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Featured Vendor

Productivity Engineering

Germany

Know-how and lengthy experience is what makes us successful in the design of analog, digital and Mixed-Signal ASICs. Your partner for future-oriented, Cost-optimized ASIC solutions.

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AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

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SGA

SGA

Sweden

SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.

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ICleviathan

Israel

ICleviathan is an multi national IC supply chain company. Established in 2005. Our company specializes in the management of customers’ IC operations throughout the entire IC flow cycle. Our customer base includes, start-ups, system companies and Defence companies.

We offer each customer a superior and comprehensive solutions that includes ASIC design, manufacturing, assembly, testing, qualification and FA services.

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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Atek Midas

Turkey

ATEK is a tech company, working on high frequency circuit design. ATEK focuses on providing design and development services from RFIC/MMIC components to Microwave/mm-wave Subsystems based on customer needs.

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Semiconductor News

CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc

CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc

IC Package Types and How to Choose One?

IC Package Types and How to Choose One?

CEO Talk: Bram De Muer of ICsense

CEO Talk: Bram De Muer of ICsense

Multi Project Wafer (MPW) Service and Price

Multi Project Wafer (MPW) Service and Price

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

What does a VLSI Engineer do?

What does a VLSI Engineer do?

What is an ASIC Engineer?

What is an ASIC Engineer?

ASIC Design: From Spec to Chips

ASIC Design: From Spec to Chips

Latest Articles

ASIC Design

CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc

CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc

CEO Talk: Bram De Muer of ICsense

CEO Talk: Bram De Muer of ICsense

What does a VLSI Engineer do?

What does a VLSI Engineer do?

IP Cores

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process

QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process

Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core

Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core

ASIC Industry Market Trends

Introduction to eDRAM

Introduction to eDRAM

CEO Talk: Michael Dube, EVP at Rochester Electronics

CEO Talk: Michael Dube, EVP at Rochester Electronics

HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

Wafer and Foundries

Multi Project Wafer (MPW) Service and Price

Multi Project Wafer (MPW) Service and Price

Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023

Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023

Semiconductor Foundry Revenue 2023-2024

Semiconductor Foundry Revenue 2023-2024

Packaging

IC Package Types and How to Choose One?

IC Package Types and How to Choose One?

Understanding CoWoS Packaging Technology

Understanding CoWoS Packaging Technology

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

Verification

The Ultimate Guide to ASIC Verification

The Ultimate Guide to ASIC Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE

Constrained Random Verification flow strategy

Constrained Random Verification flow strategy

Testing

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Qualification

Managing Space Grade RF Device Qualifications

Managing Space Grade RF Device Qualifications

Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada

Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada

Understanding High Temperature Storage Life (HTSL) in IC Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification

Supply Chain

CEO Talk: Michael Dube, EVP at Rochester Electronics

CEO Talk: Michael Dube, EVP at Rochester Electronics

The Economics of ASIC

The Economics of ASIC

Obsolete Chips – The Ultimate Guide

Obsolete Chips – The Ultimate Guide

Failure Analysis

FIB Circuit Edit

FIB Circuit Edit

Best Practices: IC Troubleshooting & IC Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis

Focused Ion Beam (FIB)

Focused Ion Beam (FIB)