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Short Guide to Selecting IC Package

March 29, 2019, anysilicon

BGA

Semiconductor integrated circuits (ICs) are an essential component of every other modern technology which is why they have undergone some of the most extensive growth. Today, IC packaging offering is wide and deep with many kinds and types of semiconductor packaging technologies.  Your goal is, therefore, to select an IC

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Sankalp Semiconductor Expands International Operations in Japan

March 28, 2019, anysilicon

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today announced that it has appointed industry veteran Hisaya Keida in the key position as the Head of Japan. In this capacity, Hisaya Keida will manage sales operations and enable Sankalp’s presence in the

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SCALINX expansion continues with ASIC design center in Caen, France

March 22, 2019, anysilicon

SCALINX, industry recognized expert in new art of signal conversion technology, embedded in ASIC designs, has continued with its expansion plans and growth of its engineering staff in Caen design facility, which was opened in July 2018.
 
“The growth of the engineering staff in our design center Caen will

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SoC Clock Domain Crossing – An Important Problem

March 20, 2019, anysilicon

Sometimes, when crossing clock domains, synchronizers are just not enough.
 
Imagine sending data serially over a single line and receiving it on the other side from the output of a common synchronizer as shown bellow.
 

Assuming one clock cycle is enough to recover from metastability under the

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Moortec Subsystem Overview Whiteboard [Video]

March 20, 2019, anysilicon

In the second of a series of new whiteboard videos, Moortec CEO Stephen Crosher explains the benefits of using Moortec’s highly accurate, highly featured modular PVT monitoring subsystem for advanced node designs in terms of increasing device reliability and optimising performance.
 
 

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Number of 300mm Semiconductor Fabs Expected to Reach 121 in 2019

March 20, 2019, anysilicon

IC Insights recently released its Global Wafer Capacity 2019-2023 report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2023. The newest edition of the Global Wafer Capacity report shows that 300mm wafers took over as the industry’s primary wafer

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