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Featured Vendor

RADLogic

RADLogic

Australia

RADLogic provides Mixed Signal IC Design Services, IP Block Development and Sales, and Board, Software and System Application Development.

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iNPACK

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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Aptasic

Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

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SGA

SGA

Sweden

SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.

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Racyics

Racyics

Germany

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

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Australian Semiconductor Technology Company

Australian Semiconductor Technology Company

Australia

ASTC is integral to the global embedded electronics supply chain, supplying semiconductors, IP and software, to OEM and systems companies.

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Semiconductor News

IC Package Types and How to Choose One?
IC Package Types and How to Choose One?
CEO Talk: Bram De Muer of ICsense
CEO Talk: Bram De Muer of ICsense
Multi Project Wafer (MPW) Service and Price
Multi Project Wafer (MPW) Service and Price
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
What does a VLSI Engineer do?
What does a VLSI Engineer do?
What is an ASIC Engineer?
What is an ASIC Engineer?
ASIC Design: From Spec to Chips
ASIC Design: From Spec to Chips
Understanding CoWoS Packaging Technology
Understanding CoWoS Packaging Technology

Latest Articles

ASIC Design

CEO Talk: Bram De Muer of ICsense
CEO Talk: Bram De Muer of ICsense
What does a VLSI Engineer do?
What does a VLSI Engineer do?
What is an ASIC Engineer?
What is an ASIC Engineer?

IP Cores

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process
QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process
Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core
Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core

ASIC Industry Market Trends

Introduction to eDRAM
Introduction to eDRAM
CEO Talk: Michael Dube, EVP at Rochester Electronics
CEO Talk: Michael Dube, EVP at Rochester Electronics
HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering
HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

Wafer and Foundries

Multi Project Wafer (MPW) Service and Price
Multi Project Wafer (MPW) Service and Price
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023
Semiconductor Foundry Revenue 2023-2024
Semiconductor Foundry Revenue 2023-2024

Packaging

IC Package Types and How to Choose One?
IC Package Types and How to Choose One?
Understanding CoWoS Packaging Technology
Understanding CoWoS Packaging Technology
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

Verification

The Ultimate Guide to ASIC Verification
The Ultimate Guide to ASIC Verification
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Constrained Random Verification flow strategy
Constrained Random Verification flow strategy

Testing

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing
Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Qualification

Managing Space Grade RF Device Qualifications
Managing Space Grade RF Device Qualifications
Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada
Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification

Supply Chain

CEO Talk: Michael Dube, EVP at Rochester Electronics
CEO Talk: Michael Dube, EVP at Rochester Electronics
The Economics of ASIC
The Economics of ASIC
Obsolete Chips – The Ultimate Guide
Obsolete Chips – The Ultimate Guide

Failure Analysis

FIB Circuit Edit
FIB Circuit Edit
Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Focused Ion Beam (FIB)
Focused Ion Beam (FIB)
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