Warpage in packaging

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  • #3990
    thinkx2

    can someone please explain the warpage phenomena?

    why it is happening? what type of packages are likely to suffer from it?

    how to avoid it?

    thanks!

    #3993
    Yovav

    Hi thinkx2,

    Warpage in packages usually happen in substrate based packages (BGA, LGA) due to thermal stress, when the thermal expansion parameter is different between the substrate material, silicon and PCB that the package is mounted on.
    In order to avoid that, you need to take the thermal expansion parameters into account during the substrate and package design.

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