DELTA Microelectronics


With over 30 years of experience, we provide ASIC design, semiconductor testing, packaging, and complete supply chain services to some of the world’s best-known brands.

Our extensive suite of ASIC services, high caliber engineering teams, and advanced test facilities allow us to take your products from specification to mass production through the most predictable and reliable path. Our teams act as an extension of each of our customers’ operations and provide services from ASIC design through wafer supply, wafer testing, packaging, final IC testing, and failure analysis.


ASIC Design

asis design die closeup

Over 100 successful ASIC projects have been developed by DELTA’s professional design team and have been deployed in systems and products worldwide. Utilizing best-in-class tools and our veteran team in Europe, we guarantee faster time-to market of smaller, more robust, more profitable ASIC products.

With several decades of combined experience in the international ASIC industry, DELTA provides unmatched technical excellence and expertise. Our teams in Denmark and the UK have more than 500 man years of ASIC design and production know-how. We apply this wealth of experience carefully throughout projects, to ensure clients of right-first-time results.

Testing and Packaging


Our semiconductor testing facility is one of the largest in Europe, where we test digital, mixed signal, wafers and components.

We cooperate closely with our customers during the design stage to build cusomised test programs and ensure design for testability. Testing takes place in our class 6 clean room, which includes several automated testers, 8″ and 12″ wafer probers, pick and place component handlers, and gravity component handlers.

We have specific expertise in testing wireless communication components for both consumer and industrial applications. We test Bluetooth, WiFi, RFID, and other wireless frequency interfaces, including high-speed signals up to 40 GHz.

Or IC testing facility is ISO9001 and IS14001 certified.



packaging green chip

DELTA offers a broad range of standard and innovative, top-quality packaging services to meet the diverse requirements of customers, such as electrical performance, heat dissipation, cost, and aggressive time-to-market.

Our packaging team can provide expert guidance for package characterisation and selection, assist with package design logistics and documentation, perform failure analysis to identify packaging-related yield issues, and drive post-packaging, final product qualification testing.

Qualification and Failure Analysis


DELTA offer comprehensive qualification services including:

  • Electrical tests, e.g. ESD and latch-up
  • EMC tests
  • Mechanical tests
  • Environmental tests
  • Combined mechanical and environmental tests
  • Preconditioning (e.g. JESD22-A113)
  • Workmanship evaluation covering  External visual inspection | Physical dimensions | X-ray | Inspection Seal testing (for hermetic components) | Solderability test | Resistance to soldering heat | Marking permanency | Lead  integrity

Failure Analysis

We operate our in-house microelectronics failure analysis lab whee we use specialized equipment and processes –  from mechanical access techniques to X-ray and scanning electron microscope examination – to identify the root cause of failures.

failure analysis cross section

  • Microsectioning
  • Real time X-ray
  • Hot spot analysis
  • Solderability tests
  • Sub-micron probing
  • Chemical and plasma etching
  • Scanning electron microscopy
  • Scanning acoustic microscopy
  • Energy dispersive ana­lysis of X-ray
  • Gross and fine leak hermeticity testing
  • Bright/dark field, differential interference, light sectioning, and stereo microscopy
  • Environmental testing (tempe­rature, shock, humidity, corrosion, vibration)

Supply Chain Services

We provide full turnkey ASIC manufacturing services for fabless IC vendors and system companies, taking products from prototype to mass production using the most predictable, low-risk path and the fastest time-to-market.

Our flexible supply chain service adapts to each customer’s unique needs and volumes, and consists of wafer procurement and probing, packaging, IC testing, storage and distribution of ICs.

ASIC supply chain services


stacked wafers

As a GLOBALFOUNDRIES channel partner for Europe, Middle East and Africa (EMEA), we provide access to all GLOBALFOUNDRIES portfolio of semiconductor technologies together with a range of value added productization services.

Our services are ideal for companies requiring MPW runs or lower-mid production volumes, who can benefit from flexible 22/40/65/130nm mixed technology options. We offer:

  • PDK and library licenses
  • Design support
  • Wafer & mask set procurement




IP Cores

RFID analog front-end

This is a contact-less RFID transceiver front-end for general-purpose applications in the 13.56MHz range ISO/IEC 14443 and ISO/IEC15693.
  • Low power low voltage operation
  • Contact-less power supply (on-chip full wave rectifier)
  • Radio frequency 13.56MHz inductive coupling
  • Supports: Type A ASK 100% Miller, Type B ASK 10% NZR-L,etc.
  • Edge sensitive demodulator with programmable threshold
  • Carrier detector
  • High power and soft load modulator for ‘back-scatter’ transmission