ASIC Verification
In order to ensure how an ASIC will actually perform as a manufactured device, ASIC verification and simulations need to take place for the sustainability of functions in the device. ASIC verification can take on many different forms and depending on the type of designer, EDA tools or technology type; ASIC verification can be straight forward or much more complex. One or many forms of verification is essentially used to measure, test and validate design functionally and robustness.
Functional verification is one of the more popular methods for ASIC verification: functional verification essentially answers the question of does a proposed ASIC design actually do what it is supposed to? This means that the company has to first develop part of the ASIC or a number of different blocks within the ASIC and then run functional verification to which is verify proper functionality of the ASIC. Usually this requires a simulation environment with input vectors as well as outputs to measure for anomalies. Simulators and drivers will play certain stresses on the ASIC functions and the monitors will record metrics based on the performance of the device.
Even with all of these other forms of verification ASIC engineers often have to submit formal verification especially if a device will be entering mass production. In this form of verification engineers will have to prove or disprove the correctness through mathematical algorithms. This verifies the design of the chip in a formal proof. This ensures that the ASIC device functions both theoretically and physically.
See here a list of ASIC verification companies:
SystematIC- Custom ASIC Design, Turnkey (Supply chain Services), Sensor Interfacing, Integrated Power, High Voltage Expertise Analog IP Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs Mixed-Signal ASIC Designs Portfolio, ASIC Design, ASIC Testing, Products, Comport Data, Comport Data Contact Form Circuit Design, Product Development, Memory products, IP and consulting, Test Consulting IP Provider, IO Design, Consulting and testing services Low Voltage ESD/EOS protection (up to 5V), HV/BCD EOS/ESD protection (5V and higher), LIN PHY (transceiver) , Programmable Clipping Circuit for Antenna pins, Power-on-Reset Circuit, Radiation Hard, ESD robust Level Shifters Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services IP Customization—System Design—Consulting Forward Error Correction, Voice & Data Compression, Security, Telecom DSP, Communication Protocols & Networking, Baseband PHYs ASIC Design, ASIC Production Testing, Measurement Systems GaN Gate Driver, SiC Gate Driver Lower Your Product Costs, Reduce the Size of your Existing Design, Protect Your Intellectual Property, Protect Yourself from Product Obsolescence, No Minimum Volume or Financial Restrictions Animal ID, Immobilizer, Access Control, NFC, Customized ASIC and System Design Services, IP Iicensing RTL Design and Verification, Analog Circuit Design and Custom Layout, PD, STA and Synthesis, Design for Test (DFT), Silicon Project Management Tool Turnkey Services, Off-shore Design Centre (ODC) Project Services, ODC Design Augmentation Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials Embedded security IP solutions Security Enclave, Protocol Engines, Crypto Accelerators, Memory Protection Foundry Services, Custom Foundry Services, Full Turnkey, In House Assembly and Test Development, In-house Qualification and Failure Analysis Services, In House SiP: System in Package, Foundry Process Longevity Turnkey ASIC, Turnkey Custom Silicon Production, New Product Introduction (NPI), ASIC Design Services, Embedded & Application Software, System Design & Validation Full turnkey, ASIC Definition, Custom IC and ASIC design, Prototype Manufacturing and Evaluation, ASIC Industrialization, Supply Chain Management ASIC Services, Mixed Signal Services, Spec-in / Turnkey Services High Speed Serdes solutions, High end, high speed ADC/DAC, Low-Power, Cost-Effective 8- and 16-bit MCUs, Video, Image & Data Compression, MIPI, RF Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services Turnkey ASIC Design, IP Blocks Design, Radioelectronic Devices Development RF Transceivers, PLL, ADC, Process, Voltage and Temperature Sensors (PVT sensor/detector/controller), RFID (UHF tag, ID card, NFC, medical implants), Energy harvesting (power converters from RF-field to voltage and current) System Architecture Definition , IP & SoC Verification, Design, Synthesis and Backend , SoC Post Silicon Validation AES SX-DPA-FIA IP Core – DPA- and FIA-Resistant Balanced FortiCrypt AES IP Core, AES XP-DPA-FIA IP Core – DPA- and FIA-Resistant Ultra High Bandwidth FortiCrypt AES IP Core , AES ULP-DPA-FIA IP Core – DPA- and FIA-Resistant Ultra Low Power FortiCrypt AES IP Core, AES UC-DPA-FIA IP Core – DPA- and FIA-Resistant Ultra Compact FortiCrypt AES IP Core, FortiCrypt Library – Advanced DPA- and FIA-Resistant Software Library, HMAC-SHA2-DPA-FIA IP Core – Advanced DPA- and FIA-Resistant FortiMac HMAC SHA2 IP Core, FortiMac library – Advanced HMAC SHA2 DPA- and FIA-Resistant Software Library Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing Logic Families, Analog Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform 0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI) Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service Analog-to-Digital Converters, Digital-to-Analog Converters, Temperature, Voltage, and Process Monitors, Ultra-Low-Power IoT IP Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design Column ADC Patent, Extensive IP Library ASIC Design, Package Design PLL Synthesizers, Front-End Modules (Transmitters, Receivers, Transceivers), Voltage Controlled Oscillators (VCOs), Power Amplifiers (PAs), Low Noise Amplifiers (LNAs), Bandgap Voltage Reference (BGR), Voltage Regulators, Analog to Digital Converters (ADCs) Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems Testing, Qualification & Reliability , Failure Analysis , mmWave Automotive / 5G Device Testing – Up to 81 GHz IP Integration Microcontrollers and Processors, Video and Image Compression, Data Compression, Interconnects and Interfaces , Peripherals and Controllers , Security Design Verification, Physical Design , Design for Test (DFT) , Analog Design , Turnkey Final Test and Wafer Sort Solutions , Embedded Services Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly Analog Circuit Design, Integrated Circuit Layout, Digital Design (RTL Design) and Verification, Digital Physical Design, Full Custom ASIC Design Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics IP Library CC EAL5+ certification of customer chips, Secure personalization of customer chips TESIC RISC-V CC EAL5+ Secure Element, TESIC CC EAL5+ Secure Element IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation Semiconductor Wafer Foundry Services, Custom Silicon Solutions (Technology Development & Commercialization Services), Custom Foundry Technology Ports 0.18um Design IP ASIC Design, ASIC Production, ASIC Production Management, Replacement of Obsolete Components Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner RFID analog front-end IP Licensing, Mixed-Signal ASIC Design and Customization HomePlug Green PHY Powerline Communication (HPGP PLC) for Electric Vehicle (EV) Charging System and Automotive, ZigBee Wireless at 2.4GHz, Sub-Gigahz RF Transceiver (programmable 400MHz – 1GHz) A to Z ASIC design services, Custom and Standard IP development HDMI2.1/DisplayPort1.4/eDP1.4 TX Combo-PHY, HDMI2.1/DisplayPort1.4/eDP1.4 RX Combo-PHY, USB4.0/DisplayPort2.0 Combo-PHY ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield Mixed Signal CMOS, Rad-Hard Microelectronics, Power Management Discretes and ICs, Interposers & Advanced Packaging Solutions, Custom Foundry Solutions Test Design & Development, Probe Card & Loadboard Design and Fabrication, Socket & Pin Solutions, High Volume/Low Mix or High Mix/Low Volume Testing, Backend AOI, Bake & Pack Services, IR4.0 Smart System Automation Smart Integrated Power, Wireless Communications, RF-Energy, Characterization and Testing, EDA, Consultancy and Training Services, Supply Chain Management, Certifications Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive) Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign Analog IP Cores, Digital IP Cores IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors RTL2GDS2, Functional Verification, Frontend Design, Backend Design, Embedded Systems Design ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator IC Design Services, IP Development, RFID, Design Tools, Technologies, System Design Radio Frequency Identification (RFID), Power Management, Medical Microelectronics, Data Conversion Advanced ASIC Development, New Product Introduction (NPI) Engineering, High Volume Manufacturing (HVM) Enablement HBM3 PHY & Controller, Non-Coherent Network-on-Chip (NOC), Coherent Network-on-Chip (NOC), DDR5/4 PHY & Controller, Die-to-Die (D2D) Interconnect, Analog & Configurable I/Os SoC Verification, System Development V-by-One PCS Rx IP Core , JESD204B PCS Rx IP Core, JESD204B PCS Tx IP Core, PCS IP Core, MIPI CSI2 Tx IP Core, HDMI v1.4 Transmitter IP Core TSMC 55/65nm I/O Library, TSMC 12/16nm I/O Library, TSMC 22/28nm I/O Library, TSMC 180nm I/O Library, GlobalFoundries 55/65nm I/O Library Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package Design Service, Layout Implementation and Verification Service, Pre-Silicon Validation Service, ASIC Testing Service Low-Power Low-PhaseNoise VCO 1.5-1.9 GHz Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation Power Management, Data Converters, Clock Management, Sensors , Front Ends Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies ASIC Design, Test and Characterization, Methodological support for IC designers, fabs, and IP vendors, Laboratory Equipment ASIC Design, Feasibility Studies, Advanced Packaging, Serial Production RF-Analog SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP SoC Design, Supply Chain Management, ASIC Services, FPGA Design Processor IP, Digital and Analog IP Custom Analog Mixed-Signal ASIC Solutions, ASIC, SoC, FPGA Design Services, Design Verification, Silicon Validation, IC Design Services, DFT Services Microcontrollers and IDE solution, Custom Memory IP and I/Os, DDR3/DDR2 Memory Controller, 3D Graphics Processor for Wearables/IoT, Gigabit Ethernet PHY Cores, Wired and Wireless Connectivity Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services Design Services Standard Cells Libraries, TCAM & CAM, SRAM & ROM, Custom PDK and PCELL, Register Files Integrated Security Services Platform (iSSP) – Securyzr iSSP, Post silicon security evaluation tool - Analyzr, Software security evaluation tool - Catalyzr, Pre-silicon security evaluation tool - Virtualyzr, Support to Certification, Evaluation as a Service Securyzr iSE, Digital TRNG, Digital PUF, Software Crypto Library, Digital Sensor – Smart Monitor powered by AI for Cybersecurity, Active Shield, Cyber Escort Unit, Hash Function, Cipher Function, PKC-RSA/ECC, Memory Ciphering DisplayPort 1.4a Transmitter, DisplayPort 1.4a Receiver, Display Stream Compression (DSC 1.2a) Encoder, Display Stream Compression (DSC 1.2a) Decoder ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality High-Voltage IP Cores, Analog IP Cores , Digital IP Cores MMIC Design and Productization from DC to 90 GHz, RF/Microwave Module/Sub-system Design and Productization Wideband and Narrowband GaN Power Amplifier MMIC, Wideband and Narrowband GaN Driver Amplifier MMIC, Wideband and Narrowband GaAs Driver Amplifier MMIC, GaAs Switchable RF Filter MMIC, GaAs SPDT SWITCH MMIC, GaAs Voltage Variable Attenuators (VVAs) MMIC Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital Leading Edge Solutions, Advanced Technologies, Base Process Technologies, Market Specific Leading Edge Technology 16nm/12nm, 10nm, 7nm, 5nm, Leading Edge Technology 40nm, 28nm, 20nm, Advanced Technology 65nm, 90nm, 0.13um, Application Specific Solutions, Packaging, Testing Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing General-Purpose I/O (GPIO), ESD Protection , High-speed I/O, Memory Interfaces, Special Advanced Logic - 40nm, 65/55nm, Mature Logic - 90nm, 0.13um/0.11um, Mature Technology 0.18μm, 0.35μm, Non-Volatile Memory, Analog/Power, Turnkey Services Advanced Technology 40nm, 28nm, Advanced Technology 90nm, 65nm/55nm, Mature Nodes, Speciality Technology MS/RF, NVM, HV, Test Services/Package Solution RTL Design, Verification, Analog Layout, Physical Design, System Engineering, Embedded Software/Firmware Custom SerDes, ARM HSSTP PHY with Link Layer, PCIe PHY, XAUI PHY, CEI SR PHY, SATA PHY ASIC/SoC Design and Implementation, Analog, RF & Mixed signal, Turnkey Manufacturing, Design Conversions Analog Circuit Design, Digital & Mixed Signal Design, Verification, Concept to Silicon Analog Design & Layout, Mixed-Signal IC Design and Layout, RF-IC Design & Layout, Digital IC Design, Synthesis & Layout, IC Verification & Characterization, IC- Production Test 1Msps, 18bit SAR ADC, 8GSPS, 12bit ADC, UV-LED Driver, 500V galvanic isolation, Digitally controlled frequency synthesizer for 24GHz radar, 4GHz Impulse-Radio Ultra-Wideband Transceiver ASIC and SOC design, Silicon IP licensing, Ultra low-power 2.4 GHz transceiver for Bluetooth Smart & IoT, Ultra low-power icyflex® processors ATE Test and Engineering, Burn-In & Reliability Qualification Services, ESD Testing & Latch-Up Testing Services, PCB Design & Assembly Services, FIB Circuit Edit and Debug Services, Failure Analysis Services ASIC Design, FPGA Design and Development, Design Verification and Validation, Specifications to GDSII, Custom IC design Packaging services, Process/Product industrialization, Full Project Development SoC Verification, IP Level Verification, FPGA Prototyping, ASIC Implementation Multi-Project Wafers (MPWs), Low Volume Production, Dedicated Runs, Low Cost, Access To Technology / Design Documents , Services ASIC Front-end Design, ASIC Design Verification, AMS Design and Physical Implementation, FPGA Design, Silicon Validation IC Qualifications for ESD, Burn-in product, process, Reliability Qualification capability and capacity, Device Package Qualification Services including Preconditioning, Engineering and Hardware capabilities, IC Package Failure Analysis ASIC design, ASIC verification, System validation and industrialization , Full turnkey Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging Digital Design Verification (DV), Digital Microarchitecture, Design, & Implementation, Analog Modeling & Mixed Signal (AMS) Verification Security & Encryption, Standard Interconnect and Communication Protocols Hardware Verification, Software Testing, Security, Safety, Training Verification IP, ARM-based VIP, Hi-Speed VIP, MIPI VIP, Memory and Storage VIP, Universal Serial IO VIP Failure Analysis, Circuit Nano-edit, Reliability Testing, FIBxTEM Analysis QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping 1G to 1,000Gbps Interlaken IP cores, 1G to 400Gbps Ethernet IP Cores, Low latency Ethernet for Financial Markets mmWave ASIC design services, ASIC prototype characterization, mmWave markets 60GHz Power Amplifier, 100+GHz transceivers for Gbps communication links, THz transmitter ASIC/FPGA Design, ASIC Implementation and Verification, DO-254 Compliance, Communication, PCB Design and Verification Video Controller, Forward Error Correction, Security, RISC-V Verification, Communication Controller Co-development in every stage of your project, Package design & prototyping, Industrialization, Development track record Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis Integrated Circuit Development, Sensor Readout, Sensor System Development Analog IPs, Digital IPs Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules Custom IP Ultra-low Power PLL, Low Power PLL, High Performance PLL in TSMC 7nm, DLL, ADC ASIC Design Services, FPGA Design Services RISC-V CPU Core, DDR4 Controller + PHY Basic Vendor Selection Package, Full Silicon Management Package, Verification Package, Silicon Roadmap Planning Package, Commercial Package, Financing Package Design Execution, AMS Circuit Design, Reliability & Product Engineering, Embedded Software, Low-Cost ASIC GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
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