46 results found See AllSend Email to All
Israel
ICleviathan is an multi national IC supply chain company. Established in 2005. Our company specializes in the management of customers’ IC operations throughout the entire IC flow cycle. Our customer base includes, start-ups, system companies and Defence companies.
IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
View vendor pageSwitzerland
Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
View vendor pageGermany
Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.
IEEE 802 Data Center and Wireless FEC , OpenZR+/ Open ROADM oFEC 800GbE, SDA, ITU High-Speed Optical Communication IP Cores, Full ETSI DVB-S2X Wideband Transmitter and Receiver, AWGN Channel, 3GPP Mobile Communications
View vendor pageCanada
Comport Data offers analog, mixed-signal and digital IC design, layout, testing and manufacturing using CMOS, BiCMOS and Bipolar technologies and processes.
Mixed-Signal ASIC Designs Portfolio, ASIC Design, ASIC Testing, Products, Comport Data, Comport Data Contact Form
View vendor pageGermany
RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.
Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
View vendor pageWafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
View vendor pageSecuryzr iSE, Digital TRNG, Digital PUF, Software Crypto Library, Digital Sensor – Smart Monitor powered by AI for Cybersecurity, Active Shield, Cyber Escort Unit, Hash Function, Cipher Function, PKC-RSA/ECC, Memory Ciphering
View vendor pageUSA
ACE provides high quality advanced level FIB circuit editing, Dual-Beam imaging and atomic resolution TEM analytical services.
USA
IC Failure Analysis Lab is a full-service provider of Failure Analysis and Qualification services to Semiconductors, Medicals, Telecommunications, and Automotive companies.
Failure Analysis, Reliability and Qualification Testing
View vendor pageThe Netherlands
Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.
PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules
View vendor pageUSA
EAG's Microelectronics Test and Engineering team provides semiconductor and electronics design firms with test, debug, and early engineering support for new product introduction.
ATE Test and Engineering, Burn-In & Reliability Qualification Services, ESD Testing & Latch-Up Testing Services, PCB Design & Assembly Services, FIB Circuit Edit and Debug Services, Failure Analysis Services
View vendor pageThe Netherlands
Eurofins MASER is an independent engineering service company. Since 1993 we have offered Reliability Test and Failure Analysis Services to the semiconductor and electronic systems industry.
Reliability Test, Failure Analysis
View vendor pageUK
NanoScope is a European Focused Ion Beam Technology and TEM Microscopy service provider.
Failure Analysis, Circuit Nano-edit, Reliability Testing, FIBxTEM Analysis
View vendor pageUSA
Our core focus is to provide customers with semiconductor IC testing services they need. Such as ESD & LU testing, Burn-In & Product Reliability, Package Qualifications , Test Hardware and Manufacturing and ATE testing.
IC Qualifications for ESD, Burn-in product, process, Reliability Qualification capability and capacity, Device Package Qualification Services including Preconditioning, Engineering and Hardware capabilities, IC Package Failure Analysis
View vendor pageUK
Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.
Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting
View vendor pageCanada and USA
XtremeEDA, founded in 2002, is a North-American based provider of design and verification services for the semiconductor industry.
Security & Encryption, Standard Interconnect and Communication Protocols
View vendor pageWith the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. Recently, the trend has been to look into the use copper wire. However, there are many drawbacks to using copper wire, including the short shelf ...
Kaiserslautern, Germany – July 31, 2025 – Creonic GmbH, the leading provider of cutting-edge communications IP cores, announces the release of Version 6.0 of its DVB-S2X Demodulator IP core. This major update introduces powerful enhancements that expand the configurability and technical performance of one of Creonic’s most mature and widely ...
Silicon Valley, CA (Feb 9, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the successful implementation of a high accuracy fiber array waveguide attachment system focused on the Silicon Photonics market. This latest set of tools is based on the double-sided HexNano ...
Creonic’s DVB-S2 and DVB-S2X IP cores now include support for the new DVB-NIP standard on physical layer — an important step toward seamless integration of satellite and IP-based network technologies. The DVB-NIP standard is designed to facilitate the native transport of IP over satellite networks, extending the capabilities of DVB-S2X by streamlining packet-based data delivery. With ...
Palo Alto, CA - 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform ...
Introduction to Semiconductor Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors. Doping ...
The richest directory of ASIC/IC FIB services worldwide. Find the IC FIB services companies that matches your needs.
Overview of Silicon-Germanium (SiGe) Technology and Historical Development Shockley's early transistor game most likely inspired the notion of fusing silicon (Si) and germanium (Ge) to create an alloy for use in transistor engineering. However, this concept has just become a reality in the last 15 years due to the challenges associated ...
One of the leading manufacturers of automatic test equipment, Advantest has proven to be one of the leading lights in the semiconductor industry. In addition, they manufacture measuring instruments that are used in the creation of electronic system. You can find Advantest products used in the creation of digital consumer ...
Try our free service and get free vendor
quotes, while remaining anonymous.
No thanks. Let me keep searching.