Inomize is a professional Research & Development company specializing in the design and delivery of hardware solutions. We offer a wide range of services tailored to meet your project needs and product constraints in terms of cost, performance and power consumption. Inomize was established in 2007, and since then is a fast-growing company and the largest ASIC design firm in Israel. Among our customers you will find large international corporations and start-up companies from Israel, Europe and North America. Inomize is experienced in various technologies like HPC, CNN, DL/ML, IoT, XR, AI, Networking, Communication and others.


Inomize is the sole DCA and VCA Israeli partner of TSMC, and as such provides intimate relationship with the world’s leading ASIC fab.


ASIC Turn-key

Inomize specializes in designing cutting-edge ASICs and systems for a wide range of applications. Our proven methodologies and systematic development process allow us to provide our customers with high quality, first-time-right designs in a short time frame.

Back-End services

At Inomize, we offer full backend services to help our customers to move smoothly and easily into silicon production.

Our industry-recognized team of experts provides all services needed to take your design into GDS2 and to silicon phase.

Inomize’s backend team is highly experienced in working with various foundries, such as TSMC, GF, SMIC, Fujitsu, Tower, and others.  Inomize is experienced in various geometries raging from 180nm down to 16nm.


A system on chip (ASIC or SOC) is an integrated circuit (IC) that integrates all components of an electronic system into a single chip. This chip may contain a wide variety of functions such as digital, analog, mixed-signal, and radio frequency.


At Inomize, we specialize in providing right-first-time complex and multi-functionality ASIC solutions. We use our multidisciplinary System on Chip (SoC) expertise, and mixed signal knowledge to design optimal architecture solutions for each of our customers’ device.

Analog and RF

The fine art of ASIC design often involves finding the optimal balance between three components: Digital, Analog, and RF. The ultimate goal is to merge these functions on a single chip, in accordance with project’s requirements (performance, power consumption, and physical size) as well as budgetary limitations.


Inomize team has decades of accumulated expertise in all ASIC/SoC development stages: design, verification, production, validation and testing. This know-how allows Inomize to guarantee Inomize customers a flawless move from a concept to a product.


At Inomize, we offer Turnkey Analog, RF, and Mixed Signal services. We deliver high quality mixed signal ASIC designs while significantly reducing development risk, cost, and time-to-market.


Each algorithm project presents a distinctive set of requirements and restrictions. The challenge is to define the optimal algorithmic solution for each project.


At Inomize, we specialize in algorithm development across a wide range of applications such as ultra-low power consumption, high performance modem design, and image processing.


Our algorithm experts hold an extensive experience, unique knowledge and a successful track record in Mobile standards such as LTE, UMTS, BT, Wi-Fi, DVB-T, DVB-H, DAB, T-DMB, CMMB, ISDB-T, WiMAX and cable modems.

In addition, our team has unique expertise in the field of single-battery, lifetime operated communication systems and Power line Communication (PLC).

Board Design

With the ever-increasing bus speeds in modern electronics, engineers must have a solid understanding of high-speed design and layout. As SerDes bus speeds approaching 10Gbits and wider and parallel buses, such as DDR3/4, entering the GHz realm, it is mandatory to maintain high level of knowledge and expertise in the areas of signal integrity. High-speed bus analysis, including comprehensive loss modeling of traces, assessment via performance, and inclusion of system timing, is vital to meeting time to market and ensuring design success.

At Inomize, our design team includes engineering professionals from multiple facility design disciplines. Our  team specializes in designing for complex, high-speed, and large electronic systems for the Telecom, Computer, Medical, Military, Industrial, Storage, ASIC Emulation, Evaluation, and Reference board design, and Consumer Electronics markets. Our engineers provide all expertise required to deliver multi-layer board design around FPGA using high-speed interfaces such as LPDDR/LPDDR2/DDR2/DDR3/DDR4, Gigabit Ethernet, RapidIO, and PCI Express as well as ultra-high speed optical interfaces. This team is also highly proficient at implementing high-speed interfaces by using modern tools for Signal-Integrity Analysis.