Top 10 Semiconductor Sales Leaders 1993-2021

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IC Insights’ 2Q Update to The McClean Report 2022 will be released in May. It presents an analysis of the marketshare of the major semiconductor suppliers excluding the pure-play foundries (Figure 1).  While there is a small amount of double-counting effect due to the IDM foundry revenue included in the figures, it is

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2016-2022 Semiconductor Wafer Capacity Trends

IC Insights’ February 1Q Update to The McClean Report 2022 includes an overview of IC industry capacity and wafer start trends from 2002 through 2026.  This bulletin provides a brief summary.
The volatile nature of the IC industry is reflected by large swings in annual wafer starts.  Over the past five years, for

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MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm

Santa Clara, CA, – April 18, 2022 – MosChip Technologies, a semiconductor and system design services company, unveils today  enhanced simplex High Speed Serial Trace Probe (HSSTP) PHY macro with link layer supporting  data transfer capabilities of up-to 12.5Gbps per lane in 6nm FinFET technology. MosChip has over a twenty-year track

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Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development


Faraday Technology Corporation (TWSE: 3035), leading ASIC design service and IP provider, today launched SoCreative!VI™ A600 SoC development platform implemented in Samsung Foundry’s 14LPP FinFET process technology. This platform is equipped with Faraday’s A600 SoC chip on an evaluation board and the Linux software development kit (SDK) to create a full-performance system

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ATS Engineering and ChipTest Announce Strategic Collaboration for Test Program Development for Advantest’s customers

Tel Aviv, Israel – March 24, 2022 – ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS

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Introduction to System in Package (SiP)

System in Package (SiP) is a method used for bundling multiple integrated circuits (ICs) and passive components into a single package, under which they all work together. This contrasts to a System on Chip (SoC), whereas the functions on those chips are integrated into the same die.


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