Beckermus Technologies


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Beckermus Technologies has more than 20 years of experience in providing micro-assembly services in the fields of microelectronics, micro-optics and photonics.

In Beckermus, there is no minimum order quantity, we support our clients from the very first steps of prototyping through small amounts assembly and up to mid-high quantities.

Our microelectronics services include the following IC assembly technologies and applications:

  • Wire bonding
  • Die attach -CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL, Laser diodes, microcontrollers and more
  • Flip chip
  • Encapsulation
  • Chip on board/Chip on flex
  • System in packages (SiP) and Multi-chip module (MCM)
  • Wafer level packaging
  • 3D stacked dies
  • Wafer dicing/sorting

Our Micro optics/photonics assembly services:

  • Optical modules assembly
  • Active alignment
  • Electro optics and photonics assembly


Our clean room includes 7 workspaces and over 60 workstations, spreading on ~700 square meters. Our facilities received class ISO 7/6/5 certifications and ISO 13485: Medical devices, AS9100D aerospace, QMS certified, IPC-A-610 and MILL-STD 883 qualifications.


Microelectronic Assembly Services

Wire Bonding

  • Supporting Au, Cu, Al automatic wire bonding
  • Ball / Wedge automatic wire bonding
  • High accuracy bond placement (2 microns)
  • Ultra-Fine-Pitch (Up to 35 microns)
  • Advanced wire bonding profiles (Ultra low loop, RF profiles, custom profiles)

Die Attach

  • Placement accuracy – 1 micron
  • Dispensing – Time-pressure, auger and JET
  • Sensitive structures die handling
  • Active alignment


  • Automatic processes of high accuracy Die Bonding (up to 1 micron), wire bonding, Flip chip.
  • Molding / Encapsulation

Flip Chip

  • Placement accuracy – 0.5 micron
  • Up to 70-micron bump diameter
  • Inert soldering
  • Threw head and substrate separate heating profiles


  • Time-pressure, auger and JET dispensing
  • Experience with most of glues types
  • Dam & Fill
  • Low Profile encapsulation


Chip On Board / Chip On Flex

  • Die size – up to 70 microns square
  • Die bonding accuracy – up to 1 microns
  • Automatic Wire bonding (Au, Al, Cu) Pitch between pads – up to 35 microns (0.7 mil wire diameter)
  • Ultra-low loop / shape, advanced wire bond loops
  • Molding / Encapsulation


Stacked Dies

  • Automatic processes of high accuracy Die Bonding (up to 1 micron), wire bonding, Flip chip.
  • Molding / Encapsulation

Electro-Optics and Photonics Assembly Services

Optical Modules Assembly

  • Class 1000 environment
  • Automatic Components handling and Bonding
  • Automatic Dispensers for High accuracy adhesive control

Active Alignment

  • Automatic Active alignment process including 6 Axis motorized stage, achieving High accuracy – up to 1 micron
  • Manual active alignment for R&D purposes, including Optical table and 6 Axis stages
  • Class 1000 environment

Electro-Optics, Photonics

  • Class 1000 environment
  • Active alignment processes.
  • Back-end assembly of micro-electronics including Die bonding, Wire bonding, Encapsulation.

Wafer Level Services

WLP – Wafer Level Packaging

  • Automatic processes of high accuracy Die Bonding (up to 1 micron), wire bonding, Flip chip.
  • Advanced Wafer dicing

Wafer Dicing / Sorting

  • Supporting 4-12 ” wafers from variety of materials
  • Sorting dies from wafer to gelpack / waffle pack