Beckermus Technologies
Israel
Beckermus Technologies has more than 20 years of experience in providing micro-assembly services in the fields of microelectronics, micro-optics and photonics.
In Beckermus, there is no minimum order quantity, we support our clients from the very first steps of prototyping through small amounts assembly and up to mid-high quantities.
Our microelectronics services include the following IC assembly technologies and applications:
- Wire bonding
- Die attach -CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL, Laser diodes, microcontrollers and more
- Flip chip
- Encapsulation
- Chip on board/Chip on flex
- System in packages (SiP) and Multi-chip module (MCM)
- Wafer level packaging
- 3D stacked dies
- Wafer dicing/sorting
Our Micro optics/photonics assembly services:
- Optical modules assembly
- Active alignment
- Electro optics and photonics assembly
Our clean room includes 7 workspaces and over 60 workstations, spreading on ~700 square meters. Our facilities received class ISO 7/6/5 certifications and ISO 13485: Medical devices, AS9100D aerospace, QMS certified, IPC-A-610 and MILL-STD 883 qualifications.
Services
Microelectronic Assembly Services
Wire Bonding
-Automatic/manual Ball Gold wire bonding
- K&S ICON, F&K Delvotech, Esec
-Automatic/manual aluminum wedge Bonding
- ASM, K&S
-Ultra low loop, RF profiles, custom profiles
-Au, Cu and Al automatic wire bonding
-High accuracy bond placement.
Ultra-Fine-Pitch
-Wafer level packaging
-Placement accuracy down to ±1 µ
-Automated die bonding on wafer.
- Wire bonding.
- Flip Chip – gold, solder, copper bumps.
Die Attach/ MCM / SiP
- Placement accuracy down to ±1 µ
- Manual/Automatic die attach
- Dispensing – Time-pressure, auger and JET
- Active alignment
- Die types: CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL, Laser diodes, microcontrollers etc.
- Substrates: FR4, FLEX, Ceramics, Glass, Silicon, Teflon, Diamond, ead frames etc.
Flip Chip
- Manual – fineTech, FinePlacer, Lambda.
- Automatic –Hacker.
- Placement accuracy down to 0.5 micron.
- Heating profiles: both through head and heating plate.
- Inert soldering
Encapsulation
- Glob Top
- Dam & Fill
- Selective Encapsulation
- UnderFill
- Low Profile Encapsulation
- Dispensing – time-pressure, screw system
Chip On Board / Chip On Flex
- Die size – down to 100µ square.
- Die bonding accuracy – 2µ.
- Automatic Wire bonding (Au, Al, Cu).
- Pads pitch ≥ 45µ (0.7 mil wire diameter).
- Ultralow loop/shape, advanced wire bond loops.
- Molding/Encapsulation.
Stacked Dies
- Complex structure assembly:
MEMS, ASIC, 2 voltaic cells, SMT, CMOS, filter. - Technologies: flip-chip inert soldering, conductive and nonconductive epoxy gluing, UnderFIll and wire bonding.
ectro-Optics and Photonics Assembly Services
Optical Modules Assembly
- Class 1000 environment
- Automatic Components handling and Bonding
- Automatic Dispensers for High accuracy adhesive control
Active Alignment
- Automatic Active alignment process. including 6 Axis motored stage.
- Placement accuracy down to ±1 µ
- FiconTEC CL1500 upgraded specially for Beckermus to serve multiple types of projects.
- Manual active alignment for R&D purposes, including Optical table and 6 Axis stages.
- Class 1000 environment.
Electro-Optics, Photonics
- Class 1000 environment
- Active alignment processes.
- Back-end assembly of micro-electronics including Die bonding, Wire bonding, Encapsulation.
Electro Optical Design
Architecture & Design
- Comprehensive optical system simulation: requirements analysis, physics, optics, and budget.
- Integrative modeling and design of optical elements and systems
- multiple solutions for rays and waves shaping.
- Optomechanical design – Integrative multidisciplinary design
Rapid Prototyping
- Prototype approximating the targeted optical system or module.
- Algorithmically sensing and simulating of real-world conditions
Pro lab work
- Early stage selection of components
- Characterize optical and semiconductor components, never count on datasheets.
Supply Chain Services
Inventory Management
- Storage of raw materials, goods in process and finished goods in dedicated, separate storage rooms.
- Stock monitoring and planning. Usage of advances software, serial numbering and barcodes to ensure control of volume and location
- Holding clients’ stock in Consignment
- Arranging components in kits according to specific assembly requirements.
- Using advanced software for optimal stock control.
- Periodical stock counting, according to client’s process flow.
Material planning
- Materials utilization services
- Keeping an optimal flow of components
- Adherence to our clients’ business plans and sales forecasts
- Planning for optimal inventory, avoiding surplus or shortage
Purchasing
- Connecting to the client’s technical requirements, timelines and business forecasts.
- Working closely to our customers in order to reach the client’s budgetary goals and meet their cost reduction targets.
Packaging and shipment
- Finished goods leaving Beckermus’ facilities are carefully packaged in dedicated materials suitable for microelectronics’ transporting.
- Shipment is available worldwide with a variety of global forwarding services and couriers.
Wafer Level Services
WLP – Wafer Level Packaging
● Automatic processes of high accuracy Die Bonding (up to 1 micron), wire bonding, Flip chip.
● Advanced Wafer dicing
Wafer Dicing / Sorting
● Supporting 4-12 ” wafers from variety of materials
● Sorting dies from wafer to gelpack / waffle pack
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