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Featured Vendor

Chipus Microelectronics

Chipus Microelectronics

Brazil

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

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Device Engineering Incorporated

Device Engineering Incorporated

USA

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

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Sencio

Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

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SYNERGIE CAD PSC

SYNERGIE CAD PSC

France

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

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Noesis Technologies

Noesis Technologies

Greece

Noesis Technologies is a Silicon IP provider specialized in hardware implementation of complex telecom algorithms for wireless and wireline applications.

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IC Enable

IC Enable

USA

Since 2004, IC Enable has successfully delivered design and layout services with exemplary quality from test chips to full-custom ASICs.

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Semiconductor News

IC Package Types and How to Choose One?
IC Package Types and How to Choose One?
CEO Talk: Bram De Muer of ICsense
CEO Talk: Bram De Muer of ICsense
Multi Project Wafer (MPW) Service and Price
Multi Project Wafer (MPW) Service and Price
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
What does a VLSI Engineer do?
What does a VLSI Engineer do?
What is an ASIC Engineer?
What is an ASIC Engineer?
ASIC Design: From Spec to Chips
ASIC Design: From Spec to Chips
Understanding CoWoS Packaging Technology
Understanding CoWoS Packaging Technology

Latest Articles

ASIC Design

CEO Talk: Bram De Muer of ICsense
CEO Talk: Bram De Muer of ICsense
What does a VLSI Engineer do?
What does a VLSI Engineer do?
What is an ASIC Engineer?
What is an ASIC Engineer?

IP Cores

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process
QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process
Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core
Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core

ASIC Industry Market Trends

Introduction to eDRAM
Introduction to eDRAM
CEO Talk: Michael Dube, EVP at Rochester Electronics
CEO Talk: Michael Dube, EVP at Rochester Electronics
HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering
HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

Wafer and Foundries

Multi Project Wafer (MPW) Service and Price
Multi Project Wafer (MPW) Service and Price
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023
Semiconductor Foundry Revenue 2023-2024
Semiconductor Foundry Revenue 2023-2024

Packaging

IC Package Types and How to Choose One?
IC Package Types and How to Choose One?
Understanding CoWoS Packaging Technology
Understanding CoWoS Packaging Technology
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

Verification

The Ultimate Guide to ASIC Verification
The Ultimate Guide to ASIC Verification
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Constrained Random Verification flow strategy
Constrained Random Verification flow strategy

Testing

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing
Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Qualification

Managing Space Grade RF Device Qualifications
Managing Space Grade RF Device Qualifications
Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada
Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification

Supply Chain

CEO Talk: Michael Dube, EVP at Rochester Electronics
CEO Talk: Michael Dube, EVP at Rochester Electronics
The Economics of ASIC
The Economics of ASIC
Obsolete Chips – The Ultimate Guide
Obsolete Chips – The Ultimate Guide

Failure Analysis

FIB Circuit Edit
FIB Circuit Edit
Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Focused Ion Beam (FIB)
Focused Ion Beam (FIB)
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