indie Semiconductor FFO


indie Semiconductor FFO GmbH is a One-Stop-Shop for high-frequency analogue and mixed-signal ASICs. We tailor to the customers’ requirements and specific demands, even for individual quantities. Using our own IP Portfolio and Patent Solutions does not only shorten the time to market for our customers but also enables custom-made solutions at a reasonable cost. We integrate, miniaturize and protect customers’ original IPs.


As an added edge, indie Semiconductor FFO GmbH also develops, manufactures, and distributes 24GHz, 60GHz*, 120GHz, and 300GHz* (*under development and samples are available upon request) high-frequency circuits for radar sensors of the highest technological standard, manufactured in the unique innovative SiGe BiCMOS and RF-CMOS technologies.


ASIC Design

We can assist you with specifying the requirements for your systems and ASICs, which is the first step in the design process. If specifications already exist or if questions of feasibility arise during the specification phase, we can clarify these in a feasibility study and decide with you on their implementation.


Our sophisticated workflow and our highly specialized staff translate specifications into an IC layout. Due to the unique features in the design of MMICs, the packaging design is integrated into the development stage. The simulations with specially developed EDA tools give precise predictions about the function and efficiency of our ASICs. But only prototypes made in MPW runs can verify the performance.


With the help of our partners who meet our particular requirements for the further processing of the wafer, bonding, and flip-chip process, as well as packaging and testing, we can supply you with end products ranging from small series to medium lot sizes on favorable terms.



– High operating frequency over 300 GHz
– BiCMOS SiGe and RF CMOS technologies
– MPW service
– Years of experience
– One-stop solutions
– Small lot sizes
– Cost-effective development and production

Feasibility Studies

Feasibility study for a good reason
Whether we check your product specifications for feasibility or clarify the feasibility of ideas generated with you, a feasibility study is a quick and cost-effective way to do so. It helps to minimize the development risk and estimate the project’s course. Especially in this phase, you benefit from our in-depth knowledge of the SiGe BiCMOS and RF CMOS technologies.


Procedure for a feasibility study
As a first step of the feasibility study, the current state of technical development is surveyed based on a literature review. After evaluating the radar front ends relevant to your project, we will make several proposals for system architecture and assess them. Here the first-order simulations of the most crucial building blocks of the system are an essential step. Through them, we can ensure the possibility of implementing the entire IC and estimate performance parameters. At this stage, we develop basic test methods for essential parts of the system and the IC as a whole. They serve later for the verification of the specifications.


The results
You will receive a comprehensive report containing literature research, patent research, simulation results, and suggestions for testing. Based on this broad considerations, a solid cost estimate and a schedule for the project can be created. At this point, it is also possible to decide against the implementation of a project or redefine a project.

Advanced Packaging

Packaging development
In the development of MMICs, the packaging of silicon chips occupies a unique position. The high frequencies present affects the essential functions of the chips. There are effects due to parasitic inductances, capacitive interactions of various components, conductor resistance, or the dielectric constant of the molding compound. To bring the performance of your ASIC in your application to its limits, we optimize these parameters. We often resort to proven and efficient standard solutions such as QNF packages to reduce costs.


The choice of the type of package – whether LGA, QFN, FAM, or Glop Top – and methods for connecting the chip and package, such as flip chip or wire bonding, or thermal management, are evaluated under different aspects. For this purpose, computer-based simulations are used first, and prototyping and sample series are used here.


Process engineering
Our professional packaging partner network guarantees access to the latest and most specialized package-building processes. Every development of a package takes place in close cooperation with these partners. In this way, we can guarantee the feasibility of our designs and make the transition from pilot series to series production seamless.



– Low-Cost
– HF compliant
– Small size
– RoHS compliant
– Robust
– Standard QFN layout possible

Serial Production

From a working sample to a series
We organize the complete supply chain for you, including forecast planning and quality assurance. You can rely on our sophisticated supply chain management. This begins with selecting and evaluating suppliers according to criteria that meet your specific requirements. The performance of the suppliers will be monitored throughout the entire production period. Our corrective action management applies if deviations from the specifications or change requests occur. As far as possible, we also provide a second source so that even the extreme case of the failure of a supplier is hedged.


Batch Size
In the foundry, a series can be produced starting from a batch size of 6 wafers. All subsequent production steps, such as packaging and testing, are sized as needed. Wafers that cannot be processed immediately and more significant volumes of produced circuits can be safely stored per current standards. We can look back on a long list of successful development projects. This experience results in the outstanding expertise of our RF developers and a network of development partners that has grown over many years. With this innovative potential, we always put together the right team for your needs.


– Certification and qualification of partners according to ISO9001: 2015 is the minimum requirement for all partners in the supply chain
Our products are compliant with: REACH / RoHS, Dodd-Frank-Act (EICC GeSI Common Reporting), ODC (Ozone Depletion Chemicals)

IP Cores


Silicon Radar has extensive libraries of LNAs, mixer, VCOs, frequency multipliers, frequency dividers and PAs operating in following frequency ranges: 8-12GHz, 22 – 29GHz, 57-64GHz, 75-85GHz, 116-124GHz, 220-275GHz.


Our IP blocks are implemented in SiGe BiCMOS (0.25um, 0.13um) and RF-CMOS (22FDX) technologies.