MASER Engineering

The Netherlands

MASER Engineering is an independent engineering service company. Since 1993 we have offered Reliability Test and Failure Analysis Services to the semiconductor and electronic systems industry.

Failure Analysis Services:

  • Non Destructive Analysis
  • Construction Analysis
  • FIB Circuit Edit
  • IPC Inspection
  • Advanced Failure Analysis


Reliability Test Services:

  • Qualification test
  • ESD & latch-up test
  • Environmental test
  • Mechanical test
  • HALT test
  • Electrical test
  • Optical test


We have the equipment and know-how available to perform timely & efficient reliability tests and failure analysis on your semiconductors, electronic components,  (sub) systems or complete products.

We strive towards long-term relationships with our customers!

We look forward to supporting you!


Qualification Services

We offer a wide range of qualification procedures to qualify your products according to the latest international standards or to your specific requirements.

Electronic components for consumer and industrial applications are usually qualified according to the JEDEC standards. Components for automotive applications are usually qualified according to AEC Q100 standards. Components for military applications are usually qualified according to MIL standards. Electronic Modules and Systems are usually qualified according to IEC standards or other application-specific standards.


Please feel free to contact us when you need assistance to define an efficient qualification flow for your component, module or (sub)system.

ESD & Latch Up Test

ESD Test

ESD tests are an important item in the qualification procedure of new components or modules. We have automatic test equipment that supports the most common ESD test pulse models.


  • Test strategy advice
  • In-house design and manufacturing of ESD Interfaces
  • Support for MIL – JEDEC – ESDA – IEC standards
  • IC level Human Body Model
  • IC level Charged Device Model
  • System-level IEC 61000-4-2

Our Thermo Mk.2 systems can automatically test the ESD performance of small to high pin count devices (up to 512 channels).

The automotive industry has defined specific test modes. MASER Engineering has built and qualified this specific test setup for all AEC-Q100 device qualification tests.

For CDM test we operate a Thermo Keytek Orion-3 system.

The IEC 61000-4-2 test capability is focusing on conductive or field induced ESD pulses on modules and systems. In a dedicated environment, the TESEQ NSG-438 system can inject HBM pulses up to 30kV.


Latch-up Test

  • Test strategy advice
  • In-house design and manufacturing of Latch-up Interfaces
  • Static Latch-Up test
  • Dynamic Latch-Up test

Failure Analysis Services

We offer Failure Analysis Services to a wide range of customers within the electronics industry. For a successful F/A a combination of good equipment and skilled engineers/technicians is key. Throughout the years we have continuously extended our equipment capability to keep pace with the technology developments. Importantly, our staffing has similarly grown in size, experience and skills. Having this capability in a centralized lab is unique in Europe and our extensive offering and F/A outcome is highly appreciated by our customers.


Services Available


Your benefits

Depending on your product phase a successful failure analysis brings you at least one of the following benefits:

  • Quicker time to market
  • Reduction of manufacturing costs (yield improvements)
  • Reduction of product maintenance costs
  • Reduction of field return rates
  • Increased knowledge of your own product

So a Failure Analysis certainly adds value!

Focused Ion Beam (FIB)

With our Focused Ion Beam (FIB) system we can repair/modify your ICs.  


We offer full front and backside FIB edit service using the latest FIB systems. We have state of the art sample decapsulation tools and know how to prepare the samples for the actual FIB edit. We have more than 20 years experience with FIB circuit edits and we have done several successful projects on process nodes down to 16nm.


Our goal is to make your chip work!


  • Decapsulation and re-encapsulation
  • GDS based navigation
  • Front & backside edits
  • Low resistance metal deposition
  • Insulator deposition
  • Support for all IC processes

Your Benefits:

  • Be 100% sure that your well-thought-out modification really fixes the issue
  • Be sure that the initial issue was not masking other (unknown) issues
  • Reduce the time to market
  • Having working samples before the final silicon arrives so your application team can progress
  • Meeting agreed deadlines with key customers