Israel
Beckermus Technologies has more than 20 years of experience in providing micro-assembly services in the fields of microelectronics, micro-optics and photonics.
In Beckermus, there is no minimum order quantity, we support our clients from the very first steps of prototyping through small amounts assembly and up to mid-high quantities.
Our microelectronics services include the following IC assembly technologies and applications:
Our Micro optics/photonics assembly services:
Our clean room includes 7 workspaces and over 60 workstations, spreading on ~700 square meters. Our facilities received class ISO 7/6/5 certifications and ISO 13485: Medical devices, AS9100D aerospace, QMS certified, IPC-A-610 and MILL-STD 883 qualifications.
Wire Bonding
-Automatic/manual Ball Gold wire bonding
-Automatic/manual aluminum wedge Bonding
-Ultra low loop, RF profiles, custom profiles
-Au, Cu and Al automatic wire bonding
-High accuracy bond placement.
Ultra-Fine-Pitch
-Wafer level packaging
-Placement accuracy down to ±1 µ
-Automated die bonding on wafer.
Flip Chip
Encapsulation
Architecture & Design
Rapid Prototyping
Pro lab work
Inventory Management
Material planning
Purchasing
Packaging and shipment
WLP – Wafer Level Packaging
● Automatic processes of high accuracy Die Bonding (up to 1 micron), wire bonding, Flip chip.
● Advanced Wafer dicing
● Supporting 4-12 ” wafers from variety of materials
● Sorting dies from wafer to gelpack / waffle pack