Quik-Pak, a division of Promex, provides IC packaging, assembly, and wafer preparation services in its ISO 9001:2008 and ITAR registered facility in San Diego, California.  Quik-Pak manufactures over molded QFN/DFN packages and pre-molded air cavity QFN packages that provide a fast, convenient solution for prototype to full production needs.  Same-day assembly services are provided to shorten time to market.  Quik-Pak now provides high volume IC assembly services utilizing its automated assembly and molding equipment for production runs in the 10,000s of units.  In addition to wire bond assembly, the company assembles flip chips, BGAs, stacked die, sensors, MEMS, and chip-on-board and chip-on-flex assemblies.