Beckermus Technologies


Beckermus Technologies has more than 20 years of experience in providing micro-assembly services in the fields of microelectronics, micro-optics and photonics.

In Beckermus, there is no minimum order quantity, we support our clients from the very first steps of prototyping through small amounts assembly and up to mid-high quantities.

Our microelectronics services include the following IC assembly technologies and applications:

  • Wire bonding
  • Die attach -CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL, Laser diodes, microcontrollers and more
  • Flip chip
  • Encapsulation
  • Chip on board/Chip on flex
  • System in packages (SiP) and Multi-chip module (MCM)
  • Wafer level packaging
  • 3D stacked dies
  • Wafer dicing/sorting

Our Micro optics/photonics assembly services:

  • Optical modules assembly
  • Active alignment
  • Electro optics and photonics assembly


Our clean room includes 7 workspaces and over 60 workstations, spreading on ~700 square meters. Our facilities received class ISO 7/6/5 certifications and ISO 13485: Medical devices, AS9100D aerospace, QMS certified, IPC-A-610 and MILL-STD 883 qualifications.