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Sankalp Semiconductor to Exhibit at ChipEx – 2019

May 06, 2019, anysilicon

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at ChipEx on May 13th in Tel Aviv, Israel. Sankalp Semiconductor’s booth will be displaying the company’s capabilities in digital, analog and mixed signal, custom layout, standard cell development, IO solutions,

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Comcores and DENSO AUTOMOTIVE Deutschland GmbH test TSN Ethernet for Automotive Applications in the Research Project EMPHASE

May 06, 2019, anysilicon

Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP) has entered into an agreement supplying DENSO AUTOMOTIVE Deutschland GmbH with time sensitive networking (TSN) Ethernet IP for EMPHASE research project.
 
The project aims, among others, to research reliable, reconfigurable and intelligent E/E architectures, processing platforms, and sensor

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Moortec Provide Embedded Monitoring Solutions for Arm’s Neoverse N1 System Development Platform on TSMC 7nm Process Technology

May 02, 2019, anysilicon

Moortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP). As market leaders, Moortec supported integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge

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1Q19 Registers the 4th Largest Sequential IC Market Decline on Record

May 01, 2019, anysilicon

IC Insights will report on and examine the 1Q19 worldwide IC market results in its May Update to the 500-page, 2019 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry next month.
 
From 1Q84 through 1Q19 there have been 141 quarters, and only seven of them registered an

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