needs. The site covers electronic design services, FPGA design services, embedded software companies, PCB layout services, PCB assembly & manufacturing services, and turnkey service providers.

CEO Talk: Dr. Phil Troyk, Sigenics

This interview was held with Dr. Philip Troyk, CEO at Sigenics.

 

 

 

Tell me a bit about your background? How did you first get started with Sigenics?

 

 

I was, and am, a university professor and I saw a need for a custom semiconductor company that could serve the research and commercial electronics industry for application-specific-integrated-circuits (ASICs) which did not have the normal high-volume sales.

 

 

Tell me about Sigenics?

 

Sigenics designs and produces custom integrated circuits for customer specific applications.  What is unique about Sigenics is that we can not only produce the ASIC designs, but we can deliver tested production ASICs.  We serve the aerospace, medical, and commercial electronics sector.  Many of our ASICs are used in commercial aircraft that we all use for travel, everyday.

 

 

When did you start Sigenics? What were you doing before that?

 

Sigenics was started in 2000.  Prior to formally creating Sigenics, I was engaged in university research for several government agencies.  My two business partners and myself had worked together on a several custom ASIC designs for the military and emerging-product commercial sector.  The timing seemed ideal to expand our exposure to industry ASIC needs, by formalizing our combined talents in a company.  We sought to create an organization with high-level design capabilities, combined with the capacity to meet customer production needs.  In some ways, our motivations in forming Sigenics were like those of the early pioneers who formed semiconductor companies.

 

What problem did you see that needed to be fixed? What is your approach to solving that?

 

 

Many companies and funding agencies need access to high-level ASIC designers and a pathway to being able to procure production ASICs. We combined these two needs in structuring Sigenics to be a turn-key ASIC provider.

 

 

How was the role/offering of Sigenics changed during the recent years?

 

 

Customers are often unsure about ASIC design methods, and even what portions of their systems can be placed on an ASIC.  We have developed an extensive team-based interaction process with the customer to guide their decision process and produce the optimal ASIC.  We have shifted to placing significant emphasis, up-front, in working with the customer to identify and quantify their needs.  This shortens the design cycle and makes physical ASICs available to the customer at an earlier stage in product development.

 

Which market segment seems promising to you? And why?

 

Innovative new product ideas from established companies, startups, and research projects, that can benefit from custom ASICs in ways which cannot be served by off-the-shelf components.  We sometimes say: “If it’s easy, you don’t need us.”

 

 

What is a typical customer for Sigenics?

 

Our customers typically know they have a need for improving performance and miniaturizing their electronics.  However, they are unsure, and apprehensive, about cost and timelines for ASIC design.  We guide the customer to a solution that is optimal for their application.

 

Customers are focused on time-to-market, first-time-right, price, etc. Do you see a change in customer behaviour in recent years? Where is the focus today and why?

 

Often projects are typically planned over a period of months with the customer’s engineering and project planning staff.  However, there seems to be a trend towards delay of starting those projects by the customer’s management.

 

What are the 3 top things you wish your customers would do better (or different)?

Typically the customer has appropriately determined that a custom ASIC is an ideal solution. My advice to our potential customers is: 1. Realize that apprehension about proceeding with a modern ASIC solution may result in retaining a larger, and less optimal, discrete component solution.  2. Consider that the sooner a pathway to using ASICs is defined, the faster the customer can move ahead of the competition.  3. Realize that waiting for the “better future moment” for using ASICs most often creates delays that places the customer at a market disadvantage, and makes the future entry into using ASICs more expensive.

 

What is the best moment in your day?

 

Sigenics’ best moments are when we all see the engineering solution we have devised actually function on the bench.  It is a moment of extreme satisfaction about using our technological knowledge to conquer a problem.

 

How do you keep yourself energized and engaged during the day?

 

The Sigenics’ engineers and staff do that for me.  We never suffer from a workday that drags on.  Most often we are surprised when it is time to leave for the day.

 

What is your preferred lunch discussion topic?

 

Often our work problems spill over into lunch, but we try to shift towards learning about each other, our families, and our lives.  Sigenics has a very low employee turn-over rate because we all work to create an environment that we all love.

 

How do you spend your time outside working hours?

 

It might sound dull, but often phone calls and thinking about the current challenging technical problems are never too far away from my thoughts.  When you love the work you do, it is not work; it is a passion for achievement.  Being with family, watching old movies and discussing the current state of world affairs helps to create the needed distractions.

 

Where can one find more information?

 

To learn more about our company you can visit us at www.sigenics.com or on Sigenics’s profile page on AnySilicon.