Teledyne e2v

Teledyne e2v is an expert in advanced semiconductors manufacturing and the only to be certified both QML-V and QML-Y in Europe. Our customers benefit from our outstanding assembly and test capabilities which meet very demanding market needs such as Avionics, Aerospace and Space. Being a one-stop-shop allows Teledyne e2v to offer a wide range of assembly skills such as flip-chip on die up to 550mm² and over 11 000 bumps, gold or aluminum wire bond, System in package, Multi-Chip Module and SMD with organic or ceramic substrate.