Optocap provides contract package design and assembly services for microelectronic and Optoelectronic devices.


  • FAST Turn IC Packaging; Ceramic & Open Cavity Plastic;
  • Hi-Rel Hermetic Packaging; Space, Oil & Gas, Military Aerospace Applications
  • Flip Chip; Au Stud Bumping; Solder Bump Reflow
  • Wire bonding; Ribbon Bonding;
  • RF & High Speed Assembly Capability
  • Stacked Die; System in Package; MCM
  • Chip on Board
  • Package Design – 3D CAD; Thermal; Stress & Optical Modelling
  • PIC – Photonic Integrated Circuit Packaging; Optical Fibre Alignment


Optocap’s turn-key packaging services enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments.


Our expertise in packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This provides customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain.